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131. 发明申请

US20020162606A1 Amorphous electrode compositions 有权
标题翻译：无定形电极组合物
公开(公告)号：US20020162606A1
公开(公告)日：2002-11-07
申请号：US09751169
申请日：2000-12-29
发明人： Robert L. Turner , Brian D. Fredericksen , Larry J. Krause , Jeffrey R. Dahn , Dominique C. Larcher , Ian A. Courtney , Ou Mao
IPC分类号： C22C045/00
CPC分类号： C22C45/00 , C22C21/00 , C22C21/02 , C22C21/14 , C22C45/08 , C23C4/10 , C23C4/123 , C23C14/022 , C23C14/0682 , H01M4/0471 , H01M4/134 , H01M4/364 , H01M4/366 , H01M4/38 , H01M4/386 , H01M4/387 , H01M4/405 , H01M4/44 , H01M4/46 , H01M4/621 , H01M4/624 , H01M10/052 , H01M10/0525
摘要： An electrode composition that includes an electrode material consisting essentially of at least one electrochemically inactive elemental metal and at least one electrochemically active elemental metal in the form of an amorphous mixture at ambient temperature. The mixture remains amorphous when the electrode composition is incorporated into a lithium battery and cycled through at least one full charge-discharge cycle at ambient temperature.
摘要翻译：一种电极组合物，其包括在环境温度下基本上由至少一种电化学惰性元素金属和至少一种无定形混合物形式的电化学活性元素金属组成的电极材料。当电极组合物结合到锂电池中并在环境温度下循环至少一次完全充电 - 放电循环时，该混合物保持非晶态。

132. 发明授权

US06423419B1 Molybdenum-sulphur coatings 失效
标题翻译：钼硫涂层
公开(公告)号：US06423419B1
公开(公告)日：2002-07-23
申请号：US09165030
申请日：1998-10-02
申请人： Dennis Gerald Teer , Victor Bellido-Gonzalez , Joanne Helen Hampshire
发明人： Dennis Gerald Teer , Victor Bellido-Gonzalez , Joanne Helen Hampshire
IPC分类号： B32B1504
CPC分类号： C23C14/024 , C23C14/02 , C23C14/022 , C23C14/025 , C23C14/0623 , C23C14/34 , C23C14/564
摘要： An unbalanced magnetron sputter ion plating system has a first magnetron with a first target of metal sulphide (e.g. MoS2) and a second magnetron with a second target of metal (e.g. Titanium). In order to recover water and sulphur impurities from the surfaces of the coating chamber the metal target is energised in a pre-coating ion cleaning operation. The Titanium target remains energised during the deposition of the molybdenum-sulphur coating to produce a MoxTiySz coating where x+y≈1 and Z≈2. Best results are achieved if the Titanium content is about 18% or less by weight of the total coating content.
摘要翻译：不平衡磁控溅射离子电镀系统具有第一磁控管，其具有金属硫化物（例如MoS 2）的第一靶和具有第二金属靶（例如钛）的第二磁控管。为了从涂覆室的表面回收水和硫杂质，金属靶在预涂层离子清洗操作中被通电。在钼硫涂层的沉积过程中，钛靶保持通电，产生一个MoxTiySz涂层，其中x +y≈1和Z≈2。如果钛含量约占总涂层含量的18％或更少，则可获得最佳结果。

133. 发明授权

US06406601B1 Method and apparatus for coating electromagnetic wave shielding films 有权
标题翻译：涂敷电磁波屏蔽膜的方法和装置
公开(公告)号：US06406601B1
公开(公告)日：2002-06-18
申请号：US09696168
申请日：2000-10-26
申请人： Do-Gon Kim , Eung-Jik Lee , Dong-Won Kim , Won-Jong Lee , Youn-Seoung Lee
发明人： Do-Gon Kim , Eung-Jik Lee , Dong-Won Kim , Won-Jong Lee , Youn-Seoung Lee
IPC分类号： C23C1434
CPC分类号： C23C14/022 , C23C14/185 , C23C14/352 , C23C14/505
摘要： Disclosed is a method and an apparatus for coating electromagnetic wave shielding films, by which adhesive forces between coating objects and the electromagnetic wave shielding films are strengthened, and the films can be uniformly coated on the coating objects. In the method, surfaces of coating objects are etched, and then electromagnetic wave shielding films are coated on the surfaces of the coating objects. In the apparatus, a cylindrical rotating jig is disposed in a chamber and contains a plurality of coating objects loaded therein. The rotating jig is rotated at a predetermined speed. The rotating jig is put into and drawn out of the chamber. Targets functioning as cathodes are disposed inside and outside of the rotating jig. A controller controls operation of the apparatus.
摘要翻译：公开了一种用于涂覆电磁波屏蔽膜的方法和装置，通过该方法和装置，涂覆物体和电磁波屏蔽膜之间的粘合力被加强，并且膜可以均匀地涂覆在涂覆物体上。在该方法中，蚀刻涂覆物体的表面，然后将电磁波屏蔽膜涂覆在涂覆物体的表面上。在该装置中，圆筒形的旋转夹具设置在腔室中并且容纳有多个涂覆物体。旋转夹具以预定速度旋转。将旋转夹具放入室内并从腔室中抽出。作为阴极的靶被配置在旋转夹具的内部和外部。控制器控制设备的操作。

