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1. 发明申请

US20110127157A1 LOW IMPEDANCE PLASMA 有权
标题翻译：低阻抗等离子体
公开(公告)号：US20110127157A1
公开(公告)日：2011-06-02
申请号：US12673393
申请日：2008-08-14
申请人： Victor Bellido-Gonzalez
发明人： Victor Bellido-Gonzalez
IPC分类号： C23C14/35 , C23C14/06
CPC分类号： H01J37/3405 , H01J37/3452
摘要： A magnetron sputtering apparatus (100) comprising: a magnetic array arranged to create a magnetic field (103) in the vicinity of a tubular target (2) which target at least partially surrounds the magnetic array and acts as a cathode (2a); an anode (2b); the magnetic array being arranged to create an asymmetric plasma distribution with respect to the normal angle of incidence to a substrate (3); and means (1b) for enhancing the magnetic field to produce a relatively low impedance path for electrons flowing from the cathode (2a) to the anode (2b).
摘要翻译：磁控管溅射装置（100）包括：磁性阵列，被布置成在管状靶（2）附近产生磁场（103），所述磁场靶至少部分地围绕所述磁阵列并用作阴极（2a）; 阳极（2b）; 磁性阵列被布置成相对于基板（3）的法向入射角产生不对称等离子体分布; 以及用于增强磁场以产生从阴极（2a）流到阳极（2b）的电子的相对低阻抗路径的装置（1b）。

2. 发明授权

US09028660B2 Low impedance plasma 有权
标题翻译：低阻抗等离子体
公开(公告)号：US09028660B2
公开(公告)日：2015-05-12
申请号：US12673393
申请日：2008-08-14
申请人： Victor Bellido-Gonzalez
发明人： Victor Bellido-Gonzalez
IPC分类号： C23C14/35 , H01J37/34
CPC分类号： H01J37/3405 , H01J37/3452
摘要： A magnetron sputtering apparatus (100) comprising: a magnetic array arranged to create a magnetic field (103) in the vicinity of a tubular target (2) which target at least partially surrounds the magnetic array and acts as a cathode (2a); an anode (2b); the magnetic array being arranged to create an asymmetric plasma distribution with respect to the normal angle of incidence to a substrate (3); and means (1b) for enhancing the magnetic field to produce a relatively low impedance path for electrons flowing from the cathode (2a) to the anode (2b).
摘要翻译：磁控管溅射装置（100）包括：磁性阵列，被布置成在管状靶（2）附近产生磁场（103），所述磁场靶至少部分地围绕所述磁阵列并用作阴极（2a）; 阳极（2b）; 磁性阵列被布置成相对于基板（3）的法向入射角产生不对称等离子体分布; 以及用于增强磁场以产生从阴极（2a）流到阳极（2b）的电子的相对低阻抗路径的装置（1b）。

3. 发明申请

US20050034980A1 Magnetron sputtering device 审中-公开
标题翻译：磁控溅射装置
公开(公告)号：US20050034980A1
公开(公告)日：2005-02-17
申请号：US10494973
申请日：2002-11-07
申请人： Dermot Monaghan , Victor Bellido-Gonzalez
发明人： Dermot Monaghan , Victor Bellido-Gonzalez
IPC分类号： C23C14/34 , C23C14/35 , H01J37/32 , H01J37/34 , C23C14/00
CPC分类号： H01J37/3429 , C23C14/352 , H01J37/3405 , H01J37/3426
摘要： A target arrangement for use within a vacuum sputtering zone comprising: a primary target (1) comprising material to be sputtered and an auxiliary target (2) of ferromagnetic material, the targets being located relative to one another such that upon application of a magnetic field across the surface of the targets, the magnetic field over the primary target is confined into an area of high homogeneous magnetic field strength substantially parallel to the surface of the primary target, to achieve uniform erosion across said area of target during sputtering. Preferably the primary target and auxiliary target are spaced apart by a gap (12), to enhance the confinement of magnetic field. The auxiliary target may have a surface which is raised beyond a surface of the primary target. The primary target may be of ferromagnetic or non-magnetic material.
摘要翻译：一种在真空溅射区内使用的目标装置，包括：主要靶（1），其包括要溅射的材料和铁磁材料的辅助靶（2），所述靶相对于彼此定位，使得在施加磁场在靶的表面上，主要目标上的磁场被限制在基本上平行于主要靶的表面的高均匀磁场强度的区域中，以在溅射期间在靶的所有区域上实现均匀的侵蚀。优选地，主要靶材和辅助靶材由间隙（12）间隔开，以增强磁场的限制。辅助靶可以具有升高超过主要靶的表面的表面。主要靶材可以是铁磁性或非磁性材料。

