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1. 发明申请

US20160067996A1 METHOD FOR FORMING PATTERN ON SURFACE OF INSULATING SUBSTRATE AND CERAMIC ARTICLE 审中-公开
标题翻译：在绝缘基材和陶瓷制品表面形成图案的方法
公开(公告)号：US20160067996A1
公开(公告)日：2016-03-10
申请号：US14943808
申请日：2015-11-17
申请人： BYD COMPANY LIMITED
发明人： Qiang XU , Xinping LIN
IPC分类号： B41M5/26 , B41M5/24 , C23C14/35
CPC分类号： B41M5/262 , B41M5/24 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/80 , C23C14/35 , C23C18/1608 , C23C18/1612 , C23C18/1868 , C23C18/38 , H05K1/0269 , H05K1/0306 , H05K3/027 , C04B35/10 , C04B35/48 , C04B41/4529 , C04B41/455 , C04B41/5049 , C04B41/5042 , C04B41/505 , C04B41/0036 , C04B41/4541 , C04B41/5127 , C04B41/5144 , C04B41/4564 , C04B41/522
摘要： Embodiments of the present disclosure are directed to a method for forming a pattern on a surface of an insulating substrate and/or a ceramic article. The method comprises: forming a film on at least one surface of the insulating substrate, a material of the film comprising at least one of ZnO, SnO2, TiO2, or a combination thereof; and irradiating at least a part of the film by an energy beam to form the pattern in the film.
摘要翻译：本公开的实施例涉及在绝缘基板和/或陶瓷制品的表面上形成图案的方法。所述方法包括：在所述绝缘基板的至少一个表面上形成膜，所述膜的材料包含ZnO，SnO 2，TiO 2或其组合中的至少一种; 以及通过能量束照射所述膜的至少一部分以在所述膜中形成图案。

2. 发明申请

US20140284088A1 CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME 有权
标题翻译：电路板和电子设备提供
公开(公告)号：US20140284088A1
公开(公告)日：2014-09-25
申请号：US14354600
申请日：2012-09-28
申请人： KYOCERA Corporation
发明人： Kiyotaka Nakamura , Yoshio Ohashi , Kunihide Shikata
IPC分类号： H05K1/09
CPC分类号： H05K1/09 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00405 , C04B2111/00844 , H01L23/15 , H01L23/3731 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H05K1/0306 , H05K1/092 , H05K3/245 , H05K3/38 , H05K2201/0269 , H05K2201/0338 , H05K2201/035 , H05K2203/1126 , C04B35/00 , C04B35/10 , C04B35/185 , C04B35/48 , C04B35/581 , C04B35/584 , C04B41/4539 , C04B41/4572 , C04B41/5022 , C04B41/5127 , C04B41/5116 , C04B41/522 , C04B41/5155 , H01L2924/00
摘要： A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12a is smaller than the average grain size in the second region 12b.
摘要翻译：电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主表面接触且包含玻璃的第一区域12a 第一区域12a和第二区域12b位于第一区域12a上并且不包含玻璃成分，第一区域12a的厚度为金属布线层12的厚度的35％以上且70％以下，并且第一区域12a中的平均晶粒尺寸小于第二区域12b中的平均晶粒尺寸。