134. 发明申请

US20020049020A1 Water-vapor-permeable, watertight, and heat-reflecting flat composite, process for its manufacture, and use thereof 失效
标题翻译：透水性，水密性和热反射平的复合材料，其制造方法及其用途
公开(公告)号：US20020049020A1
公开(公告)日：2002-04-25
申请号：US09943148
申请日：2001-08-31
申请人： Sympatex Technologies GmbH
发明人： Henricus J.M. Van De Ven , Jozef C.W. Spijkers , Karl W. Kopp
IPC分类号： B05D003/00 , B05D005/00 , C23C014/02
CPC分类号： C23C14/20 , B32B27/12 , C23C14/022 , Y10T428/31551 , Y10T428/31565 , Y10T442/2139 , Y10T442/2484 , Y10T442/40 , Y10T442/475 , Y10T442/494 , Y10T442/655 , Y10T442/657 , Y10T442/674 , Y10T442/675
摘要： A water-vapor-permeable, watertight, heat-reflecting flat composite is made by a process of combining a metal layer and a nonporous, water-vapor-permeable, watertight, hydrophilic flat substrate. The process includes at least the three steps of (1) selecting the substrate, (2) pre-cleaning the substrate, and (3) applying the substrate to the metal layer. Such a composite offers protection from heat loss, infrared-based detection, ultraviolet radiation, electro-smog, and static electricity.
摘要翻译：通过将金属层和无孔的水蒸气可渗透的水密亲水平坦基底结合在一起的方法制成水蒸汽可渗透的水密的热反射平面复合材料。该方法至少包括以下三个步骤：（1）选择衬底，（2）预清洁衬底，和（3）将衬底施加到金属层。这种复合材料提供了防止热损失，基于红外的检测，紫外线辐射，电烟雾和静电的保护。

135. 发明授权

US06337004B1 High adhesion performance roll sputtered strike layer 失效
标题翻译：高粘附性能辊溅射冲击层
公开(公告)号：US06337004B1
公开(公告)日：2002-01-08
申请号：US08431203
申请日：1995-04-28
申请人： Kim Joseph Blackwell , Pei Cheh Chen , Frank Daniel Egitto , Allan Robert Knoll , George Joseph Matarese , Luis Jesus Matienzo
发明人： Kim Joseph Blackwell , Pei Cheh Chen , Frank Daniel Egitto , Allan Robert Knoll , George Joseph Matarese , Luis Jesus Matienzo
IPC分类号： C23C1434
CPC分类号： B29C59/14 , B29K2079/00 , C23C14/022 , C23C14/20 , H01L21/4846 , H01L21/4864 , H05K3/108 , H05K3/381 , H05K3/388 , H05K2201/0154 , H05K2203/085 , H05K2203/095
摘要： The adhesion of chromium-copper layer to polyimide has been greatly improved by a method which provides controlled reduction, rather than total elimination, of water content in the polyimide. The electronic packaging device which incorporates the flexible circuit prepared by the method exhibits greatly improved reliability. It is believed that the invention can be used to improve the adhesion between other organic materials having moisture affinity and materials comprising in-organics or between two organic materials.
摘要翻译：通过提供聚酰亚胺中水含量的控制减少而不是完全消除的方法，铬 - 铜层对聚酰亚胺的粘附性已大大提高。结合通过该方法制备的柔性电路的电子封装装置显着提高了可靠性。据信本发明可用于改善具有水分亲和性的其它有机材料与包含有机物的材料或两种有机材料之间的粘合性。

