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11. 发明授权

US5154864A Process of producing biodegradable sheet formed of cellulose and chitosan 失效
标题翻译：生产可生物降解纤维素和壳聚糖片的方法
公开(公告)号：US5154864A
公开(公告)日：1992-10-13
申请号：US744399
申请日：1991-08-13
申请人： Masashi Nishiyama , Jun Hosokawa , Kazutoshi Yoshihara , Takamasa Kubo , Satoshi Maruyama , Akihiko Ueda , Kunio Kanaoka , Kenji Tateishi , Kazuo Kondo
发明人： Masashi Nishiyama , Jun Hosokawa , Kazutoshi Yoshihara , Takamasa Kubo , Satoshi Maruyama , Akihiko Ueda , Kunio Kanaoka , Kenji Tateishi , Kazuo Kondo
IPC分类号： B29C47/10 , B29C47/14 , B29K96/00 , B29K105/06 , B29L7/00 , C08J5/18 , C08L1/02 , D21H17/24
CPC分类号： C08J5/18 , C08L1/02 , D21H17/24 , C08J2301/02
摘要： A biodegradable sheet is produced from an aqueous dispersion containing finely cut cellulose fibers and chitosan. The dispersion is maintained at a temperature T.sub.1 .degree.C. which is within the following range:t.ltoreq.T.sub.1 .ltoreq.t+30wherein t is the boiling point (.degree.C.) of water at a given reduced pressure and is continuously introduced into a defoaming zone maintained at the given reduced pressure and at a temperature within the same range as that of T.sub.1. In the defoaming zone, the dispersion is formed into a downwardly flowing laminar flow so that air entrapped therein is effectively removed therefrom. The defoamed dispersion is then passed through a die and is molded into a sheet which is subsequently dried.
摘要翻译：可生物降解的片材由含有精细切割的纤维素纤维和壳聚糖的水性分散体制成。分散体保持在温度T1℃，该温度在以下范围内：t = T1

12. 发明授权

US5145552A Process for preparing electrical connecting member 失效
标题翻译：电连接件制备工艺
公开(公告)号：US5145552A
公开(公告)日：1992-09-08
申请号：US630881
申请日：1990-12-20
申请人： Tetsuo Yoshizawa , Toyohide Miyazaki , Hiroshi Kondo , Takashi Sakaki , Yoshimi Terayama , Yoichi Tamura , Takahiro Okabayashi , Kazuo Kondo , Yasuo Nakatsuka , Yuichi Ikegami
发明人： Tetsuo Yoshizawa , Toyohide Miyazaki , Hiroshi Kondo , Takashi Sakaki , Yoshimi Terayama , Yoichi Tamura , Takahiro Okabayashi , Kazuo Kondo , Yasuo Nakatsuka , Yuichi Ikegami
IPC分类号： H01L21/48 , H01L23/498
CPC分类号： H01L23/49827 , H01L21/486 , H01L2924/0002 , H01L2924/3011
摘要： A process for preparing an electrical connecting member having a holding member comprises an electrically insulating material, a plurality of electroconductive members equipped in the holding member under the state mutually insulated from each other, one end of the each electroconductive member being exposed at one surface of the holding member, and the other end of the each electroconductive member being exposed at the other surface of the holding member, the process comprising the steps of:(A) constituting a matrix member by providing a photosensitive resin which becomes the holding member on both surfaces of a base member, respectively;(B) exposing and developing the respective photosensitive resins to form a plurality of holes through the photosensitive resins, thereby having the base member exposed;(C) curing the photosensitive resins;(D) etching away a part of the base member exposed;(E) filling an electroconductive member into the holes formed in the holding members coplanar with or protruded from the holding members; and(F) removing the base member which remains.
摘要翻译：一种用于制备具有保持构件的电连接构件的方法包括电绝缘材料，多个导电构件，其在彼此相互绝缘的状态下设置在保持构件中，每个导电构件的一端在所述保持构件和所述每个导电构件的另一端在所述保持构件的另一个表面处露出，所述方法包括以下步骤：（A）通过在两者上设置成为保持构件的感光性树脂来构成矩阵构件分别为基体的表面; （B）曝光和显影各个感光树脂以形成通过感光性树脂的多个孔，从而露出基底部件; （C）固化光敏树脂; （D）蚀刻露出的基底部件的一部分; （E）将导电构件填充到与保持构件共面或突出的保持构件中形成的孔中; 和（F）去除残留的基底构件。

