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151. 发明授权

US06495394B1 Chip package and method for manufacturing the same 失效
标题翻译：芯片封装及其制造方法
公开(公告)号：US06495394B1
公开(公告)日：2002-12-17
申请号：US09584144
申请日：2000-05-31
申请人： Yoshikazu Nakata , Takeshi Kasai
发明人： Yoshikazu Nakata , Takeshi Kasai
IPC分类号： H01L2144
CPC分类号： H05K3/062 , H01L21/4853 , H01L21/486 , H01L21/4864 , H01L23/3128 , H01L23/49816 , H01L23/49872 , H01L24/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/00015 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/1433 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/3011 , H05K3/0061 , H05K3/108 , H05K3/427 , H01L2924/00 , H01L2224/05599 , H01L2224/85399 , H01L2224/45099 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In a chip package, when a Ni/Au layer is formed by electroless plating, there is no problem with density increasing of interconnections and the like, since leads for plating and tie bars are not formed. However, the adhesive strength of solder balls to ball pads is low, so that the adhesion tends to be unstable. In the present invention, no leads for plating are formed, while the adhesive strength of solder balls to ball pads is improved by electroplating the ball pads with a Ni/Au layer. In addition, an increase in the density of interconnections and an improvement of the electrical properties is also obtained. The Ni/Au layer is formed by electroplating on the base metal layer surface which is not covered with a DFR (Dry Film Resist) by applying an electric current to the base metal layer.
摘要翻译：在芯片封装中，当通过无电解电镀形成Ni / Au层时，由于不形成用于电镀和连接条的引线，因此互连等的密度增加没有问题。然而，焊球对焊盘的粘合强度低，使得粘合趋于不稳定。在本发明中，不形成电镀用引线，同时通过用Ni / Au层电镀球垫来提高焊球对球垫的粘合强度。此外，还获得了互连密度的增加和电性能的改善。通过向基底金属层施加电流，在未被DFR（干膜抗蚀剂）覆盖的基底金属层表面上电镀Ni / Au层。

152. 发明申请

US20020162880A1 APPARATUS AND METHOD FOR REMOVING INTERCONNECTIONS 失效
标题翻译：用于移除互连的装置和方法
公开(公告)号：US20020162880A1
公开(公告)日：2002-11-07
申请号：US09850350
申请日：2001-05-07
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Raymond A. Jackson , Scott A. Bradley , Stephen A. DeLaurentis , Mario J. Interrante , David C. Linnell
IPC分类号： B23K001/018 , B23K028/00 , B23K005/22
CPC分类号： B08B1/008 , B08B7/0071 , H01L21/4864 , H05K3/3436 , H05K3/3457
摘要： A method for removing at least one molten or solid structure from a surface including: placing the surface with the at least one molten or solid structure in a fixture; disposing said wiper assembly acted on by a bias proximate the at least one molten or solid structure; retaining the wiper assembly in a first position with a device having a first temperature point level equivalent to or higher than a second melting point level of the at least one molten or solid structure; and raising the temperature of the fixture to the first temperature point level; wherein the at least one molten or solid structure is wiped from the surface when the device reaches the first temperature point level. An apparatus for removing at least one molten or solid structure from a substrate for rework, the apparatus comprising: a fixture for sustaining and biasing the substrate against a wiper assembly; the wiper assembly configured and positioned to slidably engage at least a portion of the substrate; a bias for translating the wiper assembly along a surface of the substrate having the at least one molten or solid structure to be removed; and a guide block assembly capable of guiding and locking the wiper assembly.
摘要翻译：一种用于从表面去除至少一种熔融或固体结构的方法，包括：将具有至少一种熔融或固体结构的表面放置在固定装置中; 将所述擦拭器组件布置成靠近所述至少一个熔融或固体结构的偏压; 将所述刮水器组件保持在具有等于或高于所述至少一个熔融或固体结构的第二熔点水平的第一温度点水平的装置的第一位置; 并将夹具的温度提高到第一温度点水平; 其中当所述装置达到所述第一温度点水平时，所述至少一个熔融或固体结构从所述表面擦拭。一种用于从基板去除至少一个熔融或固体结构以进行返修的装置，所述装置包括：固定装置，用于将所述基板保持并偏置在刮水器组件上; 所述擦拭器组件被构造和定位成可滑动地接合所述衬底的至少一部分; 用于沿着具有要移除的至少一个熔融或固体结构的衬底的表面平移擦拭器组件的偏压; 以及能够引导和锁定刮水器组件的导块组件。