3. 发明授权

US08609206B2 Continuous or discrete metallization layer on a ceramic substrate 有权
标题翻译：陶瓷衬底上的连续或分立的金属化层
公开(公告)号：US08609206B2
公开(公告)日：2013-12-17
申请号：US12990595
申请日：2009-04-30
申请人： Maxim Seleznev
发明人： Maxim Seleznev
IPC分类号： C23C14/14 , C23C16/00 , B05D5/06 , B05B3/00 , H05B6/02 , F27B14/00 , C21D5/00 , C21D9/00
CPC分类号： C04B37/026 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , C04B2235/6565 , C04B2235/96 , C04B2237/124 , C04B2237/366 , C04B2237/407 , C04B2237/54 , C04B2237/706 , H01L21/4846 , H01L23/3735 , H01L2924/0002 , H01L2924/09701 , C04B41/4519 , C04B41/4556 , C04B41/5031 , C04B41/0072 , C04B41/4529 , C04B41/4572 , C04B41/5127 , C04B41/4539 , C04B35/581 , H01L2924/00
摘要： Surface metallization technology for ceramic substrates is disclosed herein. It makes use of a known phenomenon that many metal—metal oxide alloys in liquid state readily wet an oxide ceramic surface and strongly bond to it upon solidification. To achieve high adhesion strength of a metallization to ceramic, a discrete metallization layer consisting of metal droplets bonded to ceramic surface using metal—metal oxide bonding process is produced first. Next, a continuous metal layer is deposited on top of the discrete layer and bonded to it using a sintering process. As a result a strongly adhering, glass-free metallization layer directly bonded to ceramic surface is produced. In particular, the process can be successfully used to metalize aluminum nitride ceramic with high thermal and electrical conductivity copper metal.
摘要翻译：本文公开了陶瓷基板的表面金属化技术。它利用已知的现象，许多液态金属 - 金属氧化物合金容易地润湿氧化物陶瓷表面，并在凝固时与其牢固地结合。为了实现金属化对陶瓷的高粘合强度，首先制造了使用金属 - 金属氧化物结合工艺由金属液滴结合到陶瓷表面上的离散金属化层。接下来，连续金属层沉积在离散层的顶部上并且使用烧结工艺与其结合。结果，产生直接粘合到陶瓷表面上的强烈粘附的无玻璃的金属化层。特别地，该方法可以成功地用于金属化具有高导热和导电性的铜金属的氮化铝陶瓷。

4. 发明申请

US20130001475A1 MATERIAL COMPOSITION, METHOD OF PRODUCING THE COMPOSITION, AND OXIDATION-PROTECTED MANUFACTURE 审中-公开
标题翻译：材料组合物，生产组合物的方法和氧化保护制造
公开(公告)号：US20130001475A1
公开(公告)日：2013-01-03
申请号：US13616232
申请日：2012-09-14
申请人： MARTIN CHRIST , SANDRA KÖHLER , FLORIAN GOJNY , RAINER SCHMITT , OSWIN ÖTTINGER
发明人： MARTIN CHRIST , SANDRA KÖHLER , FLORIAN GOJNY , RAINER SCHMITT , OSWIN ÖTTINGER
IPC分类号： C09D1/00 , B32B37/24 , C09D171/10 , F16J15/06 , C09J1/00 , C09J171/10 , H01B1/00 , C04B35/622 , C08K5/05
CPC分类号： C04B35/536 , B32B18/00 , C04B35/522 , C04B35/532 , C04B35/803 , C04B35/806 , C04B37/008 , C04B41/009 , C04B41/5001 , C04B41/5127 , C04B41/85 , C04B41/88 , C04B2235/3217 , C04B2235/3232 , C04B2235/3244 , C04B2235/3284 , C04B2235/3409 , C04B2235/36 , C04B2235/3804 , C04B2235/3813 , C04B2235/3821 , C04B2235/3826 , C04B2235/386 , C04B2235/3873 , C04B2235/407 , C04B2235/425 , C04B2235/428 , C04B2235/447 , C04B2235/5248 , C04B2235/5436 , C04B2235/9684 , C04B2237/363 , C04B2237/76 , F16J15/102 , F16L23/22 , F16L58/14 , C04B41/4539 , C04B41/507 , C04B41/5096
摘要： A material composition is formed with a carrier component and an additive component. The additive component has one or more ceramic additives. The carrier component and the additive component are present in a ratio by volume in the range from approximately 1:9 to approximately 7:3, preferably in the range from approximately 1:4 to approximately 2:1. More particularly, they are present in a ratio of approximately 1:1. The material composition may be formed as a foil or as a liquid, viscous, paste or gel material. The material composition may be used, inter alia, as oxidation protection and as a sealing element.
摘要翻译：材料组合物由载体组分和添加剂组分形成。添加剂组分具有一种或多种陶瓷添加剂。载体组分和添加剂组分以体积比在约1:9至约7:3的范围内，优选在约1:4至约2:1的范围内存在。更具体地，它们以约1:1的比例存在。材料组合物可以形成为箔或液体，粘性，糊状或凝胶材料。该材料组合物尤其可用作氧化保护剂和密封元件。

