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121. 发明授权

US4115157A Organic welding flax composition 失效
标题翻译：有机焊亚麻组成
公开(公告)号：US4115157A
公开(公告)日：1978-09-19
申请号：US771680
申请日：1977-02-24
申请人： Marvin Packer
发明人： Marvin Packer
IPC分类号： B23K35/36 , H05K3/28 , H05K3/30 , H05K3/34 , B23K35/34
CPC分类号： B23K35/3612 , H05K3/305 , H05K3/306 , H05K2203/0769 , H05K2203/0786 , H05K3/282 , H05K3/3447 , Y02P70/613
摘要： Components can be held down on a printed circuit board without lead clinching by applying a non-flowing, water soluble mixture containing a polyalkylene glycol, a starch filler and a nonionic surface active agent over the components to keep them in place during soldering operations. The mixture can be completely removed after soldering by a water rinse.
摘要翻译：组件可以通过在组件上施加含有聚亚烷基二醇，淀粉填料和非离子表面活性剂的不流动的水溶性混合物，在焊接操作期间将它们保持在适当的位置，将印刷电路板压在印刷电路板上。混合物在用水冲洗后焊接后可以完全除去。

122. 发明授权

US3981761A Process for manufacturing printed substrates and decalcomania compositions used therefor 失效
标题翻译：用于制造用于其的印刷基板和decalcomania组合物的制造方法
公开(公告)号：US3981761A
公开(公告)日：1976-09-21
申请号：US392001
申请日：1973-08-27
申请人： Yasuhiro Kojima , Niiti Matunaga , Motoki Nawa
发明人： Yasuhiro Kojima , Niiti Matunaga , Motoki Nawa
IPC分类号： B44C1/16 , B41M3/12 , B44C1/175 , C04B41/86 , H05K1/00 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/20 , H05K3/28 , B32B7/04
CPC分类号： H05K3/207 , B41M3/12 , B44C1/175 , H05K1/0284 , H05K1/167 , H05K1/0306 , H05K1/092 , H05K2201/0284 , H05K2203/0531 , H05K2203/0786 , H05K3/28 , Y10S428/901 , Y10S428/914
摘要： A process for the manufacture of printed substrates and decalcomania compositions used therefor comprising a permeable backing paper, water-soluble binder, printed pattern such as hybrid or monolithic circuit, and removable cover coat, these components being laminated one upon another.
摘要翻译：用于制造用于其的印刷基材和decalcomania组合物的方法包括可渗透的背纸，水溶性粘合剂，诸如混合或单片电路的印刷图案和可移除的覆盖层，这些组分彼此层压。

123. 发明授权

US3931454A Printed circuit board and method of preparing it 失效
标题翻译：印刷电路板及其制备方法
公开(公告)号：US3931454A
公开(公告)日：1976-01-06
申请号：US298213
申请日：1972-10-17
申请人： Gerhard R. Sprengling
发明人： Gerhard R. Sprengling
IPC分类号： B32B15/04 , B32B15/08 , H01L23/28 , H05K3/28 , H05K3/34 , H05K5/00 , H05K1/18
CPC分类号： H05K3/285 , H05K2203/0769 , H05K2203/0786 , H05K2203/176 , H05K3/282 , Y10T29/49146
摘要： A printed circuit board is prepared by connecting electronic components to the circuit, coating the board with a layer up to about 0.1 mil thick of a compound of the formula C.sub.n F.sub.2n.sub.+1 C.sub.m X.sub.2m.CHY--OOC--C(R)=CH.sub.2 or its prepolymer, replacing at least one of the electronic components, thermally bonding another electronic component to the circuit, and recoating the area around the new component with a layer of the compound or its prepolymer. In the formula n is 2 to 9, m is 1 to 9, X and Y are H, F Cl, or Br and R is --H or --CH.sub.3. This method enables a printed circuit board to be easily repaired since the coating on the board can be soldered or welded through without first removing the coating or protecting the surrounding coating.
摘要翻译：通过将电子元件连接到电路来制备印刷电路板，用高达约0.1密耳厚的式CnF2n + 1CmX2m.CHY-OOC-C（R）= CH2或其预聚物的化合物涂覆该板，替换电子部件中的至少一个，将另一个电子部件热粘合到电路上，并用化合物或其预聚物层覆盖新部件周围的区域。式中，n为2至9，m为1至9，X和Y为H，F Cl或Br，R为-H或-CH 3。这种方法使得能够容易地修复印刷电路板，因为可以焊接或焊接板上的涂层而不首先去除涂层或保护周围涂层。

