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1. 发明授权

US5011734A Ceramic substrate 失效
标题翻译：陶瓷基板
公开(公告)号：US5011734A
公开(公告)日：1991-04-30
申请号：US290941
申请日：1988-12-28
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： H01L23/12 , H01L21/48 , H01L23/08 , H01L23/498
CPC分类号： H01L23/49866 , H01L21/4846 , H01L2924/0002 , H01L2924/09701 , Y10T428/12535 , Y10T428/265 , Y10T428/31678
摘要： A ceramic substrate is described, which comprises a fired ceramic sheet that has on its surface a metallized layer made of Au or Cu, or Au-Pt, Au-Pd, Cu-Pt or Cu-Pd alloy that is overlaid with a Ni plating layer.
摘要翻译：描述了一种陶瓷基板，其包括在其表面上具有由Au或Cu制成的金属化层或Au-Pt，Au-Pd，Cu-Pt或Cu-Pd合金的烧制陶瓷基板，其覆盖有Ni镀层层。

2. 发明授权

US4810528A Process for producing multilayer circuit board 失效
标题翻译：多层电路板生产工艺
公开(公告)号：US4810528A
公开(公告)日：1989-03-07
申请号：US901335
申请日：1986-08-28
申请人： Kazuo Kondo , Hisaharu Shiromizu , Asao Morikawa , Tsuneyuki Sukegawa
发明人： Kazuo Kondo , Hisaharu Shiromizu , Asao Morikawa , Tsuneyuki Sukegawa
IPC分类号： C03C17/36 , H05K1/03 , H05K1/09 , H05K3/12 , H05K3/46 , B05D5/12
CPC分类号： H05K3/4667 , H05K1/092 , H05K1/0306
摘要： A process for producing a multilayer circuit board composed of crystallized glass and copper-metallized circuit patterns, which comprises:(1) providing a green sheet of a crystallizable glass powder;(2) providing a copper paste comprising copper component (copper and/or copper oxide) and a glass powder in a proportion by weight of the copper component to the glass powder 95:5 to 75:25, copper oxide being calculated on copper;(3) printing a circuit pattern of the copper paste of step (2) on the green sheet of step (1);(4) coating on the green sheet of step (3) an insulating paste to form an insulating layer except for regions assigned for through holes;(5) printing on the insulating layer of step (4) a circuit pattern of the copper paste of step (2) and filling said holes with the copper paste make a conductive connection through said holes;(6) decomposing the binders by heating the product of step (5) under an oxidizing atmosphere at 400.degree.-850.degree. C.; and(7) heating the product of step (6) at 850.degree.-1050.degree. C. under a reducing atmosphere for a period of time sufficient to reduce copper oxide, sinter the product of step (6) and crystallize said glasses.After step (5), pairs of steps (4) and (5) are repeated to make multilayer circuit boards.
摘要翻译：一种由结晶玻璃和铜金属化电路图形成的多层电路板的制造方法，其特征在于，包括：（1）提供可结晶玻璃粉末的生片; （2）将铜成分（铜和/或氧化铜）和铜成分重量比的玻璃粉末提供给玻璃粉末95:5〜75:25，铜计算的铜膏; （3）在步骤（1）的生片上印刷步骤（2）的铜浆的电路图案; （4）在步骤（3）的生片上涂覆绝缘膏，以形成除了通孔的区域之外的绝缘层; （5）在步骤（4）的绝缘层上印刷步骤（2）的铜浆的电路图案并用铜浆填充所述孔，通过所述孔形成导电连接; （6）通过在400-850℃的氧化气氛下加热步骤（5）的产物来分解粘合剂; 和（7）在还原气氛下，在850〜-1050℃下加热步骤（6）的产物一段足以减少氧化铜的时间，烧结步骤（6）的产物并使所述玻璃结晶。在步骤（5）之后，重复步骤（4）和（5），以制造多层电路板。