13. 发明授权

US5006167A Metallizing composition 失效
标题翻译：金属组成
公开(公告)号：US5006167A
公开(公告)日：1991-04-09
申请号：US301291
申请日：1989-01-25
申请人： Asao Morikawa , Kazuo Kondo
发明人： Asao Morikawa , Kazuo Kondo
IPC分类号： B23K35/00 , C03C8/14 , C03C8/18 , C04B41/51 , C04B41/88 , C23C24/00 , H01B1/16 , H01L21/48 , H01L23/498 , H05K1/09
CPC分类号： C04B41/009 , B23K35/001 , C03C8/14 , C03C8/18 , C04B41/5116 , C04B41/88 , C23C24/00 , H01B1/16 , H01L21/4867 , H01L23/49883 , C04B2111/00844 , H01L2924/0002 , H05K1/092
摘要： A metallizing composition is described that comprises 100 parts by weight of Au powder, from 2 to 7 parts by weight of CuO powder, from 0.3 to 2 parts by weight of a glass-based inorganic powder free from PbO, and from 3 to 8 parts by weight of a resin.
摘要翻译：描述了一种金属组合物，其包含100重量份的Au粉末，2至7重量份的CuO粉末，0.3至2重量份的不含PbO的玻璃基无机粉末和3至8个的树脂。

14. 发明授权

US4801067A Method of connecting metal conductor to ceramic substrate 失效
标题翻译：将金属导体连接到陶瓷基板的方法
公开(公告)号：US4801067A
公开(公告)日：1989-01-31
申请号：US89762
申请日：1987-08-27
申请人： Kazuo Kondo , Tsuneyuki Sukegawa , Asao Morikawa
发明人： Kazuo Kondo , Tsuneyuki Sukegawa , Asao Morikawa
IPC分类号： B23K35/00 , C04B37/02 , F01M1/08 , H01L21/00 , H01L21/48 , B23K1/04 , H01R9/06 , H05K3/00
CPC分类号： H01L21/67138 , B23K35/001 , C04B37/026 , H01L21/4853 , C04B2237/123 , C04B2237/124 , C04B2237/125 , C04B2237/126 , C04B2237/343 , C04B2237/403 , C04B2237/406 , C04B2237/407 , C04B2237/708 , C04B2237/72 , C04B2237/76 , F01M2001/086 , Y10T29/49149
摘要： A method of connecting a metal conductor to a ceramic substrate including the steps of providing a terminal portion on the ceramic substrate, the ceramic substrate having a dielectric constant less than or equal to 7.0 units and a coefficient of thermal expansion of 5.times.10.sup.-6 /.degree. C. or less, forming at least one of a buffer layer and a barrier layer overlying the terminal portion of the ceramic substrate, wherein the buffer layer consists essentially of Cu and the barrier layer consists essentially of a material selected from the group consisting of Ni, Pd, and Pt, and brazing a metal conductor to the terminal portion of the ceramic substrate through the at least one of the buffer layer and the barrier layer with an Ag-based brazing filler material.
摘要翻译：一种将金属导体连接到陶瓷基板的方法，包括以下步骤：在陶瓷基板上设置端子部分，陶瓷基板的介电常数小于或等于7.0单位，热膨胀系数为5×10 -6 /℃ 形成覆盖陶瓷衬底的端部的缓冲层和阻挡层中的至少一个，其中缓冲层基本上由Cu组成，阻挡层基本上由选自Ni ，Pd和Pt，并且通过所述缓冲层和所述阻挡层中的所述至少一个，使用Ag系钎焊料将金属导体钎焊到所述陶瓷基板的所述端子部。

