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1. 发明授权

US07147721B2 Apparatus and method for cleaning electronic packages 有权
标题翻译：电子包装清洗装置及方法
公开(公告)号：US07147721B2
公开(公告)日：2006-12-12
申请号：US10698379
申请日：2003-11-03
申请人： Chi Wah Cheng , Yui Ko Wong , Tim Wai Mak
发明人： Chi Wah Cheng , Yui Ko Wong , Tim Wai Mak
IPC分类号： B08B3/10
CPC分类号： B08B3/12 , B08B3/123 , H01L21/481 , H01L21/67051
摘要： The invention provides an apparatus and method for cleaning a plurality of electronic components. A tank is provided for containing a cleaning fluid and an ultrasonic resonator is mounted in communication with the cleaning fluid for charging ultrasonic energy thereto. A support platform positionable over a top surface of the cleaning fluid supports the electronic components such that the electronic components are in contact with said top surface of the cleaning fluid in use. Further, a cleaning fluid supply system is configured to generate a continuous flow of cleaning fluid into the tank for cleaning the electronic components in contact with said top surface of the cleaning fluid.
摘要翻译：本发明提供一种用于清洁多个电子部件的装置和方法。提供容器用于容纳清洁液体，并且超声波谐振器被安装成与用于向其提供超声波能量的清洁流体连通。可在清洁流体的顶表面上定位的支撑平台支撑电子部件，使得电子部件在使用中与清洁流体的所述顶表面接触。此外，清洁流体供应系统被配置为产生连续的清洁流体流入罐中，用于清洁与清洁流体的所述顶表面接触的电子部件。

2. 发明授权

US08777086B2 Image-assisted system for adjusting a bonding tool 有权
标题翻译：用于调整粘合工具的图像辅助系统
公开(公告)号：US08777086B2
公开(公告)日：2014-07-15
申请号：US13451622
申请日：2012-04-20
申请人： Jiang Wen Deng , Hei Lam Chang , Tim Wai Mak
发明人： Jiang Wen Deng , Hei Lam Chang , Tim Wai Mak
IPC分类号： B23K31/02 , B23K37/00
CPC分类号： B23K20/10 , B23K20/26 , H01L2224/78313 , H01L2224/78315
摘要： A bonding tool is adjusted to a desired operational position by viewing the bonding tool with an image-capturing device and displaying an image of the bonding tool as viewed by the image-capturing device onto a display screen. A corresponding image of a reference bonding tool showing the desired operational position of the bonding tool is superimposed onto the display screen and the position of the bonding tool is adjusted with an adjustment mechanism until the bonding tool as viewed by the image-capturing device is aligned with the superimposed image of the reference bonding tool.
摘要翻译：通过使用图像捕获装置观察粘合工具将粘合工具调整到期望的操作位置，并将由图像捕获装置观察的粘合工具的图像显示在显示屏上。将显示焊接工具的期望操作位置的参考焊接工具的对应图像叠加在显示屏上，并且用调节机构调节焊接工具的位置，直到由图像捕获装置观察的焊接工具对准与参考焊接工具的叠加图像。

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