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1. 发明授权

US5405562A Process of making a coated substrate having closed porosity 失效
标题翻译：制造具有闭孔率的涂布基材的方法
公开(公告)号：US5405562A
公开(公告)日：1995-04-11
申请号：US183791
申请日：1994-01-21
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： C03C10/00 , C03C11/00 , C03C14/00 , C03C17/02 , H01L23/15 , H01L23/498 , H01L23/538 , H01L23/66 , H05K1/03 , B29C65/00
CPC分类号： H01L23/49894 , C03C10/0009 , C03C11/00 , C03C14/004 , C03C17/02 , H01L23/15 , H01L23/49822 , H01L23/5383 , H01L23/66 , H05K1/0306 , C03C2214/04 , H01L2924/0002 , H01L2924/09701 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/24967 , Y10T428/24975 , Y10T428/249956 , Y10T428/249981 , Y10T428/249988 , Y10T428/24999
摘要： A method of forming a substrate for electronic devices by forming a mixture of a liquid vehicle, crystalline glass powder and carbon powder into a slurry. The slurry is then formed into a desired shape and heated in an oxidizing atmosphere at a temperature less than 900.degree. C. for a time sufficient to oxidize the carbon powder and partially sinter the crystalline glass to form the porous substrate having closed porosity.
摘要翻译：通过将液态载体，结晶玻璃粉末和碳粉末的混合物形成浆料形成电子器件用基板的方法。然后将浆料形成所需形状，并在氧化气氛中在低于900℃的温度下加热足以氧化碳粉末并部分烧结结晶玻璃以形成具有闭孔率的多孔基材的时间。

2. 发明授权

US5352482A Process for making a high heat-conductive, thick film multi-layered circuit board 失效
标题翻译：制造高导热，厚膜多层电路板的工艺
公开(公告)号：US5352482A
公开(公告)日：1994-10-04
申请号：US131560
申请日：1993-10-04
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： H01L23/14 , H01L23/15 , H01L23/373 , H05K1/03 , H05K3/46 , B05D5/12
CPC分类号： H01L23/142 , H01L23/15 , H01L23/3731 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4667
摘要： A high heat-conductive, thick film multilayered circuit board for high speed signal transmission in a high frequency region has a substrate having high heat conductivity. An oxidized layer is formed on a surface of the substrate. Electrically conductive layers formed of a printed paste containing crystallized glass, and insulating layers formed of a printed insulating paste containing crystallized glass as a principal constituent are alternately disposed by printing on the oxidized layer of the substrate. The conductive and insulating layers are heated to form solid layers between successive printing steps. The substrate is AlN, Sic/BeO, SiC, Cu/W and/or ZrB.sub.2 having a heat conductivity of 40-140 W/m.multidot.k at room temperature. The layers have high adhesion strength to the substrate and the insulting layer has a low dielectric constant.
摘要翻译：在高频区域中用于高速信号传输的高导热厚膜多层电路板具有导热性高的衬底。在基板的表面上形成氧化层。由包含结晶化玻璃的印刷糊料形成的导电层和由包含结晶玻璃作为主要成分的印刷绝缘膏形成的绝缘层通过印刷在衬底的氧化层上交替布置。导电和绝缘层被加热以在连续的印刷步骤之间形成固体层。基板是在室温下具有40-140W / m×k的导热率的AlN，Sic / BeO，SiC，Cu / W和/或ZrB2。这些层对基底具有高粘合强度，并且绝缘层具有低介电常数。

3. 发明授权

US5120473A Metallizing composition for use with ceramics 失效
标题翻译：用于陶瓷的金属组成
公开(公告)号：US5120473A
公开(公告)日：1992-06-09
申请号：US256536
申请日：1988-10-12
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： C04B41/88 , H01B1/02 , H05K1/09
CPC分类号： H05K1/092 , H01B1/026
摘要： A metallizing composition for use with ceramics which comprises 100 parts by weight of a CuO-Cu combination consisting of 30 to 70 wt % CuO and 70 to 30 wt % Cu, at least one inorganic component selected from the group consisting of not more than 10 parts by weight of MnO.sub.2, not more than 7 parts by weight of Pt and not more than 5 parts by weight of Au, an organic binder, and a solvent.
摘要翻译：一种用于陶瓷的金属组合物，其包含100重量份由30重量％至70重量％的CuO和70至30重量％的Cu组成的CuO-Cu组合，至少一种选自不超过10个的无机组分重量的MnO 2，不大于7重量份的Pt和不超过5重量份的Au，有机粘合剂和溶剂。