15. 发明授权

US4451746A Non-linear emphasis circuit 失效
标题翻译：非线性强调电路
公开(公告)号：US4451746A
公开(公告)日：1984-05-29
申请号：US279811
申请日：1981-07-02
申请人： Koichi Hirose , Kazuo Kondo
发明人： Koichi Hirose , Kazuo Kondo
IPC分类号： G11B20/04 , H03G7/00 , H03G9/18 , H04B1/62 , H04B1/64 , H04N5/923 , H03B1/04 , G06G7/12
CPC分类号： H04N5/923 , H03G9/18 , H04B1/62
摘要： A non-linear emphasis circuit comprising a high-pass filter receiving an input signal, a compressor processing the output of the filter with such a variable gain as to decrease or increase responsive to an increase or a decrease of the output of the filter and an adder for adding the input signal and the output of the compressor at a predetermined rate for producing a non-linearly emphasized signal. The circuit has a structure adapted for production in an IC form and easy to design.
摘要翻译：一种非线性强调电路，包括接收输入信号的高通滤波器，压缩器以具有可变增益的方式处理滤波器的输出，以响应于滤波器的输出的增加或减少而减小或增加，加法器，用于以预定的速率将输入信号和压缩器的输出相加以产生非线性强调信号。该电路具有适于以IC形式生产并易于设计的结构。

16. 发明申请

US20100255269A1 COPPER FILLING-UP METHOD 有权
标题翻译：铜填充方法
公开(公告)号：US20100255269A1
公开(公告)日：2010-10-07
申请号：US12753530
申请日：2010-04-02
申请人： Naoki Okamoto , Kazuo Kondo , Hideyuki Kuri , Masaru Bunya , Minoru Takeuchi
发明人： Naoki Okamoto , Kazuo Kondo , Hideyuki Kuri , Masaru Bunya , Minoru Takeuchi
IPC分类号： B05D5/12 , B05C3/02 , C08K5/17 , B32B3/10
CPC分类号： C25D3/38 , C25D5/02 , H05K3/423 , Y10T428/24802
摘要： [Problem to be Solved] To provide a method of well filling copper in a non-through hole on a conductivity-rendered substrate by using a copper plating bath containing fewer additives.[Means for Solving the Problem] A method of filling copper in a non-through hole on a substrate that has been treated to render it conductive, which comprises plating said substrate in an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid and a filling additive that is a polymer having the activities of both of a brightener and a leveler.
摘要翻译： [待解决的问题]提供一种通过使用含有较少添加剂的铜电镀液在导电性基材上的非贯通孔中充填铜的方法。解决问题的方法在已经处理以使其导电的基板上的非贯通孔中填充铜的方法，其包括在包含水溶性铜盐的酸性铜电镀浴中镀覆所述基板，将硫酸酸和填充添加剂，其是具有增白剂和矫直剂活性的聚合物。