136. 发明授权

US06280844B1 Product produced by sequential ion implantation and deposition (SIID) technique 失效
标题翻译：通过顺序离子注入和沉积（SIID）技术生产的产品
公开(公告)号：US06280844B1
公开(公告)日：2001-08-28
申请号：US09148320
申请日：1998-09-04
申请人： Oleg Vesnovsky , Timmie Topoleski , Victor Pushnykh
发明人： Oleg Vesnovsky , Timmie Topoleski , Victor Pushnykh
IPC分类号： B32B904
CPC分类号： C23C14/5833 , C23C14/022 , C23C14/48 , Y10T428/12493 , Y10T428/31504 , Y10T428/31678
摘要： A surface of a substrate is vacuum coated with a material by sequentially implanting and depositing ions from a single ion source. First ions of the coating material are initially implanted into the surface of the substrate to form an implanted substrate layer. Next, second ions of the material are deposited on the implanted substrate layer to form a seed layer. Third ions of the material are then implanted into the seed layer to form an intermixed layer. Fourth ions of the material are deposited over the intermixed layer to form the coating over the substrate.
摘要翻译：通过从单个离子源顺序地注入和沉积离子，将衬底的表面真空涂覆在材料上。首先将涂层材料的第一离子注入到衬底的表面中以形成植入的衬底层。接下来，材料的第二离子沉积在注入的衬底层上以形成种子层。然后将材料的第三离子注入种子层以形成混合层。材料的第四离子沉积在混合层上，以在衬底上形成涂层。

137. 发明申请

US20010011634A1 The process of coating super-fine particles of multi-element thin film 失效
标题翻译：涂覆多元素薄膜超细颗粒的过程
公开(公告)号：US20010011634A1
公开(公告)日：2001-08-09
申请号：US09751690
申请日：2000-12-28
发明人： Chung-Lin Chou , Chen-Chun Hsu
IPC分类号： C23C014/32
CPC分类号： C23C14/325 , C23C14/022 , C23C14/0664
摘要： This invention provides a process for coating super fine ion particles of multiple elements on the surface of a micro router substrate, characteristics of which is that the coating step is operated under low temperatures and vacuums. First, raw micro routers are cleaned by electron beams under atmospheric pressures and room temperatures, then the raw micro routers are transferred into a vacuum environment, and increase the temperature of the environment. Next, the surface of the micro router is cleaned by ions, then proceed with the coating process. An arc source is used to bombard cations from a target, while a filtration net is used to get filtrate of small cation particles. Then, an ion assistant device is operated to further fine the filtrated particles, therefore only super fine ion particles are coated on the surface of the micro router substrates. The coated substance is super fine particle and has good adhesion to the micro router substrate, therefore cutting speed and wear-resistance of the coated micro router has increased, the cutting precision, and the life has also improved. This invention has short process time and successfully coats a thin film with good adhesion to a micro router substrate which can not be easily achieved by conventional technologies.
摘要翻译：本发明提供了一种在微路由器基板的表面上涂覆多个元件的超细离子颗粒的方法，其特征在于涂覆步骤在低温和真空下运行。首先，原子微路由器在大气压和室温下被电子束清洗，然后将原始微路由器转移到真空环境中，并增加环境温度。接下来，微型路由器的表面被离子清洗，然后进行涂覆处理。使用电弧源从靶中轰击阳离子，而使用过滤网来获得小阳离子颗粒的滤液。然后，操作离子辅助装置以进一步细化过滤的颗粒，因此在微路由器基板的表面上仅涂覆超细离子颗粒。涂层物质为超细颗粒，对微路由器基材具有良好的粘附性，因此涂层微型路由器的切割速度和耐磨性提高，切割精度和寿命也有所提高。本发明处理时间短，成功地涂覆了一种具有良好粘合性的薄膜，微型路由器基板不易于通过传统技术实现。

138. 发明授权

US06224724B1 Physical vapor processing of a surface with non-uniformity compensation 失效
标题翻译：具有不均匀补偿的表面物理蒸汽处理
公开(公告)号：US06224724B1
公开(公告)日：2001-05-01
申请号：US09119291
申请日：1998-07-20
申请人： Thomas J. Licata , Steven D. Hurwitt
发明人： Thomas J. Licata , Steven D. Hurwitt
IPC分类号： C23C1434
CPC分类号： H01J37/321 , C23C14/022 , C23C14/35 , H01J37/3402 , H01J37/3405 , H01J37/347 , H01L21/28556
摘要： An apparatus and method for compensating the process-related asymmetries produced in physical vapor processing of a surface. The apparatus and method may be used on either a substrate when sputtering material from a source or when using an ionized physical vapor deposition (IPVD) apparatus to either deposit a film onto or remove material from a substrate. A compensating magnet is configured and positioned to produce a compensating magnetic field. The compensating magnetic is positioned to offset the effects of chamber and process-related asymmetries, particularly those that affect the distribution of plasma processing on a substrate where the plasma has been otherwise symmetrically produced. Assymetries about an axis of the substrate, for example, are corrected, in, for example, systems such as sputter coating machines where a rotating magnet cathode or other such technique produces an initially symmetrical plasma. Asymmetrical non-uniformities in deposited films are reduced to an acceptable amount and substrates may be cleaned in situ prior to metallization.
摘要翻译：一种用于补偿在表面的物理蒸汽处理中产生的与工艺有关的不对称的装置和方法。当从源溅射材料时或者当使用离子化物理气相沉积（IPVD）装置将薄膜沉积在衬底上或从衬底移除材料时，该装置和方法可以用于衬底上。补偿磁体被配置和定位以产生补偿磁场。补偿磁性被定位以抵消室和工艺相关不对称性的影响，特别是影响等离子体对称地产生的衬底上的等离子体处理分布的影响。例如，在例如诸如溅射镀膜机的系统中校正关于衬底的轴线的部分，其中旋转磁体阴极或其它这样的技术产生初始对称的等离子体。沉积膜中的不对称不均匀性降低到可接受的量，并且可以在金属化之前原位清洁衬底。

