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11. 发明授权

US07993485B2 Methods and apparatus for processing a substrate 有权
标题翻译：用于处理衬底的方法和设备
公开(公告)号：US07993485B2
公开(公告)日：2011-08-09
申请号：US11299295
申请日：2005-12-09
申请人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
发明人： Erik C. Wasinger , Gary C. Ettinger , Sen-Hou Ko , Wei-Yung Hsu , Liang-Yuh Chen , Ho Seon Shin , Donald Olgado
IPC分类号： C03C15/00 , H01I21/306
CPC分类号： C03C19/00 , B24B1/04 , B24B9/065 , B24B21/004 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
摘要翻译：适于抛光衬底边缘的装置和方法包括抛光膜，适于张紧和加载抛光膜的框架，使得膜的至少一部分被支撑在平面中，以及基板旋转驱动器，其适于旋转衬底抵靠抛光膜的平面，使得抛光膜适于对衬底施加力，轮廓到衬底的边缘，边缘至少包括外边缘和第一斜面，并且抛光外边缘和第一斜面作为基底旋转。提供了许多其他方面。

12. 发明申请

US20070131653A1 Methods and apparatus for processing a substrate 审中-公开
公开(公告)号：US20070131653A1
公开(公告)日：2007-06-14
申请号：US11298555
申请日：2005-12-09
申请人： Gary Ettinger , Erik Wasinger , Sen-Hou Ko , Wui-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
发明人： Gary Ettinger , Erik Wasinger , Sen-Hou Ko , Wui-Yung Hsu , Liang-Yuh Chen , Ho Shin , Donald Olgado
IPC分类号： C03C15/00 , H01L21/306
CPC分类号： B24B9/065 , B24B21/002 , B24B41/002 , H01L21/02021
摘要： Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.

13. 发明申请

US20070111638A1 PAD ASSEMBLY FOR ELECTROCHEMICAL MECHANICAL POLISHING 有权
标题翻译：电化学机械抛光用PAD组件
公开(公告)号：US20070111638A1
公开(公告)日：2007-05-17
申请号：US11562320
申请日：2006-11-21
申请人： SHOU-SUNG CHANG , Stan Tsai , Donald Olgado , Liang-Yuh Chen , Alain Duboust , Ralph Wadensweiler
发明人： SHOU-SUNG CHANG , Stan Tsai , Donald Olgado , Liang-Yuh Chen , Alain Duboust , Ralph Wadensweiler
IPC分类号： B24B51/00
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.
摘要翻译：提供了用于处理基板的垫组件的实施例。焊盘组件包括处理层，其具有适于处理衬底的工作表面，耦合到处理层的下层并设置在处理层下面的工作表面;以及电极，具有设置在处理层的工作表面下方的下表面上方的上表面。电极的上表面通过多个孔至少部分地暴露于工作表面，以在电极的上表面和焊盘组件的工作表面之间提供电解质通路。

14. 发明申请

US20060019581A1 Polishing solution retainer 有权
标题翻译：抛光液固定器
公开(公告)号：US20060019581A1
公开(公告)日：2006-01-26
申请号：US10942600
申请日：2004-09-16
申请人： Hanzhong Zhang , Feng Liu , Stan Tsai , Rashid Mavliev , Donald Olgado , Liang-Yuh Chen
发明人： Hanzhong Zhang , Feng Liu , Stan Tsai , Rashid Mavliev , Donald Olgado , Liang-Yuh Chen
IPC分类号： B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing solution to the polishing pad substantially within the polishing area during the polishing operation. A polishing solution retaining mechanism is attached to one of the base or the carrier head assembly. The retaining mechanism engages a top surface of the polishing pad and retains the polishing solution substantially within the polishing area during the polishing operation. Some implementations may reduce polishing solution consumption and allow for increased angular velocity.
摘要翻译：对基板研磨装置和方法进行说明。基座包括至少一个可移动的压板以接合抛光垫。在抛光操作期间，至少一个承载头组件基本上在抛光区域内将衬底压靠在抛光垫上。抛光溶液分配器在抛光操作期间基本上在抛光区域内将抛光溶液施加到抛光垫。抛光溶液保持机构附接到基座或承载头组件中的一个。保持机构接合抛光垫的顶表面，并且在抛光操作期间将抛光液基本保持在抛光区域内。一些实施方案可以减少抛光溶液消耗并允许增加的角速度。

