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11. 发明授权

US4303554A Composition and process for producing transparent conductive film 失效
标题翻译：透明导电薄膜的组成和工艺
公开(公告)号：US4303554A
公开(公告)日：1981-12-01
申请号：US161028
申请日：1980-06-19
申请人： Ryoichi Sudo , Masaaki Okunaka , Hitoshi Yokono , Tokio Isogai , Mitsuo Yamazaki
发明人： Ryoichi Sudo , Masaaki Okunaka , Hitoshi Yokono , Tokio Isogai , Mitsuo Yamazaki
IPC分类号： H05B33/00 , C01G15/00 , C03C17/25 , C03C17/27 , C04B28/28 , C04B41/46 , C04B41/50 , C04B41/82 , C04B41/85 , C04B41/87 , C09D5/24 , C09D11/00 , C23C18/12 , G02F1/1333 , G02F1/1343 , H01B1/06
CPC分类号： C04B41/5007 , C03C17/27 , C04B28/28 , C04B41/009 , C04B41/46 , C04B41/82 , C04B41/85 , C23C18/1216 , C23C18/1245 , C23C18/1279 , C03C2217/215 , C03C2217/231 , C03C2218/11 , C03C2218/322
摘要： Transparent electroconductive film having no cracks and whitening is obtained by coating on a substrate a composition comprising an inorganic indium salt, a polybasic carboxylic acid or polybasic carboxylic acid anhydride and a solvent, and calcining the coated composition at a temperature of 300.degree. to 700.degree. C. under an atmosphere containing oxygen. When a tin compound is added to the composition, sheet resistance of the transparent electroconductive film can be adjusted favorably.
摘要翻译：通过在基材上涂布含有无机铟盐，多元羧酸或多元羧酸酐和溶剂的组合物，得到无裂纹和增白的透明导电膜，并在300〜700℃的温度下煅烧涂布组合物 C.在含氧气氛下。当向组合物中加入锡化合物时，可以有利地调节透明导电膜的薄层电阻。

12. 发明授权

US4303443A Electroless copper plating solution 失效
标题翻译：化学镀铜溶液
公开(公告)号：US4303443A
公开(公告)日：1981-12-01
申请号：US159231
申请日：1980-06-13
申请人： Osamu Miyazawa , Hitoshi Oka , Isamu Tanaka , Akira Matsuo , Hitoshi Yokono , Nobuo Nakagawa , Tokio Isogai
发明人： Osamu Miyazawa , Hitoshi Oka , Isamu Tanaka , Akira Matsuo , Hitoshi Yokono , Nobuo Nakagawa , Tokio Isogai
IPC分类号： C23C18/40 , C23C3/02
CPC分类号： C23C18/40
摘要： When an amine compound having at least two polyolefin glycol chains in one molecule is used as a stabilizer, and an alkylene diamine compound, at least one hydrogen atom in the respective amino groups thereof being substituted by CH.sub.2 COOX (wherein X is H or Na) and another hydrogen atom in the respective amino group thereof being substituted by CH.sub.2 OH, is used as a complexing agent for cupric ions and a nitrogen-containing cyclic compound is used as a complexing agent for cuprous ions in an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent and a stabilizer, or an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent, a stabilizer and a complexing agent for cuprous ions, the plating rate of the electroless copper plating solution, mechanical strength of plating film, and stability of the plating solution are improved.
摘要翻译：当使用在一个分子中具有至少两个聚烯烃二醇链的胺化合物作为稳定剂和亚烷基二胺化合物时，其各氨基中的至少一个氢原子被CH 2 COOX（其中X是H或Na）取代，和在其氨基中的另一个氢原子被CH 2 OH取代，用作铜离子的络合剂，并且含氮环状化合物用作含有水，水的无电镀铜溶液中的亚硝酸根离子的络合剂可溶性铜盐，铜离子络合剂，还原剂，pH控制剂和稳定剂，或包含水，水溶性铜盐，铜离子络合剂，还原剂的化学镀铜溶液药剂，pH控制剂，稳定剂和亚铜离子络合剂，化学镀铜溶液的电镀速率，电镀膜的机械强度和稳定剂改善了电镀溶液的性能。

