专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US07147721B2 Apparatus and method for cleaning electronic packages 有权
标题翻译：电子包装清洗装置及方法
公开(公告)号：US07147721B2
公开(公告)日：2006-12-12
申请号：US10698379
申请日：2003-11-03
申请人： Chi Wah Cheng , Yui Ko Wong , Tim Wai Mak
发明人： Chi Wah Cheng , Yui Ko Wong , Tim Wai Mak
IPC分类号： B08B3/10
CPC分类号： B08B3/12 , B08B3/123 , H01L21/481 , H01L21/67051
摘要： The invention provides an apparatus and method for cleaning a plurality of electronic components. A tank is provided for containing a cleaning fluid and an ultrasonic resonator is mounted in communication with the cleaning fluid for charging ultrasonic energy thereto. A support platform positionable over a top surface of the cleaning fluid supports the electronic components such that the electronic components are in contact with said top surface of the cleaning fluid in use. Further, a cleaning fluid supply system is configured to generate a continuous flow of cleaning fluid into the tank for cleaning the electronic components in contact with said top surface of the cleaning fluid.
摘要翻译：本发明提供一种用于清洁多个电子部件的装置和方法。提供容器用于容纳清洁液体，并且超声波谐振器被安装成与用于向其提供超声波能量的清洁流体连通。可在清洁流体的顶表面上定位的支撑平台支撑电子部件，使得电子部件在使用中与清洁流体的所述顶表面接触。此外，清洁流体供应系统被配置为产生连续的清洁流体流入罐中，用于清洁与清洁流体的所述顶表面接触的电子部件。

12. 发明授权

US09461013B2 Wire spool system for a wire bonding apparatus 有权
标题翻译：线接线装置用线轴系统
公开(公告)号：US09461013B2
公开(公告)日：2016-10-04
申请号：US14549771
申请日：2014-11-21
申请人： Chi Wah Cheng , Hon Kam Ng
发明人： Chi Wah Cheng , Hon Kam Ng
IPC分类号： H01L23/00 , B65H63/06 , B65H51/02 , B65H51/20 , B65H59/00
CPC分类号： H01L24/78 , B65H51/02 , B65H51/20 , B65H59/00 , B65H63/02 , B65H63/06 , B65H2553/42 , B65H2701/361 , H01L2224/45014 , H01L2224/7855 , H01L2224/78601 , H01L2224/78611 , H01L2224/78901 , H01L2924/00014 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a wire spool system for a wire bonding apparatus, comprising: a wire reel arranged to receive a wire; a wire guide for feeding a free end of the wire to a bond head of the wire bonding apparatus; and a tensioning mechanism for tensioning the wire to define a wire path between the wire reel and the wire guide. The wire spool system comprises an imaging module comprising a camera having an image sensor. The imaging module also comprises an image processing unit. The camera is positioned to image, by said image sensor, at least a portion of the wire path to generate image data. The image processing unit is configured to process the image data to determine a geometry and/or a change in geometry of the at least a portion of the wire path.
摘要翻译：公开了一种用于引线接合装置的线卷轴系统，包括：布置成接收线的线卷轴; 用于将线的自由端馈送到引线接合装置的接合头的线引导件; 以及张紧机构，用于张紧所述线以限定所述线卷轴和所述导线器之间的线路。线滑系统包括成像模块，该成像模块包括具有图像传感器的相机。成像模块还包括图像处理单元。定位摄像机通过所述图像传感器对所述线路的至少一部分进行成像以产生图像数据。图像处理单元被配置为处理图像数据以确定线路的至少一部分的几何形状和/或几何形状的变化。