4. 发明授权

US4871608A High-density wiring multilayered substrate 失效
标题翻译：高密度布线多层基板
公开(公告)号：US4871608A
公开(公告)日：1989-10-03
申请号：US133817
申请日：1987-12-10
申请人： Kazuo Kondo , Asao Morikawa , Hiroshi Iwata , Yoshimasa Shibata
发明人： Kazuo Kondo , Asao Morikawa , Hiroshi Iwata , Yoshimasa Shibata
IPC分类号： C03C17/00 , C03C17/06 , C03C17/23 , H05K1/03 , H05K1/09
CPC分类号： H05K1/092 , C03C17/008 , C03C17/06 , C03C17/23 , C03C2217/23 , C03C2217/29 , C03C2218/119 , H05K1/0306 , H05K3/4629 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： A high-density wiring multi-layered substrate comprising a plurality of sequentially laminated green sheets containing crystallizable glass, each of the green sheets having a conductor paste on the surface thereof, the conductive component of the conductor paste comprising at least about 80 wt % of one copper component selected from copper and copper oxide and at least one member selected from up to about 15 parts by weight of MnO.sub.2 and up to about 10 parts by weight of Ag.sub.2 O based on 100 parts by weight of said copper component in terms of metallic copper.
摘要翻译：一种高密度布线多层基板，包括多个顺序层压的含有可结晶玻璃的生片，每个生片在其表面上具有导体糊，所述导体糊的导电组分包含至少约80重量％一种选自铜和氧化铜的铜组分和至少一种选自至多约15重量份的MnO 2和至多约10重量份的Ag 2 O的组分，基于100重量份的所述铜组分（以金属铜计）。

5. 发明授权

US5318744A Process for producing ceramic sintered body having metallized via hole 失效
标题翻译：具有金属化通孔的陶瓷烧结体的制造方法
公开(公告)号：US5318744A
公开(公告)日：1994-06-07
申请号：US926654
申请日：1992-08-10
申请人： Asao Morikawa , Kazuo Kondo
发明人： Asao Morikawa , Kazuo Kondo
IPC分类号： C04B38/00 , C04B41/51 , C04B41/52 , C04B41/85 , C04B41/88 , C04B41/89 , H01L21/48 , H05K1/03 , H05K3/10 , H05K3/40 , H05K3/46 , B22F1/00 , B22F7/00
CPC分类号： C04B41/009 , C04B41/5194 , C04B41/52 , C04B41/88 , C04B41/89 , H01L21/486 , H05K3/4061 , C04B2111/00844 , H05K1/0306 , H05K2201/09981 , H05K2203/0759 , H05K3/102 , H05K3/4611 , H05K3/4629
摘要： A process for producing a ceramic sintered body having a metallized via hole previously formed after lamination of the ceramics is disclosed and said process comprises immersing in a first liquid a ceramic semi-sintered body formed through heating at 500 to 900.degree. C. and having a large number of pores and a straight via hole, thereby to allow the first liquid to penetrate into the pores of the semi-sintered body, subsequently immersing the resulting semi-sintered body in a suspension of electrically conductive powder particles having an average particle size of 2 to 3 .mu.m in a second liquid incompatible with the first liquid, thereby to fill the via hole with the suspension, and then sintering the resulting semi-sintered body in a non-oxidizing atmosphere.
摘要翻译：公开了一种陶瓷烧结体的制造方法，该陶瓷烧结体具有在陶瓷层压之后预先形成的金属化通孔，所述方法包括将第一液体浸渍在通过在500-900℃下加热形成的陶瓷半烧结体，大量的孔和直通孔，从而允许第一液体渗透到半烧结体的孔中，随后将所得的半烧结体浸渍在平均粒径为在与第一液体不相容的第二液体中2至3μm，从而用悬浮液填充通孔，然后在非氧化气氛中烧结所得的半烧结体。