153. 发明授权

US06395097B1 Method and apparatus for cleaning and removing flux from an electronic component package 有权
标题翻译：用于清洁和去除电子部件封装中的焊剂的方法和装置
公开(公告)号：US06395097B1
公开(公告)日：2002-05-28
申请号：US09465132
申请日：1999-12-16
申请人： Abhay Maheshwari , Shirish Shah
发明人： Abhay Maheshwari , Shirish Shah
IPC分类号： C03C2300
CPC分类号： H01L21/4864 , C03C23/0075 , Y10S134/902 , Y10S438/906
摘要： The present invention is a method for cleaning the cavities in electronic components by providing a semiconductor component having an outside surface and a cavity therein. The component including hole in the outside surface enabling fluid flow in to or out of the cavity. The component is immersed in a solvent bath where solvent is flowed into the cavity using the hole, the solvent cleaning the cavity and then optionally being evacuated from the cavity. Specifically, the principles of the present invention may be used to clean the underfill space of a flip-chip package. The flip-chip package includes a packaging substrate with an evacuation port passing through the bulk of the packaging substrate such that the port is in communication with the underfill space and a bottom surface with the packaging substrate. This assembly is immersed in a solvent filled solvent bath. Solvent is drawn into the underfill space through said port. Alternatively, solvent may be injected into the underfill space through the port. Moreover, both approaches may be combined to modulate the solvent flow through the underfill space. The act of drawing or injecting solvent into the underfill space cleans the flux and residues from the underfill space of the die/substrate assembly. After cleaning, the underfill space can be rinsed. After which the assembly is subject to further processing. The present invention includes an apparatus for cleaning electronic components in accordance with the present invention. The system includes a solvent containing solvent bath, a solvent flow means for flowing solvent under pressure into or out of an underfill space of an electronic component, and a rack for holding a plurality of components in position such that the solvent flow means can effectively flow solvent into the underfill spaces of the components.
摘要翻译：本发明是一种通过在其中提供具有外表面和空腔的半导体部件来清洁电子部件中的空腔的方法。该组件包括外表面中的孔，使得流体能够流入或流出空腔。将该组分浸入溶剂浴中，其中使用孔将溶剂流入空腔，溶剂清洗空腔，然后可选地从空腔排空。具体地，本发明的原理可以用于清洁倒装芯片封装的底部填充空间。倒装芯片封装包括具有通过封装基板主体的抽空端口的封装基板，使得该端口与底部填充空间连通，并且底部表面与封装基板连接。将该组件浸入溶剂填充的溶剂浴中。溶剂通过所述端口被吸入底部填充空间。或者，可以通过端口将溶剂注入底部填充空间。此外，两种方法可以组合以调节通过底部填充空间的溶剂流。将溶剂吸入或注入底部填充空间的作用清除了模具/基底组件的底部填充空间的助焊剂和残留物。清洁后，可以冲洗底部填充空间。之后组装进行进一步处理。本发明包括根据本发明的用于清洁电子部件的设备。该系统包括含溶剂的溶剂浴，用于在压力下将溶剂流入或流出电子部件的底部填充空间的溶剂流装置，以及用于将多个部件保持在适当位置的支架，使得溶剂流动装置能够有效地流动溶剂进入组件的底部填充空间。