5. 发明申请

US20100260988A1 Metal-Ceramic Substrate 失效
标题翻译：金属陶瓷基板
公开(公告)号：US20100260988A1
公开(公告)日：2010-10-14
申请号：US11990179
申请日：2006-06-02
申请人： Jürgen Schulz-Harder
发明人： Jürgen Schulz-Harder
IPC分类号： C04B37/02 , B32B18/00 , B32B15/04 , B32B7/02 , C04B35/622 , C04B37/00
CPC分类号： H05K1/0306 , C04B37/021 , C04B37/025 , C04B37/026 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , C04B2235/96 , C04B2235/9607 , C04B2237/062 , C04B2237/064 , C04B2237/124 , C04B2237/368 , C04B2237/407 , C04B2237/58 , C04B2237/704 , C04B2237/706 , C04B2237/708 , H01L23/3735 , H01L2924/0002 , H05K3/38 , H05K2201/0195 , H05K2201/0355 , H05K2201/068 , Y10T428/2495 , Y10T428/26 , Y10T428/265 , Y10T428/266 , C04B41/4535 , C04B41/5037 , C04B41/5024 , C04B41/522 , C04B41/4501 , C04B41/5127 , C04B35/584 , H01L2924/00
摘要： In the case of a metal-ceramic substrate with a multilayered ceramic material in sheet form, and with at least one metallization that is provided on one surface side of the ceramic material and is joined to be ceramic material by direct bonding or active soldering, the ceramic material has at least one inner layer or base layer of a silicon nitride ceramic. The surface side of the ceramic material that is provided with the at least one metallization is formed by an intermediate layer of an oxidic ceramic applied to the base layer.
摘要翻译：在具有片状多层陶瓷材料的金属陶瓷基板的情况下，并且在陶瓷材料的一个表面侧具有至少一个金属化，并且通过直接接合或主动焊接而与陶瓷材料接合，陶瓷材料具有至少一个氮化硅陶瓷的内层或基层。设置有至少一个金属化的陶瓷材料的表面侧由施加到基底层的氧化陶瓷的中间层形成。

6. 发明申请

US20100237037A1 Ceramic substrate metalization process 审中-公开
标题翻译：陶瓷基板金属化工艺
公开(公告)号：US20100237037A1
公开(公告)日：2010-09-23
申请号：US12461279
申请日：2009-08-06
申请人： Wen-Hsin Lin , Chi-Jen Liu
发明人： Wen-Hsin Lin , Chi-Jen Liu
IPC分类号： B44C1/22 , B05D1/04
CPC分类号： C04B41/89 , C04B41/009 , C04B41/52 , C04B2111/00844 , H01L21/4867 , H01L23/15 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/146 , H05K3/16 , H05K3/38 , H05K3/381 , H05K2203/09 , C04B41/4549 , C04B2103/402 , C04B41/4572 , C04B41/5096 , C04B41/5133 , C04B41/5144 , C04B41/5127 , C04B41/5111 , C04B35/00 , H01L2924/00
摘要： A ceramic substrate metallization process for making a ceramic circuit substrate practically in an economic way by means of: washing a non-charged ceramic substrate and roughening the surface of the ceramic substrate by etching, and then coating a negatively charged (or positively charged), silicon-contained, nanoscaled surface active agent on the ceramic substrate, and then coating a positively charged (or negatively charged) first metal layer on the ceramic substrate.
摘要翻译：一种用于通过以下方法实现陶瓷电路衬底的制造陶瓷衬底金属化方法：通过蚀刻来洗涤未充电的陶瓷衬底和粗糙化陶瓷衬底的表面，然后涂覆带负电荷（或带正电荷的）含硅的纳米尺度的表面活性剂，然后在陶瓷衬底上涂覆带正电（或带负电荷的）第一金属层。