6. 发明授权

US5011530A Metallizing composition for use with ceramics 失效
标题翻译：用于陶瓷的金属组成
公开(公告)号：US5011530A
公开(公告)日：1991-04-30
申请号：US289339
申请日：1988-12-23
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： C04B41/51 , C04B41/88 , H01B1/02 , H01L23/498 , H05K1/09
CPC分类号： C04B41/009 , C04B41/5127 , C04B41/88 , H01B1/026 , H01L23/49866 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： Metallizing composition for use in ceramics, comprises 100 parts by weight of a CuO-Cu combination consisting of 30-70 wt % CuO and 70-30 wt % Cu, at least one inorganic component selected from not more than 10 parts by weight of MnO.sub.2, not more than 7 parts by weight of Pt and not more than 5 parts by weight of Au, an organic binder and a solvent, wherein the Cu particles have a size in the range of 0.5-20 .mu.m and consist of at least two classes of particles having different average sizes.
摘要翻译：用于陶瓷的金属组合物包含100重量份由30-70重量％CuO和70-30重量％Cu组成的CuO-Cu组合物，至少一种选自不超过10重量份的MnO 2的无机组分，不超过7重量份的Pt和不超过5重量份的Au，有机粘合剂和溶剂，其中Cu颗粒的尺寸在0.5-20μm的范围内，并且由至少两个具有不同平均尺寸的颗粒类。

7. 发明授权

US5003131A Connection structure between ceramic body and outer terminal 失效
标题翻译：陶瓷体和外部端子之间的连接结构
公开(公告)号：US5003131A
公开(公告)日：1991-03-26
申请号：US404998
申请日：1989-09-08
申请人： Asao Morikawa , Kazuo Kondo
发明人： Asao Morikawa , Kazuo Kondo
IPC分类号： H01L23/50 , C04B37/02 , H01L21/48
CPC分类号： H01L21/4853 , H01L2924/0002
摘要： A device for connecting a metal conductor on a surface of a first ceramic body to an outer terminal in which dispersion of copper metal into adjoining layers is prevented. An outer surface conductor made of Cu or Au is connected to the metal conductor on the surface of the ceramic body and extends through a throughhole in a second ceramic body. A lower conductive layer of Pd is formed over and in electrical connection with the outer end of the outer surface conductor, the lower layer having an area greater than the area of the outer end of the outer surface conductor. A dispersion-preventing layer is formed on a portion of the lower layer concentric with the outer end of the outer surface conductor, the dispersion-preventing layer having an area greater than the area of the outer end of the outer surface conductor but less than the area of the lower layer. The dispersion-preventing layer is made of a crystallized glass material. An upper conductive layer is formed over the dispersion-preventing layer and a portion of the lower layer, the upper conductive layer having an area greater than the area of the dispersion-preventing layer but less than the area of the lower layer. A soldering layer formed over the upper layer and a portion of the lower layer in electrical contact with the upper layer and the lower layer, the outer terminal being connected to the soldering layer.
摘要翻译：用于将第一陶瓷体的表面上的金属导体连接到外部端子的装置，其中防止了铜金属分散在相邻层中。由Cu或Au制成的外表面导体与陶瓷体的表面上的金属导体连接，并延伸穿过第二陶瓷体中的通孔。 Pd的下导电层形成在外表面导体的外端上且与外表面导体的外端电连接，下层的面积大于外表面导体的外端面积。在下层的与外表面导体的外端同心的部分上形成防分散层，该防分散层的面积大于外表面导体的外端面积，但小于下层的面积。防分散层由结晶玻璃材料制成。在防分散层和下层的一部分上形成上导电层，上导电层的面积大于防分散层的面积，但小于下层的面积。形成在上层上的焊接层和与上层和下层电接触的下层的一部分，外部端子连接到焊接层。