139. 发明授权

US06187682B1 Inert plasma gas surface cleaning process performed insitu with physical vapor deposition (PVD) of a layer of material 失效
标题翻译：惰性等离子体气体表面清洁过程是用物理气相沉积（PVD）进行的
公开(公告)号：US06187682B1
公开(公告)日：2001-02-13
申请号：US09084276
申请日：1998-05-26
申请人： Dean J. Denning , Rama I. Hegde , Sam S. Garcia , Robert W. Fiordalice
发明人： Dean J. Denning , Rama I. Hegde , Sam S. Garcia , Robert W. Fiordalice
IPC分类号： H01L21311
CPC分类号： H01L21/76843 , C23C14/022 , C23C14/358 , H01L21/02046 , H01L21/28518 , H01L21/2855 , H01L21/31116 , H01L21/32136 , H01L21/32137 , H01L21/76804 , H01L21/76807 , H01L21/76814 , Y10S438/913
摘要： A method for insitu performing a cleaning operation along with a physical sputtering operation begins by placing a wafer (26) into a chamber (12). A plasma (30) is generated within the chamber (12) using an inert, noble, or reducing gas. The gas is ionized to form ions (32) within the plasma (30). Power is provided to various components (16, 22, and 24) within the chamber (12) to ensure that the ions (32) are accelerated towards the wafer (26) during first stages of wafer processing. This acceleration of the ions (32) towards the wafer (26) will clean a surface of the wafer (26). Following this cleaning operation, power supplied within the chamber (12) is altered to accelerate the ions (32) into a reverse direction so that the ions (32) impact a sputter target (20). Due to ionic bombardment of the target (20), a material is sputtered onto a clean surface of the wafer (26) in an insitu manner.
摘要翻译：将物理溅射操作连同执行清洁操作的方法开始于将晶片（26）放入室（12）中。使用惰性，贵重或还原气体在室（12）内产生等离子体（30）。气体被离子化以在等离子体（30）内形成离子（32）。功率被提供到腔室（12）内的各种部件（16,22和24），以确保离子（32）在晶片处理的第一阶段期间朝向晶片（26）加速。离子（32）朝向晶片（26）的加速将清洁晶片（26）的表面。在该清洁操作之后，改变在室（12）内供应的功率以将离子（32）加速到相反方向，使得离子（32）撞击溅射靶（20）。由于靶（20）的离子轰击，材料以本体的方式溅射到晶片（26）的清洁表面上。

140. 发明授权

US6162512A Process for modifying surfaces of nitride, and nitride having surfaces modified thereby 失效
标题翻译：用于修饰氮化物表面的方法和具有由其改性的表面的氮化物
公开(公告)号：US6162512A
公开(公告)日：2000-12-19
申请号：US839373
申请日：1997-04-18
申请人： Seok Keun Koh , Hyung Jin Jung , Won Kook Choi , Yong Bai Son
发明人： Seok Keun Koh , Hyung Jin Jung , Won Kook Choi , Yong Bai Son
IPC分类号： C08J7/00 , B01J19/00 , C01B21/072 , C03C21/00 , C04B35/581 , C04B41/00 , C04B41/51 , C04B41/52 , C04B41/80 , C04B41/88 , C04B41/89 , C23C14/02 , C23C14/18 , C23C14/20 , H01L23/373 , C23C14/08 , C23C14/06 , H05H1/00
CPC分类号： C04B41/009 , C04B41/0045 , C04B41/5127 , C04B41/52 , C04B41/80 , C04B41/88 , C04B41/89 , C23C14/022 , C23C14/185 , C23C14/20 , H01J2237/316 , C04B41/0027 , C04B41/4556 , C04B41/5031 , C04B41/4529 , C04B35/581
摘要： A process for modifying a nitride surface includes irradiating energized ion particles onto the nitride surface while blowing a reactive gas directly on the nitride surface under a vacuum condition. An aluminum nitride for a direct bond copper (DBC) can be obtained by forming a thin copper film on the thusly modified nitride.
摘要翻译：用于改变氮化物表面的方法包括在氮化物表面上照射通电离子颗粒，同时在真空条件下直接在氮化物表面上吹送反应性气体。通过在这样改性的氮化物上形成薄的铜膜，可以获得直接键合铜（DBC）的氮化铝。

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