13. 发明授权

US4643913A Process for producing solar cells 失效
标题翻译：太阳能电池生产工艺
公开(公告)号：US4643913A
公开(公告)日：1987-02-17
申请号：US687162
申请日：1984-12-28
申请人： Masaaki Okunaka , Mitsuo Nakatani , Haruhiko Matsuyama , Hitoshi Yokono , Tokio Isogai , Tadashi Saitoh , Kunihiro Matsukuma , Sumiyuki Midorikawa , Satoru Suzuki
发明人： Masaaki Okunaka , Mitsuo Nakatani , Haruhiko Matsuyama , Hitoshi Yokono , Tokio Isogai , Tadashi Saitoh , Kunihiro Matsukuma , Sumiyuki Midorikawa , Satoru Suzuki
IPC分类号： H01L31/04 , C07F7/00 , H01L21/283 , H01L21/288 , H01L31/0216 , H01L31/0224 , H01L31/18
CPC分类号： C07F7/006 , H01L31/02168 , H01L31/022425 , H01L31/1804 , Y02E10/547 , Y02P70/521
摘要： A process for producing solar cells which comprises applying a composition for anti-reflection coating formation on one side of a silicon base plate having a p-n junction therein, printing an Ag paste for contact formation on predetermined areas of the coat, and heat-treating the resulting plate at a temperature of 400.degree. to 900.degree. C. to complete anti-reflection coating and a light-receiving side contact, the process being characterized in that the composition for anti-reflection coating formation contains as essential component, (a) at least one member selected from the metal-organic ligand complex compounds represented by the general formula M(OR.sub.1).sub.n (L).sub.a-n wherein M is a metal selected from Zn, Al, Ga, In, Ti, Zr, Sn, V, Nb, Ta, Mo, and W; R.sub.1 is a C.sub.1 -C.sub.18 alkyl group; L is an organic ligand which forms an non-hydrolyzable bond with the metal ion; a is the valency of the metal M; and n is an integer satisfying 1.ltoreq.n
摘要翻译：一种太阳能电池的制造方法，其特征在于，在具有pn结的硅基板的一面上涂布抗反射涂层用组合物，在所述涂层的规定区域印刷用于接触形成的Ag浆料，并对所述涂料进行热处理得到的板在400-900℃的温度下完成防反射涂层和光接收侧接触，其特征在于用于防反射涂层形成的组合物包含作为必要组分的（a）在选自由通式M（OR1）n（L）a表示的金属 - 有机配体络合物中的至少一种成分其中M是选自Zn，Al，Ga，In，Ti，Zr，Sn，V，Nb ，Ta，Mo和W; R1是C1-C18烷基; L是与金属离子形成不可水解键的有机配体; a为金属M的化合价; n为1，n为1的整数，通式（OR 1）n-1M（L）anOM（OR 1）n-1（L）a表示的水解缩合物，（b）化合物，和（c）溶剂。

14. 发明授权

US4310563A Method for automatically controlling composition of chemical copper plating solution 失效
标题翻译：自动控制化学镀铜液组成的方法
公开(公告)号：US4310563A
公开(公告)日：1982-01-12
申请号：US197150
申请日：1980-10-15
申请人： Hitoshi Oka , Kenji Nakamura , Hitoshi Yokono , Tokio Isogai , Akira Matsuo , Osamu Miyazawa , Isamu Tanaka
发明人： Hitoshi Oka , Kenji Nakamura , Hitoshi Yokono , Tokio Isogai , Akira Matsuo , Osamu Miyazawa , Isamu Tanaka
IPC分类号： G01N27/333 , C23C18/16 , G01N27/30 , G01N27/416 , C23C3/02 , B05D1/18
CPC分类号： C23C18/1683
摘要： The pH of a chemical copper plating solution is exactly measured for a prolonged time by utilizing a copper oxide prepared by etching metallic copper in an 0.1-1 N inorganic acid then oxidizing the etched metallic copper in an aqueous 0.1-1 N alkali metal hydroxide solution as a main electrode for pH measurement or reducing agent concentration measurement in terms of pH.A combination of the pH measurement with well known procedures for measuring concentrations of cupric ions and a complexing agent exactly measures the pH and the concentrations of a reducing agent, cupric ions and a complexing agent for a continuation of longer time than the conventional procedures.
摘要翻译：通过使用通过在0.1-1N无机酸中蚀刻金属铜制备的氧化铜，然后在0.1-1N的碱金属氢氧化物水溶液中氧化蚀刻的金属铜，化学镀铜溶液的pH被长时间精确地测量作为用于pH测量的主要电极或根据pH的还原剂浓度测量。用于测量铜离子浓度和络合剂的众所周知的测量方法的组合可以精确地测量还原剂，铜离子和络合剂的pH值和浓度，持续比常规方法更长的时间。