3. 发明授权

US5405562A Process of making a coated substrate having closed porosity 失效
标题翻译：制造具有闭孔率的涂布基材的方法
公开(公告)号：US5405562A
公开(公告)日：1995-04-11
申请号：US183791
申请日：1994-01-21
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： C03C10/00 , C03C11/00 , C03C14/00 , C03C17/02 , H01L23/15 , H01L23/498 , H01L23/538 , H01L23/66 , H05K1/03 , B29C65/00
CPC分类号： H01L23/49894 , C03C10/0009 , C03C11/00 , C03C14/004 , C03C17/02 , H01L23/15 , H01L23/49822 , H01L23/5383 , H01L23/66 , H05K1/0306 , C03C2214/04 , H01L2924/0002 , H01L2924/09701 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/24967 , Y10T428/24975 , Y10T428/249956 , Y10T428/249981 , Y10T428/249988 , Y10T428/24999
摘要： A method of forming a substrate for electronic devices by forming a mixture of a liquid vehicle, crystalline glass powder and carbon powder into a slurry. The slurry is then formed into a desired shape and heated in an oxidizing atmosphere at a temperature less than 900.degree. C. for a time sufficient to oxidize the carbon powder and partially sinter the crystalline glass to form the porous substrate having closed porosity.
摘要翻译：通过将液态载体，结晶玻璃粉末和碳粉末的混合物形成浆料形成电子器件用基板的方法。然后将浆料形成所需形状，并在氧化气氛中在低于900℃的温度下加热足以氧化碳粉末并部分烧结结晶玻璃以形成具有闭孔率的多孔基材的时间。

4. 发明授权

US5352482A Process for making a high heat-conductive, thick film multi-layered circuit board 失效
标题翻译：制造高导热，厚膜多层电路板的工艺
公开(公告)号：US5352482A
公开(公告)日：1994-10-04
申请号：US131560
申请日：1993-10-04
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： H01L23/14 , H01L23/15 , H01L23/373 , H05K1/03 , H05K3/46 , B05D5/12
CPC分类号： H01L23/142 , H01L23/15 , H01L23/3731 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4667
摘要： A high heat-conductive, thick film multilayered circuit board for high speed signal transmission in a high frequency region has a substrate having high heat conductivity. An oxidized layer is formed on a surface of the substrate. Electrically conductive layers formed of a printed paste containing crystallized glass, and insulating layers formed of a printed insulating paste containing crystallized glass as a principal constituent are alternately disposed by printing on the oxidized layer of the substrate. The conductive and insulating layers are heated to form solid layers between successive printing steps. The substrate is AlN, Sic/BeO, SiC, Cu/W and/or ZrB.sub.2 having a heat conductivity of 40-140 W/m.multidot.k at room temperature. The layers have high adhesion strength to the substrate and the insulting layer has a low dielectric constant.
摘要翻译：在高频区域中用于高速信号传输的高导热厚膜多层电路板具有导热性高的衬底。在基板的表面上形成氧化层。由包含结晶化玻璃的印刷糊料形成的导电层和由包含结晶玻璃作为主要成分的印刷绝缘膏形成的绝缘层通过印刷在衬底的氧化层上交替布置。导电和绝缘层被加热以在连续的印刷步骤之间形成固体层。基板是在室温下具有40-140W / m×k的导热率的AlN，Sic / BeO，SiC，Cu / W和/或ZrB2。这些层对基底具有高粘合强度，并且绝缘层具有低介电常数。

5. 发明授权

US5120473A Metallizing composition for use with ceramics 失效
标题翻译：用于陶瓷的金属组成
公开(公告)号：US5120473A
公开(公告)日：1992-06-09
申请号：US256536
申请日：1988-10-12
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： C04B41/88 , H01B1/02 , H05K1/09
CPC分类号： H05K1/092 , H01B1/026
摘要： A metallizing composition for use with ceramics which comprises 100 parts by weight of a CuO-Cu combination consisting of 30 to 70 wt % CuO and 70 to 30 wt % Cu, at least one inorganic component selected from the group consisting of not more than 10 parts by weight of MnO.sub.2, not more than 7 parts by weight of Pt and not more than 5 parts by weight of Au, an organic binder, and a solvent.
摘要翻译：一种用于陶瓷的金属组合物，其包含100重量份由30重量％至70重量％的CuO和70至30重量％的Cu组成的CuO-Cu组合，至少一种选自不超过10个的无机组分重量的MnO 2，不大于7重量份的Pt和不超过5重量份的Au，有机粘合剂和溶剂。