15. 发明申请

US20050217586A1 Lift pin alignment and operation methods and apparatus 审中-公开
公开(公告)号：US20050217586A1
公开(公告)日：2005-10-06
申请号：US11146687
申请日：2005-06-06
申请人： Dmitry Lubomirsky , Sheshraj Tulshibagwale , Donald Olgado , Avi Tepman
发明人： Dmitry Lubomirsky , Sheshraj Tulshibagwale , Donald Olgado , Avi Tepman
IPC分类号： H01L21/683 , H01L21/687 , C23C16/00
CPC分类号： H01L21/68742 , Y10S414/135
摘要： A lifting mechanism includes a plurality of lift pins which may be driven separately and independently upward to engage an alignment surface of the chamber using ambient atmospheric pressure as the chamber is evacuated by a pump. In the illustrated embodiment, each lift pin includes a piston which is exposed to the internal chamber pressure on one side of the piston, and is exposed to the external ambient pressure on the other side of the piston. As the pump evacuates the chamber, the internal chamber pressure decreases, causing each lift pin piston to drive the associated lift pin upward. Once all the lift pins have securely engaged the alignment surface, the lift pins may be clamped to a linking mechanism to permit a motor to actuate the lift pins during processing operations.

16. 发明申请

US20110274850A1 HYDROTHERMAL SYNTHESIS OF ACTIVE MATERIALS AND IN SITU SPRAYING DEPOSITION FOR LITHIUM ION BATTERY 有权
标题翻译：活性材料的氢热合成和锂离子电池的喷涂沉积
公开(公告)号：US20110274850A1
公开(公告)日：2011-11-10
申请号：US13098924
申请日：2011-05-02
申请人： Lu Yang , Hooman Bolandi , Karl Brown , Victor Pebenito , Donald Olgado
发明人： Lu Yang , Hooman Bolandi , Karl Brown , Victor Pebenito , Donald Olgado
IPC分类号： C23C16/513 , C23C4/10 , C23C16/505 , C23C4/12 , C23C16/511 , C23C16/503
CPC分类号： C23C4/121 , C23C4/123 , C23C26/02 , H01M4/0419 , H01M4/0421 , H01M4/139 , H01M4/625 , Y02E60/122 , Y02P70/54
摘要： A method and apparatus for forming an electrochemical layer of a lithium ion battery is provided. A precursor mixture in a carrying medium is activated in a reactor chamber by application of energy to synthesize active materials. The activated precursor mixture is then spray deposited on a substrate. A binder and conductive materials may be blended, or sprayed separately, with the nano- or micro-crystals as they deposit on the surface to enhance adhesion and conductivity.
摘要翻译：提供了一种用于形成锂离子电池的电化学层的方法和装置。携带介质中的前体混合物通过施加能量在反应器室中活化以合成活性材料。然后将活化的前体混合物喷雾沉积在基底上。当粘合剂和导电材料沉积在表面上时，粘合剂和导电材料可以与纳米或微晶分别共混或喷涂，以增强粘合性和导电性。