15. 发明授权

US5388328A Process for fabricating an interconnected multilayer board 失效
标题翻译：用于制造互连的多层板的工艺
公开(公告)号：US5388328A
公开(公告)日：1995-02-14
申请号：US187546
申请日：1994-01-28
申请人： Hitoshi Yokono , Hideo Arima , Takashi Inoue , Naoya Kitamura , Haruhiko Matsuyama , Hitoshi Oka , Fumio Kataoka , Fusaji Shoji , Hideyasu Murooka , Masayuki Kyooi
发明人： Hitoshi Yokono , Hideo Arima , Takashi Inoue , Naoya Kitamura , Haruhiko Matsuyama , Hitoshi Oka , Fumio Kataoka , Fusaji Shoji , Hideyasu Murooka , Masayuki Kyooi
IPC分类号： H01L21/48 , H01L27/01 , H05K3/10 , H05K3/24 , H05K3/46
CPC分类号： H01L21/4857 , H05K3/4647 , H01L2224/1147 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/15312 , H01L2924/16152 , H01L2924/3025 , H05K2203/0733 , H05K2203/0769 , H05K3/108 , H05K3/243 , Y10S428/901 , Y10T29/49126 , Y10T29/49165
摘要： A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby forming a conductor layer, forming another windowed resist layer on the conductor layer and filling windows of this resist layer with a conductor by plating, thereby forming a via-hole layer and to provide a two-level structure of the conductor layer and the via-hole layer. Thereafter, the resist layers and portions of the metallic under-conductor layer other than those in contact with a lower face of the conductor constituting the conductor layer are dissolved to form a two-level skeleton structure of conductor lines and spaces within the skeleton structure are filled with a varnish in a solventless form and the varnish is cured.
摘要翻译：制造相互连接的多层板的方法包括以下步骤：在基底基板上形成金属导电层，在金属下导电层上形成窗口化抗蚀剂层，用导体用电镀填充抗蚀剂层的窗口从而形成导体层，在导体层上形成另一个窗口化的抗蚀剂层，并通过电镀用导体填充该抗蚀剂层的窗口，从而形成通孔层，并提供导体层和通孔的两层结构井层。此后，除了与形成导体层的导体的下表面接触的金属下导体层的抗蚀剂层和部分被溶解以形成骨架结构内的导体线和空间的两级骨架结构填充无溶剂形式的清漆，并且清漆被固化。