13. 发明授权

US09261536B2 Test contactor for electrical testing of electronic components 有权
标题翻译：用于电子元件电气测试的测试接触器
公开(公告)号：US09261536B2
公开(公告)日：2016-02-16
申请号：US13584971
申请日：2012-08-14
申请人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Kai Fung Lau
发明人： Hing Suen Siu , Yu Sze Cheung , Chi Wah Cheng , Kai Fung Lau
IPC分类号： G01R31/20 , G01R31/02 , G01R31/26 , G01R31/302 , H01R11/18 , H01R13/00 , H05K1/00 , G01R1/067 , G01R1/04 , G01R1/073
CPC分类号： G01R1/06772 , G01R1/0416 , G01R1/07342
摘要： A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.
摘要翻译：一种用于电子部件的测试装置包括安装块和布置在安装块上的多个接触条。接触条被配置成使得电子部件的电引线可操作以在偏置方向上按压和弯曲接触片，以确保电子部件测试期间电引线和接触片之间的良好接触。此外，位于安装块上的预加载块可操作以在电引线和接触片之间接触之前在偏压方向上接触并施加预接触力。

14. 发明授权

US09016675B2 Apparatus and method for supporting a workpiece during processing 有权
标题翻译：在加工过程中支撑工件的装置和方法
公开(公告)号：US09016675B2
公开(公告)日：2015-04-28
申请号：US13542785
申请日：2012-07-06
申请人： Chi Wah Cheng , Lap Kei Chow , Chi Hang Leung
发明人： Chi Wah Cheng , Lap Kei Chow , Chi Hang Leung
IPC分类号： B25B11/00 , C23C16/00 , C23F1/00 , B24B7/00 , B24B9/00 , B28D5/00 , H01L21/67 , H01L21/687 , H01L21/683
CPC分类号： B28D5/0094 , H01L21/67126 , H01L21/6838 , H01L21/68792 , Y10T29/49998
摘要： An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.
摘要翻译：公开了一种用于在加工工件期间支撑工件的装置。该装置包括：具有可连接到真空源的真空室的底架; 支撑装置可相对于底盘旋转，支撑装置具有中空隔室和用于保持工件的支撑表面; 以及布置在底盘和支撑装置之间的至少一个密封装置，以在底架和支撑装置之间提供气密密封，同时允许支撑装置相对于底盘旋转，以便形成真空通道从支撑装置的支撑表面延伸穿过支撑装置的中空隔室和底盘的真空室到真空源，从而在工件加工期间将工件保持在支撑装置的支撑表面上。

15. 发明授权

US08289388B2 Alignment method for singulation system 有权
标题翻译：分割系统对齐方法
公开(公告)号：US08289388B2
公开(公告)日：2012-10-16
申请号：US12465766
申请日：2009-05-14
申请人： Chi Wah Cheng , Lap Kei Chow
发明人： Chi Wah Cheng , Lap Kei Chow
IPC分类号： H04N7/18
CPC分类号： H01L21/681 , H01L21/67092
摘要： A method for determining virtual cutting lines for a substrate prior to its singulation is provided whereby the substrate comprises first and second rows of alignment marks which are substantially parallel to each other such that a pair of alignment marks each from the first and second rows of alignment marks is configured for determining a position of a virtual cutting line. The method comprises the steps of positioning the first row of alignment marks along a relative motion path of a first camera and positioning the second row of alignment marks along a relative motion path of a second camera. While the substrate is being moved relative to the first and second cameras along the respective relative motion paths without stopping, the first and second cameras capture images of multiple pairs of alignment marks from the first and second rows of alignment marks during such motion. Thereafter, the position of each virtual cutting line is determined from the images of each pair of alignment marks along the first and second rows of alignment marks relating to the virtual cutting line and stored in a storage device for use during singulation.
摘要翻译：提供了一种用于在其单独化之前确定用于衬底的虚拟切割线的方法，由此所述衬底包括基本上彼此平行的第一和第二排对准标记，使得一对对准标记各自来自第一和第二排对准标记被配置用于确定虚拟切割线的位置。该方法包括以下步骤：沿着第一相机的相对运动路径定位第一排对准标记，并沿着第二相机的相对运动路径定位第二排对准标记。当基板相对于第一和第二相机相对于相应的相对运动路径移动而不停止时，第一和第二相机在这种运动期间从第一和第二排对准标记捕获多对对准标记的图像。此后，根据与虚拟切割线相关的第一和第二排对准标记的每对对准标记的图像确定每个虚拟切割线的位置，并存储在用于分割的存储装置中。