6. 发明授权

US4871608A High-density wiring multilayered substrate 失效
标题翻译：高密度布线多层基板
公开(公告)号：US4871608A
公开(公告)日：1989-10-03
申请号：US133817
申请日：1987-12-10
申请人： Kazuo Kondo , Asao Morikawa , Hiroshi Iwata , Yoshimasa Shibata
发明人： Kazuo Kondo , Asao Morikawa , Hiroshi Iwata , Yoshimasa Shibata
IPC分类号： C03C17/00 , C03C17/06 , C03C17/23 , H05K1/03 , H05K1/09
CPC分类号： H05K1/092 , C03C17/008 , C03C17/06 , C03C17/23 , C03C2217/23 , C03C2217/29 , C03C2218/119 , H05K1/0306 , H05K3/4629 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： A high-density wiring multi-layered substrate comprising a plurality of sequentially laminated green sheets containing crystallizable glass, each of the green sheets having a conductor paste on the surface thereof, the conductive component of the conductor paste comprising at least about 80 wt % of one copper component selected from copper and copper oxide and at least one member selected from up to about 15 parts by weight of MnO.sub.2 and up to about 10 parts by weight of Ag.sub.2 O based on 100 parts by weight of said copper component in terms of metallic copper.
摘要翻译：一种高密度布线多层基板，包括多个顺序层压的含有可结晶玻璃的生片，每个生片在其表面上具有导体糊，所述导体糊的导电组分包含至少约80重量％一种选自铜和氧化铜的铜组分和至少一种选自至多约15重量份的MnO 2和至多约10重量份的Ag 2 O的组分，基于100重量份的所述铜组分（以金属铜计）。

7. 发明授权

US5175130A Low-temperature baked substrate 失效
标题翻译：低温烘烤基材
公开(公告)号：US5175130A
公开(公告)日：1992-12-29
申请号：US303374
申请日：1989-01-30
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： C03C10/00 , C03C11/00 , C03C14/00 , C03C17/02 , H01L23/15 , H01L23/498 , H01L23/538 , H01L23/66 , H05K1/03
CPC分类号： H01L23/49894 , C03C10/0009 , C03C11/00 , C03C14/004 , C03C17/02 , H01L23/15 , H01L23/49822 , H01L23/5383 , H01L23/66 , H05K1/0306 , C03C2214/04 , H01L2924/0002 , H01L2924/09701 , Y10T428/24917 , Y10T428/24926 , Y10T428/24942 , Y10T428/24967 , Y10T428/24975 , Y10T428/249956 , Y10T428/249981 , Y10T428/249988 , Y10T428/24999
摘要： A substrate having a low dielectric constant for use with electronic devices consisting essentially of porous crystalline glass. The composition of the crystalline glass is represented by the formula X-Al.sub.2 O.sub.3 -SiO.sub.2, where X is one or more of the metal oxides ZnO, MgO, Li.sub.2 O, ZrO.sub.2, B.sub.2 O.sub.3, P.sub.2 O.sub.5, Y.sub.2 O.sub.3 and BaO. The crystalline glass may also include a filler material such as a ceramic powder or non-glass material. The substrate initially has a particle size of approximately 5 microns or less, which provides a high mechanical strength to the substrate even at high porosities.
摘要翻译：具有低介电常数的衬底，用于与基本上由多孔结晶玻璃组成的电子器件。结晶玻璃的组成由式X-Al 2 O 3 -SiO 2表示，其中X是一种或多种金属氧化物ZnO，MgO，Li 2 O，ZrO 2，B 2 O 3，P 2 O 5，Y 2 O 3和BaO。结晶玻璃还可以包括诸如陶瓷粉末或非玻璃材料的填充材料。基底最初具有大约5微米或更小的粒度，即使在高孔隙率下也能提供高的机械强度。

8. 发明授权

US5122930A High heat-conductive, thick film multi-layered circuit board 失效
标题翻译：高导热，厚膜多层电路板
公开(公告)号：US5122930A
公开(公告)日：1992-06-16
申请号：US456087
申请日：1990-01-04
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： H05K3/46 , H01L23/14 , H01L23/15 , H01L23/373 , H05K1/03
CPC分类号： H01L23/142 , H01L23/15 , H01L23/3731 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4667
摘要： High heat-conductive, thick film multilayered circuit board for high speed signal transmission in a high frequency region, the circuit board comprising: a substrate having high heat conductivity; an oxidized layer formed on a surface of said substrate; an electrically conductive layer formed of a printed paste containing therein crystallized glass; and an insulating layer formed of a printed insulating paste comprised of crystallized glass as a principal constitutent, wherein at least one of said conductive layer and at least one of said insulating layer are alternately disposed by printing on the oxidized layer of said substrate, and said conductive and insulating layers have been heated to form solid layers. The substrate is AlN, SiC/BeO, SiC, Cu/W and/or ZrB.sub.2 having a heat conductively of 40-140 W/m.multidot.k at room temperature. The layers have high adhesion strength to the substrate and the insulating layer has a low dielectric constant.
摘要翻译：高导热，厚膜多层电路板，用于高频区域的高速信号传输，该电路板包括：具有高导热性的基板; 形成在所述基板的表面上的氧化层; 由含有结晶玻璃的印刷糊形成的导电层; 以及由以结晶化玻璃为主要成分的印刷绝缘膏形成的绝缘层，其中所述导电层和至少一个所述绝缘层中的至少一个通过印刷在所述基板的氧化层上交替设置，并且所述绝缘层导电和绝缘层已被加热以形成固体层。基板是在室温下导热为40-140W / m×k的AlN，SiC / BeO，SiC，Cu / W和/或ZrB 2。这些层对基板具有高粘合强度，并且绝缘层具有低介电常数。