17. 发明授权

US07378107B2 Serum remnant-like lipoprotein concentration regulator 有权
标题翻译：血清残留样脂蛋白浓度调节剂
公开(公告)号：US07378107B2
公开(公告)日：2008-05-27
申请号：US11222741
申请日：2005-09-12
申请人： Hideaki Maki , Michio Kasai , Yoshie Suzuki , Naohisa Nosaka , Mitsuko Okazaki , Osamu Igarashi , Kazuo Kondo
发明人： Hideaki Maki , Michio Kasai , Yoshie Suzuki , Naohisa Nosaka , Mitsuko Okazaki , Osamu Igarashi , Kazuo Kondo
IPC分类号： A61K47/00 , A61K31/56 , A61K31/355 , A61K31/225 , A01N45/00 , A01N37/02
CPC分类号： A61K31/22 , A23L33/12 , A23V2002/00 , A23V2250/1944
摘要： The present invention discloses serum remnant-like lipoprotein concentration regulators containing triglyceride of medium-chain fatty acids, wherein 90% or more by weight of the fatty acids as components of the medium-chain triglyceride are saturated fatty acids having 8 and 10 carbon atoms; weight ratio between the saturated fatty acids having 8 carbon atoms and those having 10 carbon atoms is 60/40 to 85/15; and the proportion of the saturated fatty acids having 8 carbon atoms in all the fatty acids bonding to the second position of the triglyceride is 60 to 85 % by weight. The present invention also discloses foods for controlling the concentration of serum remnant-like lipoproteins and pharmaceutical compositions for controlling the concentration of serum remnant-like lipoproteins, which contain the serum remnant-like lipoprotein concentration regulator. The foods for controlling the concentration of serum remnant-like lipoproteins can be easily used without concerning about side effects and restrictive diet.
摘要翻译：本发明公开了含有中链脂肪酸甘油三酯的血清残余样脂蛋白浓度调节剂，其中作为中链甘油三酯成分的脂肪酸的90重量％以上为碳原子数为8〜10的饱和脂肪酸，具有8个碳原子的饱和脂肪酸与具有10个碳原子的饱和脂肪酸之间的重量比为60/40至85/15; 在与甘油三酯的第二位置结合的所有脂肪酸中具有8个碳原子的饱和脂肪酸的比例为60〜85重量％。本发明还公开了用于控制血清残余样脂蛋白浓度的食品和用于控制含有血清残余样脂蛋白浓度调节剂的血清残余样脂蛋白浓度的药物组合物。用于控制血清残余样脂蛋白浓度的食物可以容易地使用，而不涉及副作用和限制性饮食。

18. 发明授权

US5614315A Heat-shrinkable multi-layer polyolefin films 失效
标题翻译：热收缩多层聚烯烃薄膜
公开(公告)号：US5614315A
公开(公告)日：1997-03-25
申请号：US375829
申请日：1995-01-20
申请人： Kazuo Kondo , Teruo Tada , Toyoki Wano , Hideki Uehara , Tomohisa Tsuchida
发明人： Kazuo Kondo , Teruo Tada , Toyoki Wano , Hideki Uehara , Tomohisa Tsuchida
IPC分类号： B32B7/02 , B32B27/16 , B32B27/32 , C08L23/08 , C08L23/10 , B32B27/08 , B65B53/02
CPC分类号： C08L23/0815 , B32B27/322 , C08L23/10 , C08L2205/02 , C08L2205/03 , Y10T428/1328 , Y10T428/1393 , Y10T428/26 , Y10T428/31909 , Y10T428/31913 , Y10T428/31928
摘要： A heat shrinkable multilayer film which includes two outer layers consisting essentially of a polyethylene resin, and one or more inner layers interposed between the outer layers, wherein at least one of the inner layers comprises a blend of a polypropylene resin and a substantially linear ethylene/alpha-olefin copolymer, wherein said copolymer has a molecular weight distribution Mw/Mn of not greater than about 2 and a melt flow ratio I.sub.10 /I.sub.2 of not smaller than 7.0.
摘要翻译：一种热收缩多层膜，其包括基本上由聚乙烯树脂组成的两个外层和插入在所述外层之间的一个或多个内层，其中所述内层中的至少一个包括聚丙烯树脂和基本上线性的乙烯/ α-烯烃共聚物，其中所述共聚物的分子量分布Mw / Mn不大于约2，熔体流动比I10 / I2不小于7.0。