154. 发明授权

US06392286B1 Semiconductor chip packaging system and a semiconductor chip packaging method using the same 失效
标题翻译：半导体芯片封装系统和半导体芯片封装方法采用相同的方法
公开(公告)号：US06392286B1
公开(公告)日：2002-05-21
申请号：US09632079
申请日：2000-08-02
申请人： Ho-Tae Jin , Heui-Seong Kim , Sang-Young Kim
发明人： Ho-Tae Jin , Heui-Seong Kim , Sang-Young Kim
IPC分类号： H01L2144
CPC分类号： H01L21/4864 , H01L24/75 , H01L24/78 , H01L2224/78 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： The present invention uses an ultraviolet ray to clean PCBs in packaging semiconductors, instead of using a plasma gas. Since the ultraviolet ray cleaning does not require a vacuum condition around an ultraviolet ray lamp, a guide belt for conveying the PCBs can be freely installed in such a manner that an ultraviolet ray cleaning tool and fabricating equipment are arranged in-line. This results in an in-line arrangement of an ultraviolet ray cleaning chamber and the fabricating equipment. Therefore, the PCBs can be introduced into fabricating processes immediately after cleaning and a long standby time problem of the PCB outside of the fabricating equipment is solved.
摘要翻译：本发明使用紫外线来清洁封装半导体中的PCB，而不是使用等离子体气体。由于紫外线清洁不需要紫外线灯附近的真空条件，所以用于输送PCB的引导带可以以紫外线清洁工具和制造设备成对排列的方式自由地安装。这导致紫外线清洁室和制造设备的在线布置。因此，可以在清洁后立即将PCB引入制造工艺中，并且解决了制造设备外的PCB的长待机时间问题。

155. 发明申请

US20020034840A1 Plasma-processing apparatus, plasma-processing method, plasma-processed board, chip mounting method, and chip mounted assembly 失效
标题翻译：等离子体处理装置，等离子体处理方法，等离子体处理板，芯片安装方法和芯片安装组件
公开(公告)号：US20020034840A1
公开(公告)日：2002-03-21
申请号：US09948098
申请日：2001-09-07
发明人： Ryota Furukawa , Ryuji Nagadome
IPC分类号： H01L021/44 , H01L021/48 , H01L021/50
CPC分类号： H01L24/85 , H01L21/4864 , H01L21/67028 , H01L24/48 , H01L24/78 , H01L24/97 , H01L2224/05554 , H01L2224/16 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/78301 , H01L2224/83192 , H01L2224/85013 , H01L2224/85181 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/181 , H05K3/26 , Y10S438/906 , H01L2224/81 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A plasma-processing apparatus providing a resin mold domed enough to allow no bonding wires to be exposed is presented. The plasma-processing apparatus cleans a board including a chip mounted thereon and a disposing area for a pad formed around the chip. The apparatus includes a chamber for accommodating the board; an electrode mounted to the chamber for generating plasma in the chamber with a voltage applied thereto, a table for supporting the board in the chamber, and a masking member which is provided above the board. The masking member has an opening for exposing the chip and the disposing area to the plasma.
摘要翻译：提供了一种提供足以允许没有接合线暴露的树脂模具的等离子体处理设备。等离子体处理装置清洗包括安装在其上的芯片的板和用于在芯片周围形成的焊盘的布置区域。该装置包括容纳该板的腔室; 电极，其安装到所述室中，用于在所述室中产生施加电压的等离子体，用于在所述室中支撑所述板的台，以及设置在所述板上方的掩模构件。掩模构件具有用于将芯片暴露和等离子体的布置区域的开口。

156. 发明申请

US20010028117A1 Method and structure for preventing adhesive bleed onto surfaces 失效
标题翻译：防止粘合剂渗透到表面上的方法和结构
公开(公告)号：US20010028117A1
公开(公告)日：2001-10-11
申请号：US09881466
申请日：2001-06-14
申请人： International Business Machines Corporation
发明人： Bernd K. Appelt , Gary A. Johansson , Gerald W. Jones , Luis J. Matienzo , Yenloan H. Nguyen , Konstantinos I. Papathomas
IPC分类号： H01L029/40
CPC分类号： B82Y30/00 , B82Y10/00 , H01L21/4864 , H01L23/49894 , H01L24/80 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/14
摘要： A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide nullSelf-Assembled Monolayersnull (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface. The hydrocarbon segment presents a surface on the noble metal that has the characteristics of the hydrocarbon portion of the molecule which has a low surface tension, and, thus, prevents wetting of the noble metal by an epoxy adhesive component. The SAMs, once they provide protection from the bleed of the die attach adhesives, self desorb during the wire bonding or soldering temperatures.
摘要翻译：提供了一种方法和结构，用于当将I / C芯片附接到基板时，防止粘合剂（例如环氧树脂）在电介质基板的表面上的贵金属引线接合焊盘上的润湿或渗出。该方法包括用化学成分处理引线接合焊盘，该化学组合物防止由环氧树脂的部件渗透到引线接合焊盘的表面上。化学成分是一种在金表面提供“自组装单层”（SAM）的化学成分。这些组合物的特征在于具有连接到烃部分如（CH 2）x链的至少一个基团的硫醇或二硫化物的分子。与贵金属化学键合的分子的硫醇或含硫部分的亲和性提供了分子与金属表面相对较强的附着。碳氢化合物段在贵金属上呈现具有低分子表面张力的分子的特征的表面，从而防止了环氧粘合剂组分对贵金属的润湿。 SAMs一旦提供防止裸片附着胶粘剂的泄漏，在引线接合或焊接温度期间自解吸。