16. 发明授权

US5300735A Interconnected multilayer boards and fabrication processes thereof 失效
标题翻译：互连多层板及其制造工艺
公开(公告)号：US5300735A
公开(公告)日：1994-04-05
申请号：US37543
申请日：1993-03-22
申请人： Hitoshi Yokono , Hideo Arima , Takashi Inoue , Naoya Kitamura , Haruhiko Matsuyama , Hitoshi Oka , Fumio Kataoka , Fusaji Shoji , Hideyasu Murooka , Masayuki Kyooi
发明人： Hitoshi Yokono , Hideo Arima , Takashi Inoue , Naoya Kitamura , Haruhiko Matsuyama , Hitoshi Oka , Fumio Kataoka , Fusaji Shoji , Hideyasu Murooka , Masayuki Kyooi
IPC分类号： H01L21/48 , H01L27/01 , H05K3/10 , H05K3/24 , H05K3/46 , H05K1/00
CPC分类号： H01L21/4857 , H05K3/4647 , H01L2224/1147 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/15312 , H01L2924/16152 , H01L2924/3025 , H05K2203/0733 , H05K2203/0769 , H05K3/108 , H05K3/243 , Y10S428/901 , Y10T29/49126 , Y10T29/49165
摘要： Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.
摘要翻译：这里描述了互连的多层板及其制造工艺。骨架结构的多层导体线通过导电多层金属化而形成，同时包括所有的抗蚀剂层和金属的低导电层，然后立即去除抗蚀剂层和金属的不良导电层。然后用无溶剂清漆填充骨架结构的多层导体线之间的空隙，从而形成绝缘层。还描述了使用这种互连的多层板的模块和具有这种模块的计算机。

17. 发明授权

US5208656A Multilayer wiring substrate and production thereof 失效
标题翻译：多层布线基板及其制造
公开(公告)号：US5208656A
公开(公告)日：1993-05-04
申请号：US674605
申请日：1991-03-25
申请人： Haruhiko Matsuyama , Mitsuo Yoshimoto , Jun Tanaka , Fusaji Shoji , Hitoshi Yokono , Takashi Inoue , Tetsuya Yamazaki , Minoru Tanaka , Hidetaka Shigi
发明人： Haruhiko Matsuyama , Mitsuo Yoshimoto , Jun Tanaka , Fusaji Shoji , Hitoshi Yokono , Takashi Inoue , Tetsuya Yamazaki , Minoru Tanaka , Hidetaka Shigi
IPC分类号： H05K3/46 , H01L21/60 , H01L23/498
CPC分类号： H01L23/49827 , H01L23/49822 , H01L2924/0002 , H01L2924/09701
摘要： A multilayer wiring substrate having high reliability can be produced in good productivity by subjecting metal wiring layers to stabilization treatment on the surface with a metal such as Cr, Mo or the like or an aqueous solution of water glass so as to prevent generation of hillocks or whiskers and to improve chemical resistance.
摘要翻译：通过使金属布线层通过金属如Cr，Mo等在表面上进行稳定化处理或水玻璃水溶液，可以以良好的生产率制造具有高可靠性的多层布线基板，以防止产生小丘或晶须并改善耐化学性。

18. 发明授权

US4587197A Flexible photosensitive polymer composition with azide and/or amine compound, poly(amic acid) and highly polar compound with boiling point above 150.degree. C. 失效
标题翻译：具有叠氮化物和/或胺化合物的柔性光敏聚合物组合物，聚（酰胺酸）和沸点高于150℃的高极性化合物
公开(公告)号：US4587197A
公开(公告)日：1986-05-06
申请号：US578058
申请日：1984-02-08
申请人： Mithumasa Kojima , Fumio Kataoka , Fusaji Shoji , Hitoshi Yokono
发明人： Mithumasa Kojima , Fumio Kataoka , Fusaji Shoji , Hitoshi Yokono
IPC分类号： C08L79/08 , G03F7/004 , G03F7/012 , G03F7/038 , G03C1/71 , G03C1/60
CPC分类号： G03F7/0387 , C08L79/08 , G03F7/0125 , Y10S430/12 , Y10S430/128
摘要： A photosensitive polymer composition comprising (A) a poly(amic acid), (B) a compound or a mixture of compounds which can form a compound having two or more amino groups in the molecule, and (C) at least one compound having a boiling point of 150.degree. C. or higher at atmospheric pressure and selected from the group consisting of ##STR1## wherein R.sup.a, R.sup.b, R.sup.c, m and n are as defined in the specification, has good properties and does not produce cracks on a pattern at the time of development obtained from said composition.
摘要翻译：一种光敏聚合物组合物，其包含（A）聚（酰胺酸），（B）可以在分子中形成具有两个或更多个氨基的化合物的化合物或化合物的混合物，和（C）至少一种具有沸点在大气压下为150℃或更高，并且选自由下列组成的组：其中Ra，Rb，Rc，m和n如说明书中所定义，具有良好的性能并且不会在图案上产生裂纹在从所述组合物获得的显影时。