8. 发明授权

US4943470A Ceramic substrate for electrical devices 失效
标题翻译：陶瓷基板用于电气设备
公开(公告)号：US4943470A
公开(公告)日：1990-07-24
申请号：US320796
申请日：1989-03-09
申请人： Hisaharu Shiromizu , Asao Morikawa , Tsuneyuki Sukegawa , Kazuo Kondo
发明人： Hisaharu Shiromizu , Asao Morikawa , Tsuneyuki Sukegawa , Kazuo Kondo
IPC分类号： H01L21/48 , H01L23/15
CPC分类号： H01L21/481 , H01L23/15 , H01L2224/45147 , H01L2224/48247 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/01014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/16152 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： A ceramic substrate for an electrical device such as a layered circuit or an integrated circuit formed of a crystalline glass or ceramic material having a low densifying temperature such that conductor materials and circuits can be readily formed from high conductivity metals.
摘要翻译：一种用于诸如分层电路或由具有低致密化温度的结晶玻璃或陶瓷材料形成的集成电路的电气装置的陶瓷基板，使得可以容易地由高导电性金属形成导体材料和电路。

9. 发明授权

US4837408A High density multilayer wiring board and the manufacturing thereof 失效
标题翻译：高密度多层布线板及其制造
公开(公告)号：US4837408A
公开(公告)日：1989-06-06
申请号：US196408
申请日：1988-05-20
申请人： Kazuo Kondo , Asao Morikawa , Hiroshi Iwata
发明人： Kazuo Kondo , Asao Morikawa , Hiroshi Iwata
IPC分类号： C03C17/00 , H05K1/03 , H05K1/09 , H05K3/46
CPC分类号： H05K3/4611 , C03C17/008 , H05K1/092 , H05K3/4629 , C03C2217/23 , C03C2217/29 , C03C2218/119 , H05K1/0306
摘要： A multilayered wiring board comprising a plurality of green sheets of crystallizable glass which have a conductive pattern printed thereon. The green sheets are laminated together and sintered as a unit. The conductive composition used for the conductive pattern mainly comprises Cu or CuO with lesser amounts of MnO.sub.2. According to two embodiments the conductive composition additionally contains (1) Pd and/or Pt or (2) Ag.sub.2 O and TiO.sub.2 or TiH.sub.2. Thereby volume contraction due CuO reduction cancels out volume expansion due to Cu oxidation in the subsequent degreasing.
摘要翻译：一种多层布线板，包括多个可结晶玻璃生片，其上印有导电图案。将生片层叠在一起并烧结成一个单位。用于导电图案的导电组合物主要包含少量MnO 2的Cu或CuO。根据两个实施方案，导电组合物另外含有（1）Pd和/或Pt或（2）Ag 2 O和TiO 2或TiH 2。因此，由于CuO还原引起的体积收缩抵消随后的脱脂中的Cu氧化引起的体积膨胀。

10. 发明授权

US5011734A Ceramic substrate 失效
标题翻译：陶瓷基板
公开(公告)号：US5011734A
公开(公告)日：1991-04-30
申请号：US290941
申请日：1988-12-28
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： H01L23/12 , H01L21/48 , H01L23/08 , H01L23/498
CPC分类号： H01L23/49866 , H01L21/4846 , H01L2924/0002 , H01L2924/09701 , Y10T428/12535 , Y10T428/265 , Y10T428/31678
摘要： A ceramic substrate is described, which comprises a fired ceramic sheet that has on its surface a metallized layer made of Au or Cu, or Au-Pt, Au-Pd, Cu-Pt or Cu-Pd alloy that is overlaid with a Ni plating layer.
摘要翻译：描述了一种陶瓷基板，其包括在其表面上具有由Au或Cu制成的金属化层或Au-Pt，Au-Pd，Cu-Pt或Cu-Pd合金的烧制陶瓷基板，其覆盖有Ni镀层层。

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