16. 发明授权

US08167523B2 Singulation handler comprising vision system 有权
标题翻译：分割处理器包括视觉系统
公开(公告)号：US08167523B2
公开(公告)日：2012-05-01
申请号：US11777000
申请日：2007-07-12
申请人： Chi Wah Cheng , Lap Kei Eric Chow
发明人： Chi Wah Cheng , Lap Kei Eric Chow
IPC分类号： H01L21/304
CPC分类号： H01L21/681 , H01L21/67092 , Y10T83/04
摘要： Singulation handler is provided which comprises a loading zone where a carrier mechanism receives and holds an electronic component and a singulation zone where the electronic component held by the carrier mechanism is singulated. A loader that is movable along an axis is operative to place the electronic component onto the carrier mechanism when it is situated in the loading zone and a vision system that is movable along substantially the same axis as the loader is operative to obtain at least one image of the electronic component showing alignment information so that the electronic component can be properly aligned during singulation.
摘要翻译：提供了一种分包处理器，其包括载体区域，其中载体机构接收并保持电子部件和由载体机构保持的电子部件被单个化的单位区域。沿着轴线可移动的装载机可操作以将电子部件放置在载体机构上，当它位于装载区域中时，以及视觉系统可沿与加载器基本上相同的轴线移动以获得至少一个图像的电子部件显示对准信息，使得电子部件可以在分割期间适当地对准。

17. 发明授权

US07762449B2 Bond head for heavy wire bonder 有权
标题翻译：重焊接机的焊头
公开(公告)号：US07762449B2
公开(公告)日：2010-07-27
申请号：US12275826
申请日：2008-11-21
申请人： Chi Wah Cheng , Tim Wai Tony Mak , Hon Kam Boris Ng
发明人： Chi Wah Cheng , Tim Wai Tony Mak , Hon Kam Boris Ng
IPC分类号： B23K31/02 , B23K37/00
CPC分类号： B23K20/004 , B23K20/106 , B23K2101/42 , H01L21/67138 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48472 , H01L2224/78313 , H01L2224/7855 , H01L2224/78822 , H01L2224/85 , H01L2224/85205 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01059 , H01L2924/01082 , H01L2924/00014 , H01L2924/00
摘要： A bonding apparatus for bonding a length of wire comprises a first module which is drivable along a linear axis towards and away from a bonding point and a second module slidably mounted to the first module. A wire cutter is mounted to the first module and a bonding tool is mounted to the second module. A coupling mechanism is operative to lock the second module in fixed relative position to the first module, and to unlock the second module from its fixed relative position to the first module so that the second module is slidable relative to the first module in directions parallel to the linear axis.
摘要翻译：用于接合一段电线的接合装置包括可沿着线性轴线朝向和远离接合点驱动的第一模块和可滑动地安装到第一模块的第二模块。线切割器安装到第一模块，并且粘合工具安装到第二模块。联接机构用于将第二模块锁定在与第一模块固定的相对位置上，并且将第二模块从与第一模块的固定相对位置解锁，使得第二模块可相对于第一模块在与线性轴。

18. 发明授权

US06983872B2 Substrate alignment method and apparatus 失效
标题翻译：基板对准方法及装置
公开(公告)号：US06983872B2
公开(公告)日：2006-01-10
申请号：US10454258
申请日：2003-06-03
申请人： Chi Wah Cheng , Ping Chun Benson Chong , Chin Pang Anson Chan
发明人： Chi Wah Cheng , Ping Chun Benson Chong , Chin Pang Anson Chan
IPC分类号： B23K13/08 , B23K31/12 , B23Q15/00
CPC分类号： B23K3/0607 , B23K2101/42
摘要： The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.
摘要翻译：本发明提供了一种用于对准衬底的方法和装置。该装置包括用于在球拾取过程中拾取多个焊球并将其沉积到基板上的球形拾取头，以及适于观察和获得基板的位置信息的视觉系统。此外，提供了可安装视觉系统的载体，使得视觉系统的操作与球拍头的移动脱离。响应于由视觉系统观看的所述位置信息的驱动器可操作以至少对准基底和球形拾取头，以将焊球沉积到基底上。