19. 发明授权

US4736012A Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US4736012A
公开(公告)日：1988-04-05
申请号：US625968
申请日：1984-06-29
申请人： Fusaji Shoji , Akihiro Kenmotsu , Isao Obara , Hitoshi Yokono , Takeshi Komaru
发明人： Fusaji Shoji , Akihiro Kenmotsu , Isao Obara , Hitoshi Yokono , Takeshi Komaru
IPC分类号： C08G73/00 , C08G73/10 , H01L23/06 , H01L23/29 , H01L23/31 , H01L23/556 , C08G69/26
CPC分类号： H01L23/3171 , H01L23/293 , H01L23/556 , H01L2224/45144 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01079 , H01L2924/09701 , H01L2924/15153 , H01L2924/15165 , H01L2924/16152 , H01L2924/3025
摘要： A semiconductor device containing an .alpha.-rays shielding resin layer on at least active portion of a semiconductor element, said .alpha.-rays shielding resin being a special polyimide resin, is excellent in thermal resistance at the time of sealing the semiconductor element, adhesion of the .alpha.-rays shielding layer to the semiconductor element, and .alpha.-rays shielding ability.
摘要翻译：一种在半导体元件的至少有效部分上含有α-阵列屏蔽树脂层的半导体器件，所述α-阵列屏蔽树脂是特殊的聚酰亚胺树脂，其密封半导体元件时的耐热性优异，半导体元件的α-阵列屏蔽层和α射线屏蔽能力。

20. 发明授权

US5162240A Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate 失效
标题翻译：在厚膜和薄膜混合多层布线基板上制作电路图案的方法和装置
公开(公告)号：US5162240A
公开(公告)日：1992-11-10
申请号：US537492
申请日：1990-06-12
申请人： Norio Saitou , Hideo Todokoro , Katsuhiro Kuroda , Satoru Fukuhara , Genya Matsuoka , Hideo Arima , Hitoshi Yokono , Takashi Inoue , Hidetaka Shigi
发明人： Norio Saitou , Hideo Todokoro , Katsuhiro Kuroda , Satoru Fukuhara , Genya Matsuoka , Hideo Arima , Hitoshi Yokono , Takashi Inoue , Hidetaka Shigi
IPC分类号： H01L21/48 , H01L23/538 , H01L23/544 , H05K1/02 , H05K1/03 , H05K1/09 , H05K3/46
CPC分类号： H05K3/4679 , H01L21/4857 , H01L23/5383 , H01L23/544 , H01L2223/5442 , H01L2223/54473 , H01L2224/16 , H01L2224/16235 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15174 , H05K1/0269 , H05K1/0306 , H05K1/092 , H05K2201/09781 , H05K2201/09918 , H05K3/4605 , H05K3/467
摘要： A thick and thin film hybrid multilayer wiring substrate includes an adjustment layer provided between a thick film circuit and a thin film circuit in order to adjust positions of the thick film circuit and the thin film circuit with high integration and large area of the thick and thin film hybrid substrate. The adjustment layer is formed using a direct printing process in accordance with dispersion of the shape of the thick film circuit substrate to absorb the dispersion of the substrate. Further, in order to absorb dispersion of contraction of the thick film substrate due to sintering, a position of a mark provided on the substrate is detected by an electron beam and thereafter a connection pattern is formed to be connected to a regular pattern.
摘要翻译：厚薄膜混合多层布线基板包括设置在厚膜电路和薄膜电路之间的调整层，以便调整厚膜电路和薄膜电路的位置，具有高集成度和大面积的厚薄薄膜混合基板。根据厚膜电路基板的形状的分散，使用直接印刷法形成调整层，以吸收基板的分散。此外，为了吸收由于烧结引起的厚膜基板的收缩分散，通过电子束检测设置在基板上的标记的位置，然后形成连接图案以连接到规则图案。

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