7. 发明申请

US20100143690A1 PRODUCTION OF COMPOSITE MATERIALS WITH HIGH THERMAL CONDUCTIVITY 审中-公开
标题翻译：生产具有高导热性的复合材料
公开(公告)号：US20100143690A1
公开(公告)日：2010-06-10
申请号：US12514002
申请日：2008-03-14
申请人： Francisco Javier Narciso Romero , Richard Prieto Alfonzo , Enrique Louis Cereceda , Jose Miguel Molina Jorda
发明人： Francisco Javier Narciso Romero , Richard Prieto Alfonzo , Enrique Louis Cereceda , Jose Miguel Molina Jorda
IPC分类号： B32B5/16 , B22D19/14 , B32B15/04
CPC分类号： H01L23/373 , C04B41/009 , C04B41/5116 , C04B41/5127 , C04B41/5155 , C04B41/88 , C04B2111/00844 , C22C1/05 , C22C1/1036 , C22C5/00 , C22C9/00 , C22C21/00 , C22C32/0084 , C22C47/08 , H01L23/3733 , H01L23/3736 , H01L2924/0002 , Y10T428/249927 , Y10T428/25 , C04B41/4521 , C04B41/4523 , C04B41/5096 , C04B41/5133 , C04B35/565 , C04B35/52 , C04B14/386 , C04B38/00 , H01L2924/00
摘要： “Disclosed is high thermal conductivity materials used as heat dissipaters in microelectronic and optoelectronic devices and power generators. Also disclosed is development of composite materials with high thermal performance and low production costs for use in semiconductor devices as heat dissipaters and a process for producing this material. The materials have a thermal conductivity above 200 Wm−1K−1 and a coefficient of thermal expansion in the range of 2 to 10×10−6K−1 (measured in the temperature range of 20 to 300° C. in at least two directions). The composite material is constituted in three phases: a phase consisting mainly of graphite flakes; a phase comprising particles or fibers of a flake separating material, selected from a ceramic material (such as SiC, BN, AlN, TiB2 and diamond) and carbon fibers, of high thermal performance in at least one direction; and a phase consisting of a metal alloy.”
摘要翻译： “公开了用作微电子和光电子器件和发电机中的散热器的高热导率材料。还公开了开发具有高热性能和低生产成本的复合材料，用于作为散热器的半导体器件和用于生产该材料的方法。该材料具有高于200Wm-1K-1的热导率和2至10×10-6K-1范围内的热膨胀系数（在至少两个方向上在20至300℃的温度范围内测量））。复合材料分为三个阶段：主要由石墨薄片组成的相; 选自在至少一个方向上具有高热性能的陶瓷材料（例如SiC，BN，AlN，TiB 2和金刚石）和碳纤维的片状分离材料的颗粒或纤维的相; 和由金属合金组成的相“。

8. 发明申请

US20100136248A1 METHOD OF MANUFACTURING AND PROCESSING SILICON CARBIDE SCANNING AND OPTICAL MIRRORS 审中-公开
标题翻译：制造和加工碳化硅扫描和光学镜像的方法
公开(公告)号：US20100136248A1
公开(公告)日：2010-06-03
申请号：US11993702
申请日：2007-10-30
申请人： Stephen Hastings
发明人： Stephen Hastings
IPC分类号： C23C4/00 , C23C4/10 , C23C4/18 , C23C4/02 , G02B5/08
CPC分类号： C04B41/5096 , C04B41/009 , C04B41/5035 , C04B41/5127 , C04B41/5155 , C04B41/52 , C04B41/85 , C04B41/89 , C04B2111/80 , G02B5/08 , C04B41/4527 , C04B41/53 , C04B35/565
摘要： The invention relates to a method of Silicon Carbide scanning or optical mirror production. In order to reduce the costs for manufacturing a scanning or optical mirror, according to the present invention, Silicon Carbide powder is pressed or stamped or isostatically pressed using an engineered stamp or tool to form the shape and structure of a scanning or optical mirror which is then in this embodiment sintered to provide a surface that will become the face surface of said scanning or optical mirror that is then coated or bonded with a suitably thick layer of in this embodiment Silicon material deposited by a thermal spray process onto said face surface of said scanning or optical mirror that is then polished to achieve the desired surface quality and/or roughness and/or flatness and then optical coated using coating technologies and materials to coat said face surface that will then become the reflective surface with suitable high reflective optical coatings specific to the wavelength or wavelengths that the finished Silicon Carbide scanning or optical mirrors will be used to reflect in final application/s.
摘要翻译：本发明涉及一种碳化硅扫描方法或光学镜的制造方法。为了降低制造扫描或光学镜的成本，根据本发明，使用工程印刷或工具对碳化硅粉末进行压制或冲压或等压或压制，以形成扫描或光学镜的形状和结构，然后在该实施例中烧结以提供将成为所述扫描或光学反射镜的表面的表面，然后在该实施例中用合适厚度的层涂覆或粘合通过热喷涂工艺沉积的硅材料到所述的所述表面上扫描或光学镜，其然后被抛光以实现期望的表面质量和/或粗糙度和/或平坦度，然后使用涂覆技术和材料进行光学涂层以涂覆所述表面，然后将成为具有合适的高反射光学涂层的反射表面达到将使用成品碳化硅扫描或光学镜的波长或波长t o反映在最终申请中。