157. 发明授权

US06280527B1 Aqueous quaternary ammonium hydroxide as a screening mask cleaner 失效
标题翻译：水性季铵氢氧化物作为筛选面膜清洁剂
公开(公告)号：US06280527B1
公开(公告)日：2001-08-28
申请号：US09096841
申请日：1998-06-12
申请人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
发明人： Krishna G. Sachdev , John T. Butler , Michael E. Cropp , Donald W. DiAngelo , John F. Harmuth , James N. Humenik , John U. Knickerbocker , Daniel S. Mackin , Glenn A. Pomerantz , David E. Speed , Candace A. Sullivan , Bruce E. Tripp , James C. Utter
IPC分类号： B08B308
CPC分类号： C23G1/14 , C11D7/06 , C11D7/3209 , C11D7/3218 , C11D11/0047 , C23G1/24 , G03F7/425 , H01L21/4864 , H05K1/092 , H05K3/1233 , H05K3/26 , H05K2203/0793 , H05K2203/122
摘要： This invention relates to the cleaning of objects that relate to semiconductor printing, such as, for example, screening masks. This invention is basically directed to removing, for example, an organic polymer-metal composite paste from screening masks used in printing conductive metal patterns onto ceramic green sheets in the fabrication of semiconductor packaging substrates. More particularly, this invention is concerned with the automated in-line cleaning of paste screening masks with an aqueous alkaline solution of a quaternary ammonium hydroxide as a more environmentally friendly alternative to non-aqueous organic solvents-based cleaning in screening operations for the production multilayer ceramic (MLC) substrates.
摘要翻译：本发明涉及清洁与半导体印刷有关的物体，例如掩模掩模。本发明基本上涉及在半导体封装基板的制造中，从用于印刷导电金属图案的掩模掩模中去除例如有机聚合物 - 金属复合浆料到陶瓷生片上。更具体地说，本发明涉及使用季铵氢氧化物的碱性水溶液的糊状掩模掩模的自动在线清洗作为生产多层筛选操作中非水有机溶剂基清洗的更环保的替代方法陶瓷（MLC）基板。

158. 发明授权

US06252307B1 Structure for preventing adhesive bleed onto surfaces 失效
标题翻译：用于防止粘合剂渗透到表面上的结构
公开(公告)号：US06252307B1
公开(公告)日：2001-06-26
申请号：US09537959
申请日：2000-03-28
申请人： Bernd K. Appelt , Gary A. Johansson , Gerald W. Jones , Luis J. Matienzo , Yenloan H. Nguyen , Konstantinos I. Papathomas
发明人： Bernd K. Appelt , Gary A. Johansson , Gerald W. Jones , Luis J. Matienzo , Yenloan H. Nguyen , Konstantinos I. Papathomas
IPC分类号： H01L2100
CPC分类号： B82Y30/00 , B82Y10/00 , H01L21/4864 , H01L23/49894 , H01L24/80 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/014 , H01L2924/14
摘要： A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface. The hydrocarbon segment presents a surface on the noble metal that has the characteristics of the hydrocarbon portion of the molecule which has a low surface tension, and, thus, prevents wetting of the noble metal by an epoxy adhesive component. The SAMs, once they provide protection from the bleed of the die attach adhesives, self desorb during the wire bonding or soldering temperatures.
摘要翻译：提供了一种方法和结构，用于当将I / C芯片附着到基板上时，防止粘合剂（例如环氧树脂）在电介质基板的表面上的贵金属线接合焊盘上的润湿或渗出。该方法包括用化学成分处理引线接合焊盘，该化学组合物防止由环氧树脂的部件渗透到引线接合焊盘的表面上。化学成分是一种在金表面提供“自组装单层”（SAM）的化学成分。这些组合物的特征在于具有连接到烃部分如（CH 2）x链的至少一个基团的硫醇或二硫化物的分子。与贵金属化学键合的分子的硫醇或含硫部分的亲和性提供了分子与金属表面相对较强的附着。烃段在贵金属上呈现具有低分子表面张力的分子的特征的表面，并且因此防止了环氧粘合剂组分对贵金属的润湿。一旦它们提供防止裸片的泄漏附着粘合剂，在引线接合或焊接温度期间自身解吸。