124. 发明授权

US3804689A Process for removing copper films from substrates 失效
标题翻译：从基板上去除铜膜的工艺
公开(公告)号：US3804689A
公开(公告)日：1974-04-16
申请号：US20476871
申请日：1971-12-03
申请人： NCR
发明人： O CONNOR J
IPC分类号： H05K1/00 , H05K3/02 , H05K3/10 , H05K3/38 , B32B35/00
CPC分类号： H05K3/025 , H05K1/0393 , H05K3/105 , H05K3/386 , H05K2201/0317 , H05K2203/016 , H05K2203/0315 , H05K2203/0786 , H05K2203/1157 , H05K2203/125
摘要： A medium substantially free of copper oxide having a thin, electrically conductive copper film thereon is disclosed. The copper film or circuit is developed on copper oxide surfaces. The copper film then is contacted with dilute hydrofluoric acid. After washing and drying, the copper film is contacted with the adhesive surface of a medium substantially free of copper oxide. The medium is removed from the copper oxide surface with the copper film adhered to the adhesive surface intact. This medium can be used in electronic displays, microrecording and microcircuitry.
摘要翻译：公开了一种基本上不含氧化铜的介质，其上具有薄的导电铜膜。铜膜或电路在铜氧化物表面上显影。然后将铜膜与稀氢氟酸接触。洗涤和干燥后，铜膜与基本上不含氧化铜的介质的粘合剂表面接触。介质从铜氧化物表面去除，铜膜完全粘附在粘合剂表面上。该介质可用于电子显示器，微型记录和微电路。

125. 发明授权

US3729819A Method and device for fabricating printed wiring or the like 失效
标题翻译：用于制作印刷线或类似物的方法和装置
公开(公告)号：US3729819A
公开(公告)日：1973-05-01
申请号：US3729819D
申请日：1970-01-09
申请人： NIPPON TOKI KK
发明人： HORIE I
IPC分类号： H05K1/03 , H05K1/09 , H05K1/16 , H05K3/20 , H05K3/40 , B41M3/08
CPC分类号： H05K3/207 , H05K1/0306 , H05K1/092 , H05K1/16 , H05K3/403 , H05K2201/0284 , H05K2203/0531 , H05K2203/0786 , Y10T29/49155
摘要： A transfer device comprises a base layer of paper or the like, an adhesive layer attached to said base layer directly or by means of a thin paper, a conductive pattern or circuit element pattern printed on said adhesive layer and, further, a carrier layer over said pattern. Printed wiring, integrated circuits or the like are fabricated by printing a circuit pattern on the base layer and covering same with the carrier layer, removing the base layer and mounting the circuit pattern and carrier layer on a substrate.
摘要翻译：转印装置包括纸层等的基层，直接或通过薄纸附着到所述基底层的粘合剂层，印刷在所述粘合剂层上的导电图案或电路元件图案，以及另外的载体层说模式。印刷布线，集成电路等通过在基底层上印刷电路图案并与载体层相同的方式制造，除去基底层并将电路图案和载体层安装在基底上。