19. 发明授权

US5306550A Biodegradable composition and shaped article obtained therefrom 失效
标题翻译：可生物降解组合物和由其获得的成型制品
公开(公告)号：US5306550A
公开(公告)日：1994-04-26
申请号：US721766
申请日：1991-06-28
申请人： Masashi Nishiyama , Jun Hosokawa , Kazutoshi Yoshihara , Takamasa Kubo , Kunio Kanaoka , Kazuo Kondo , Satoshi Maruyama , Kenji Tateishi , Akihiko Ueda
发明人： Masashi Nishiyama , Jun Hosokawa , Kazutoshi Yoshihara , Takamasa Kubo , Kunio Kanaoka , Kazuo Kondo , Satoshi Maruyama , Kenji Tateishi , Akihiko Ueda
IPC分类号： C08L67/00 , C08L71/02 , C08L75/04 , C08L77/00 , C08L101/00 , B32B5/16 , B32B9/02 , C08K5/00
CPC分类号： C08L75/04 , C08L101/00 , C08L67/00 , C08L71/02 , C08L77/00 , C08L2201/06 , Y10S428/913 , Y10T428/253 , Y10T428/31971 , Y10T442/614
摘要： A biodegradable film or the like shaped article is formed from a composition including 100 parts by weight of cellulose fibers having a length of 3 mm or less and a diameter of 50 .mu.m or less, 10-600 parts by weight of a thermoplastic resin and 2-100 parts by weight of chitosan. A mixture containing (a) an aqueous solution of an acid salt of chitosan, (b) an aqueous dispersion or solution of a thermoplastic resin and (c) fine cellulose fibers is dried and shaped to obtain such a biodegradable shaped article.
摘要翻译：生物降解性膜或类似物成型制品由包含100重量份长度为3mm或更小，直径为50（my）m以下的纤维素纤维的组合物形成，10-600重量份的热塑性塑料树脂和2-100重量份的壳聚糖。将（a）壳聚糖的酸性盐的水溶液，（b）水分散体或热塑性树脂的溶液和（c）细纤维素纤维的混合物干燥并成型，得到这样的生物降解成型制品。

20. 发明授权

US5175130A Low-temperature baked substrate 失效
标题翻译：低温烘烤基材
公开(公告)号：US5175130A
公开(公告)日：1992-12-29
申请号：US303374
申请日：1989-01-30
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： C03C10/00 , C03C11/00 , C03C14/00 , C03C17/02 , H01L23/15 , H01L23/498 , H01L23/538 , H01L23/66 , H05K1/03
CPC分类号： H01L23/49894 , C03C10/0009 , C03C11/00 , C03C14/004 , C03C17/02 , H01L23/15 , H01L23/49822 , H01L23/5383 , H01L23/66 , H05K1/0306 , C03C2214/04 , H01L2924/0002 , H01L2924/09701 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/24967 , Y10T428/24975 , Y10T428/249956 , Y10T428/249981 , Y10T428/249988 , Y10T428/24999
摘要： A substrate having a low dielectric constant for use with electronic devices consisting essentially of porous crystalline glass. The composition of the crystalline glass is represented by the formula X-Al.sub.2 O.sub.3 -SiO.sub.2, where X is one or more of the metal oxides ZnO, MgO, Li.sub.2 O, ZrO.sub.2, B.sub.2 O.sub.3, P.sub.2 O.sub.5, Y.sub.2 O.sub.3 and BaO. The crystalline glass may also include a filler material such as a ceramic powder or non-glass material. The substrate initially has a particle size of approximately 5 microns or less, which provides a high mechanical strength to the substrate even at high porosities.
摘要翻译：具有低介电常数的衬底，用于与基本上由多孔结晶玻璃组成的电子器件。结晶玻璃的组成由式X-Al 2 O 3 -SiO 2表示，其中X是一种或多种金属氧化物ZnO，MgO，Li 2 O，ZrO 2，B 2 O 3，P 2 O 5，Y 2 O 3和BaO。结晶玻璃还可以包括诸如陶瓷粉末或非玻璃材料的填充材料。基底最初具有大约5微米或更小的粒度，即使在高孔隙率下也能提供高的机械强度。

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