4. 发明授权

US06551718B2 Low friction coating 失效
标题翻译：低摩擦涂层
公开(公告)号：US06551718B2
公开(公告)日：2003-04-22
申请号：US09319826
申请日：1999-06-11
申请人： Victor Bellido-Gonzalez
发明人： Victor Bellido-Gonzalez
IPC分类号： B32B1504
CPC分类号： C23C14/0623 , C23C14/06 , C23C16/30 , Y10T428/31678
摘要： Disclosed is a metal sulphide coating composition of the formula MXSiVRYSZFW where M is one or more metals selected from: Mo, Ti, W, Nb, Ta, Zr, and Hf; Si is silicon; R is one or more elements selected from: C, B, Al, V, Cr, Fe, Co, Ni, Sm, Au, Cu, Zn, Sn, Pb, N, H, and O; S is sulphur; F is fluorine; X is 0.2 to 1.5; V is 0.02 to 3; Y is 0 to 4; Z is 0.2 to 6; and W is 0.01 to 6, and in which X, Y, Z, V, and W are given in amounts by atomic ratio. The compositions show good non-stick properties, low hydrophilia, and high stability.
摘要翻译：公开了式MXSiVRYSZFW的金属硫化物涂料组合物，其中M是选自Mo，Ti，W，Nb，Ta，Zr和Hf中的一种或多种金属; 硅是硅; R是选自C，B，Al，V，Cr，Fe，Co，Ni，Sm，Au，Cu，Zn，Sn，Pb，N，H和O中的一种或多种元素; S是硫; F是氟; X为0.2〜1.5; V为0.02〜3; Y为0〜4; Z为0.2〜6; W为0.01〜6，X，Y，Z，V，W的原子比为原子数。组合物显示出良好的不粘性，低亲水性和高稳定性。

5. 发明授权

US06423419B1 Molybdenum-sulphur coatings 失效
标题翻译：钼硫涂层
公开(公告)号：US06423419B1
公开(公告)日：2002-07-23
申请号：US09165030
申请日：1998-10-02
申请人： Dennis Gerald Teer , Victor Bellido-Gonzalez , Joanne Helen Hampshire
发明人： Dennis Gerald Teer , Victor Bellido-Gonzalez , Joanne Helen Hampshire
IPC分类号： B32B1504
CPC分类号： C23C14/024 , C23C14/02 , C23C14/022 , C23C14/025 , C23C14/0623 , C23C14/34 , C23C14/564
摘要： An unbalanced magnetron sputter ion plating system has a first magnetron with a first target of metal sulphide (e.g. MoS2) and a second magnetron with a second target of metal (e.g. Titanium). In order to recover water and sulphur impurities from the surfaces of the coating chamber the metal target is energised in a pre-coating ion cleaning operation. The Titanium target remains energised during the deposition of the molybdenum-sulphur coating to produce a MoxTiySz coating where x+y≈1 and Z≈2. Best results are achieved if the Titanium content is about 18% or less by weight of the total coating content.
摘要翻译：不平衡磁控溅射离子电镀系统具有第一磁控管，其具有金属硫化物（例如MoS 2）的第一靶和具有第二金属靶（例如钛）的第二磁控管。为了从涂覆室的表面回收水和硫杂质，金属靶在预涂层离子清洗操作中被通电。在钼硫涂层的沉积过程中，钛靶保持通电，产生一个MoxTiySz涂层，其中x +y≈1和Z≈2。如果钛含量约占总涂层含量的18％或更少，则可获得最佳结果。

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