9. 发明申请

US20090092823A1 Braze-metal coated articles and process for making same 审中-公开
标题翻译：钎焊金属涂层制品及其制造方法
公开(公告)号：US20090092823A1
公开(公告)日：2009-04-09
申请号：US12287123
申请日：2008-10-06
申请人： Steven W. Webb , Gaurav Aggarwal
发明人： Steven W. Webb , Gaurav Aggarwal
IPC分类号： B32B15/04 , B05D3/00 , B32B5/16
CPC分类号： B23K1/20 , B23K1/0008 , B23K2101/002 , B23K2101/20 , C04B37/006 , C04B41/009 , C04B41/5127 , C04B41/52 , C04B41/88 , C04B41/90 , C04B2237/12 , C04B2237/124 , C04B2237/361 , C23C4/12 , C23C24/04 , Y10T428/25 , Y10T428/31678 , C04B41/4527 , C04B41/5057 , C04B41/5144 , C04B41/515 , C04B41/5161 , C04B41/53 , C04B35/52 , C04B35/5831
摘要： In one embodiment, a carbide-containing article includes a carbide body with an attached optional superabrasive layer. A braze metal coating is attached to a surface the carbide substrate. The coating primarily is made of particles of a metal having a melting point of less than 1200° C., the particles having a size of less than 0.1 mm. In another embodiment, a process for applying a braze metal coating to a carbide body of a superabrasive or other article includes depositing finely divided particles of a low melting point metal onto the carbide body by spraying the particles and gas onto the body at a velocity that is between 500 km/sec and 2 km/sec, with volumetric delivery of the particles being less than 50 grams per minute.
摘要翻译：在一个实施例中，含碳化物的制品包括具有附接的可选超研磨层的碳化物本体。钎焊金属涂层附着在碳化物基体的表面上。涂层主要由熔点小于1200℃的金属颗粒制成，颗粒的尺寸小于0.1mm。在另一个实施例中，将钎焊金属涂层施加到超级磨料或其它制品的碳化物体的方法包括将低熔点金属的细碎颗粒沉积到碳化物本体上，方法是将颗粒和气体以在500公里/秒和2公里/秒之间，颗粒的体积输送小于每分钟50克。

10. 发明申请

US20090020321A1 METAL-CERAMIC SUBSTRATE 有权
标题翻译：金属陶瓷基板
公开(公告)号：US20090020321A1
公开(公告)日：2009-01-22
申请号：US12086695
申请日：2006-08-22
申请人： Jurgen Schulz-Harder
发明人： Jurgen Schulz-Harder
IPC分类号： H05K1/09 , H05K3/10
CPC分类号： C04B41/90 , B32B2311/12 , C04B37/025 , C04B37/026 , C04B41/009 , C04B41/52 , C04B2111/00844 , C04B2237/062 , C04B2237/064 , C04B2237/124 , C04B2237/368 , C04B2237/407 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/06 , H05K3/38 , H05K2201/0195 , H05K2201/0355 , Y10T29/49128 , Y10T29/49155 , Y10T29/49204 , C04B41/0072 , C04B41/4556 , C04B41/5031 , C04B41/5035 , C04B41/522 , C04B41/4535 , C04B41/5037 , C04B41/5024 , C04B41/4523 , C04B41/4558 , C04B41/4572 , C04B41/5116 , C04B41/5127 , C04B41/5133 , C04B41/4501 , C04B35/584 , C04B35/581 , H01L2924/00
摘要： In the case of a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material which includes a base substrate made of an aluminum-nitride or silicon-nitride ceramic and to which the metallization is applied by active soldering before patterning, an intermediate layer made of an oxidic ceramic is provided between the at least one metallization and the base substrate.
摘要翻译：在具有至少一种金属化的金属陶瓷衬底的情况下，通过蚀刻图案化，在包括由氮化铝或氮化硅陶瓷制成的基底衬底的层状陶瓷材料的至少一个表面侧上，在图案化之前通过主动焊接施加金属化，在至少一个金属化和基底之间设置由氧化陶瓷制成的中间层。

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