9. 发明授权

US4963187A Metallizing paste for circuit board having low thermal expansion coefficient 失效
标题翻译：具有低热膨胀系数的电路板用金属膏
公开(公告)号：US4963187A
公开(公告)日：1990-10-16
申请号：US164361
申请日：1988-03-04
申请人： Kazuo Kondo , Asao Morikawa
发明人： Kazuo Kondo , Asao Morikawa
IPC分类号： C22C32/00 , H01L23/498 , H05K1/09
CPC分类号： H01L23/49883 , C22C32/0089 , H01L2924/0002 , H01L2924/09701 , H05K1/092
摘要： Metallizing paste is composed, by weight, of 100 parts of Pt, 0.5 to 5 parts of Ag, 0.1 to 1 part of CuO, and 2 to 10 parts of a low thermal expansion fritt, which may also contain up to 100 parts of Au. Another metallizing paste is composed, by weight, of 100 parts of Pd, 0.5 to 4 parts of Ag, 0.1 to 1 part of CuO, and 1 to 10 parts of a low thermal expansion fritt, which may also contain up to 50 parts of Au. A low thermal expansion circuit board with multi-layers is made up to a low thermal expansion substrate such as crystallized glass, A1N, SiC, Si.sub.3 N.sub.4 etc. and metallized layers formed on the surface of the substrate based on the abovementioned metallizing pastes comprising crystallized glass type materials.
摘要翻译：金属化膏料按重量计由100份Pt，0.5份至5份Ag，0.1份至1份CuO和2份至10份低热膨胀型脆饼组成，其中还可含有至多100份Au 。另一种金属化糊料按重量计由100份Pd，0.5至4份Ag，0.1份至1份CuO和1至10份低热膨胀型脆饼组成，其中还可含有至多50份金。具有多层的低热膨胀电路板由诸如结晶玻璃，AlN，SiC，Si 3 N 4等的低热膨胀基板构成，并且基于上述包含结晶玻璃的金属化糊料形成在基板表面上的金属化层型材料。

10. 发明授权

US4941582A Hermetically sealed ceramic package 失效
标题翻译：密封陶瓷包装
公开(公告)号：US4941582A
公开(公告)日：1990-07-17
申请号：US415777
申请日：1989-10-02
申请人： Asao Morikawa , Kazuo Kondo
发明人： Asao Morikawa , Kazuo Kondo
IPC分类号： H01L23/10 , B65D6/32 , B65D81/34 , H01L23/08
CPC分类号： B65D81/3453 , H01L2924/15151 , Y10T428/1317
摘要： The invention relates to a hermetically sealed ceramic package for an electric or electronic device, the package using a low temperature fired ceramic or glass-ceramic as the material of the package base supporting the device. The hermetically sealing joint between the package base and a ceramic cap is provided by metallizing the opposite surfaces of the base and the cap with Cu, plating the Cu metallized layer of each member with a metal not alloyable with Cu or Ag, such as Ni or Pd for example, plating that metal layer with Au and brazing the Au layer of the cap to the Au layer of the base with Au-Sn eutectic alloy. Since the Au layers are respectively shielded from the Cu metallized layers by the non-alloyable metal layers, the brazing operation to form the sealing layer of Au-Sn is accomplished without suffering from deterioration of the Au-Sn seal by intrusion of melted Cu into the Au-Sn seal.
摘要翻译：本发明涉及一种用于电气或电子设备的密封陶瓷封装，该封装使用低温烧制陶瓷或玻璃陶瓷作为支撑该器件的封装基座的材料。通过用Cu对基底和盖的相对表面进行金属化，使每个构件的Cu金属化层与不能与Cu或Ag合金化的金属（例如Ni或Ni）镀覆，从而提供封装基座和陶瓷盖之间的气密密封接头 Pd，例如，用Au镀金属层，并用Au-Sn共晶合金将盖的Au层钎焊到基体的Au层。由于Au层通过不合金金属层分别与Cu金属化层屏蔽，所以形成Au-Sn密封层的钎焊操作完成，而不会由于熔融的Cu侵入而导致Au-Sn密封的劣化 Au-Sn密封。

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