159. 发明授权

US5882954A Method for adhering a metallization to a substrate 失效
标题翻译：将金属化粘附到基底的方法
公开(公告)号：US5882954A
公开(公告)日：1999-03-16
申请号：US944506
申请日：1997-10-06
申请人： Ram Singh Raghava , Andrew Z. Glovatsky , Jay DeAvis Baker , Michael George Todd
发明人： Ram Singh Raghava , Andrew Z. Glovatsky , Jay DeAvis Baker , Michael George Todd
IPC分类号： H01L21/48 , H05K3/14 , H05K3/16 , H05K3/38 , H01L21/44 , H01L21/50
CPC分类号： H05K3/387 , H01L21/4846 , H01L21/4864 , H05K3/381 , H05K2201/0129 , H05K2201/0133 , H05K2201/0212 , H05K2203/0773 , H05K3/14 , H05K3/16
摘要： There is disclosed herein a method for adhering metallizations to a substrate, comprising the steps of: (1) providing a substrate having a first surface; (2) applying a coating atop the first surface, such that the coating has a second surface bonded to the first surface, and a third surface generally conforming with the second surface; (3) etching away material from the third surface, so as to roughen and form pits in the third surface; and (4) attaching a metallization to the pits in the third surface by plating, sputtering, or similar means.
摘要翻译：本文公开了一种将金属化物粘合到基底上的方法，包括以下步骤：（1）提供具有第一表面的基底; （2）在所述第一表面顶上施加涂层，使得所述涂层具有与所述第一表面结合的第二表面，以及大致与所述第二表面相符的第三表面; （3）从第三表面蚀刻掉材料，以便在第三表面中粗糙化并形成凹坑; 和（4）通过电镀，溅射或类似方式将金属化附着到第三表面中的凹坑。

160. 发明授权

US5632438A Direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization 失效
标题翻译：直接芯片连接工艺和铝线接线铜电路设备
公开(公告)号：US5632438A
公开(公告)日：1997-05-27
申请号：US541256
申请日：1995-10-12
申请人： Mark K. Hoffmeyer , Gregg A. Knotts , Connie J. Mathison
发明人： Mark K. Hoffmeyer , Gregg A. Knotts , Connie J. Mathison
IPC分类号： H01L21/48 , H01L21/60 , H01L21/603
CPC分类号： H01L24/85 , H01L21/4864 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/8501 , H01L2224/85011 , H01L24/45 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/14 , H01L2924/181
摘要： A direct chip attachment process and apparatus for aluminum wirebonding on copper circuitization are provided. After at least one integrated circuit chip is attached to a carrier, an aqueous cleaning solution containing citric and oxalic acid based additives is applied to the carrier and attached integrated circuit chip. Then a deionized water rinse is applied to the carrier and attached integrated circuit chip, followed drying for a set time period. Next wirebonding on copper circuitization carried by the carrier is performed.
摘要翻译：提供了用于铜电路上的铝线接合的直接芯片附接工艺和装置。在至少一个集成电路芯片附着到载体上之后，将含有柠檬酸和草酸的添加剂的含水清洗溶液施加到载体和附着的集成电路芯片上。然后将去离子水冲洗物施加到载体和附接的集成电路芯片上，然后干燥一段固定的时间。执行由载体承载的铜电路的下一次引线接合。

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