17. 发明申请

US20080045012A1 ELECTROPROCESSING PROFILE CONTROL 失效
标题翻译：电子轮廓控制
公开(公告)号：US20080045012A1
公开(公告)日：2008-02-21
申请号：US11877233
申请日：2007-10-23
申请人： Antoine Manens , Vladimir Galburt , Yan Wang , Alain Duboust , Donald Olgado , Liang-Yuh Chen
发明人： Antoine Manens , Vladimir Galburt , Yan Wang , Alain Duboust , Donald Olgado , Liang-Yuh Chen
IPC分类号： H01L21/44
CPC分类号： B23H5/08 , B24B37/042 , C25D17/10 , C25F7/00
摘要： Embodiments of the present invention provide methods of electroprocessing a substrate. One embodiment of the present invention provides a method comprises pressing a substrate against a polishing pad with a force less than about two pounds per square inch, the substrate contacting a first electrode of the polishing pad, applying an electrical bias to the substrate with the first electrode relative to a second electrode of the polishing pad, wherein the second electrode is disposed below the second electrode, and biasing a third electrode disposed in the polishing pad radially outward of the second electrode.
摘要翻译：本发明的实施方案提供了对基底进行电处理的方法。本发明的一个实施方案提供了一种方法，包括以小于约2磅/平方英寸的力将衬底压靠抛光垫，衬底与抛光垫的第一电极接触，将第一电极施加电偏压至衬底电极，其中所述第二电极设置在所述第二电极下方，并且偏置设置在所述抛光垫中的第三电极，所述第三电极位于所述第二电极的径向外侧。

18. 发明申请

US20070096315A1 BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION 审中-公开
标题翻译：用于铜减少和减少焦距的球接触罩
公开(公告)号：US20070096315A1
公开(公告)日：2007-05-03
申请号：US11555588
申请日：2006-11-01
申请人： Antoine Manens , Alain Duboust , Donald Olgado , Yan Wang , Jose Salas-Vernis , Shou-Sung Chang
发明人： Antoine Manens , Alain Duboust , Donald Olgado , Yan Wang , Jose Salas-Vernis , Shou-Sung Chang
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： B24B37/16 , B23H5/08 , H01L21/32125
摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing comprises a conductive material. In another embodiment, the housing comprises a lower housing and a contact cover wherein the contact cover comprises a conductive material.
摘要翻译：本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。在一个实施例中，用于电化学处理衬底的接触组件包括具有设置在通过壳体形成的通道中的球的壳体。该球适于在加工过程中从壳体部分延伸以接触基底。壳体包括导电材料。在另一个实施例中，壳体包括下壳体和接触盖，其中接触盖包括导电材料。

19. 发明申请

US20060166500A1 Electroprocessing profile control 失效
标题翻译：电加工配置文件控制
公开(公告)号：US20060166500A1
公开(公告)日：2006-07-27
申请号：US11043570
申请日：2005-01-26
申请人： Antoine Manens , Vladimir Galburt , Yan Wang , Alain Duboust , Donald Olgado , Liang-Yuh Chen
发明人： Antoine Manens , Vladimir Galburt , Yan Wang , Alain Duboust , Donald Olgado , Liang-Yuh Chen
IPC分类号： H01L21/44
CPC分类号： B23H5/08 , B24B37/042 , C25D17/10 , C25F7/00
摘要： A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially outward of substrate with a polarity opposite the bias applied tot he first electrode.
摘要翻译：提供了一种用于电子处理衬底的方法和装置。在一个实施例中，一种用于对衬底进行电处理的方法包括以下步骤：偏置第一电极以在电极和衬底之间建立第一电处理区，并且以与其施加的偏压相反的极性偏置衬底径向外侧的第二电极第一电极。

20. 发明申请

US20060148381A1 Pad assembly for electrochemical mechanical processing 有权
标题翻译：焊接组件用于电化学机械加工
公开(公告)号：US20060148381A1
公开(公告)日：2006-07-06
申请号：US11369065
申请日：2006-03-06
申请人： Shou-Sung Chang , Stan Tsai , Donald Olgado , Liang-Yuh Chen , Alain Duboust , Ralph Wadensweiler
发明人： Shou-Sung Chang , Stan Tsai , Donald Olgado , Liang-Yuh Chen , Alain Duboust , Ralph Wadensweiler
IPC分类号： B24B51/00
CPC分类号： B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.
摘要翻译：提供了用于处理基板的垫组件的实施例。焊盘组件包括处理层，其具有适于处理衬底的工作表面，耦合到处理层的下层并设置在处理层下方的电极，以及具有设置在处理层的工作表面下方和下方的上表面的电极。电极的上表面至少部分地暴露于工作表面，以在电极的上表面和工作表面之间提供电解质通路。

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