19. 发明授权

US09218995B2 Transfer apparatus for transferring electronic devices and changing their orientations 有权
标题翻译：用于传送电子设备和改变其方向的传送设备
公开(公告)号：US09218995B2
公开(公告)日：2015-12-22
申请号：US14258463
申请日：2014-04-22
申请人： Chi Wah Cheng , Kai Fung Lau , Hing Suen Siu
发明人： Chi Wah Cheng , Kai Fung Lau , Hing Suen Siu
IPC分类号： B65G47/84 , H01L21/677 , H01L21/67
CPC分类号： H01L21/67718 , H01L21/67132
摘要： A transfer apparatus for transferring electronic devices from a wafer to a test handler. The transfer apparatus comprises: i) a rotary device rotatable about an axis; and ii) a plurality of holders configured to hold the electronic devices for transfer from the wafer to the test handler. The plurality of holders are coupled to, and extendable from, the rotary device to pick the electronic devices from the wafer. Specifically, the plurality of holders are arranged circumferentially around, and inclined with respect to, the axis of the rotary device, so as to change an orientation of the electronic devices on the wafer to a desired orientation of the electronic devices on the test handler.
摘要翻译：一种用于将电子设备从晶片传送到测试处理器的传送设备。传送装置包括：i）可围绕轴线旋转的旋转装置; 以及ii）多个保持器，其构造成保持用于从晶片转移到测试处理器的电子设备。多个保持器联接到旋转装置并且可从旋转装置延伸以从晶片拾取电子装置。具体地说，多个保持器周向地布置并相对于旋转装置的轴线倾斜，以便将晶片上的电子设备的取向改变到测试处理器上的电子设备的期望取向。

20. 发明授权

US08967368B2 Apparatus for processing electronic devices 有权
标题翻译：电子设备处理装置
公开(公告)号：US08967368B2
公开(公告)日：2015-03-03
申请号：US14047143
申请日：2013-10-07
申请人： Chi Wah Cheng , Kai Fung Lau
发明人： Chi Wah Cheng , Kai Fung Lau
IPC分类号： B65G29/00 , B65G47/84 , H01L21/677
CPC分类号： B65G29/00 , B65G47/846 , H01L21/677 , H01L21/67721
摘要： An apparatus for processing electronic devices includes a rotary turret having first device concentric around the rotary turret, which transfer the electronic devices; a rotary wheel having second device holders concentric around the rotary wheel, which receive the electronic devices and a processing device to process the electronic devices. The rotary turret rotates the first device holders along a first circular path, and the rotary wheel rotates the second device holders along a second circular path. The first axis of the rotary turret is perpendicular to the second axis of the rotary wheel, and that a projection of the second circular path of the second device holders in a direction perpendicular to the second axis of the rotary wheel onto the first circular path of the first device holders defines a line from the inside to the outside of the first circular path of the first device holders.
摘要翻译：一种用于处理电子设备的设备包括：旋转转台，其具有围绕旋转转台同心的第一设备，其传送电子设备; 旋转轮具有围绕旋转轮同心的第二装置保持器，其接收电子装置和处理装置以处理电子装置。旋转转台沿着第一圆形路径旋转第一装置保持器，并且旋转轮沿着第二圆形路径旋转第二装置保持器。旋转转台的第一轴线垂直于旋转轮的第二轴线，并且第二装置保持器的第二圆形路径在垂直于旋转轮的第二轴线的方向上的突起到第一圆形路径上第一装置保持器限定从第一装置保持器的第一圆形路径的内侧到外侧的线。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式