126. 发明申请

US20170164482A1 Transient Electronic Devices Comprising Inorganic or Hybrid Inorganic and Organic Substrates and Encapsulates 审中-公开
公开(公告)号：US20170164482A1
公开(公告)日：2017-06-08
申请号：US15351234
申请日：2016-11-14
申请人： The Board of Trustees of the University of Illinois
发明人： John A. ROGERS , Seung-Kyun KANG , SukWon HWANG , Jianjun CHENG , Yanfeng ZHANG , Hanze YING
IPC分类号： H05K1/18 , H05K3/28 , H05K1/03 , H01L25/065 , A61B5/00 , H01L23/29 , H01L23/498 , H01L21/56 , H01L21/02 , H01L21/311 , G06K19/077 , H01L23/31
CPC分类号： H05K1/185 , A61B5/686 , A61B2562/125 , A61M5/44 , G06K19/0775 , H01L21/02164 , H01L21/0217 , H01L21/02274 , H01L21/0228 , H01L21/31111 , H01L21/31133 , H01L21/56 , H01L23/291 , H01L23/3121 , H01L23/3192 , H01L23/49894 , H01L25/0655 , H01L2924/0002 , H05K1/0275 , H05K1/0286 , H05K1/0306 , H05K3/22 , H05K3/285 , H05K3/287 , H05K3/288 , H05K5/069 , H05K13/00 , H05K2201/10151 , H05K2201/10196 , H05K2201/10212 , H05K2203/0271 , H05K2203/0292 , H05K2203/0769 , H05K2203/0776 , H05K2203/0786 , H05K2203/17 , H05K2203/175 , H05K2203/178 , Y10T29/49124 , Y10T137/0318 , Y10T428/239 , H01L2924/00
摘要： The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.

127. 发明授权

US09493764B2 Hybrid electronic sheets 有权
标题翻译：混合电子纸
公开(公告)号：US09493764B2
公开(公告)日：2016-11-15
申请号：US14748962
申请日：2015-06-24
申请人： KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
发明人： Hyunjung Yi , Ki Young Lee , Chaun Jang , Joonyeon Chang
IPC分类号： C12N9/00 , H05K3/00 , C12N11/14 , C12N7/00 , H05K3/10 , C12N9/08 , B82Y5/00
CPC分类号： C12N11/14 , B82Y5/00 , C12N7/00 , C12N9/0065 , C12N2795/00031 , C12N2795/14123 , C12N2795/14131 , H05K3/007 , H05K3/10 , H05K2203/0786 , H05K2203/12 , H05K2203/122 , H05K2203/1305 , H05K2203/1333
摘要： Provided is an electronic sheet including a graphitic material and a phage which displays a peptide having a binding ability to the graphitic material on its coat protein or a fragment thereof.
摘要翻译：本发明提供一种电子片材，其包含石墨材料和噬菌体，其显示具有与其外涂层蛋白质或其片段上的石墨材料结合能力的肽。

128. 发明申请

US20160168715A1 ELECTROLESS COPPER PLATING POLYDOPAMINE NANOPARTICLES 审中-公开
标题翻译：电镀铜聚氨酯纳米粒子
公开(公告)号：US20160168715A1
公开(公告)日：2016-06-16
申请号：US14965468
申请日：2015-12-10
申请人： The Research Foundation for The State University of New York
发明人： Siyuan Ma , Liang Liu , Vadim Bromberg , Timothy Singler
IPC分类号： C23C18/16 , H05K1/03 , H05K1/09 , C23C18/31
CPC分类号： C23C18/1607 , B41M3/006 , C09D11/10 , C09D11/322 , C23C18/1608 , C23C18/1689 , C23C18/1851 , C23C18/1893 , C23C18/2006 , C23C18/2086 , C23C18/31 , C23C18/40 , C23C18/44 , H05K1/0306 , H05K1/0346 , H05K1/097 , H05K3/125 , H05K3/1275 , H05K3/182 , H05K2201/0154 , H05K2201/09236 , H05K2203/0709 , H05K2203/0786 , H05K2203/1173
摘要： Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 μm in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.
摘要翻译：将人造合成的贻贝多孔多糖胺纳米颗粒的水性分散体喷墨印刷在柔性聚对苯二甲酸乙二醇酯（PET）基材上。由于蒸发驱动的运输（咖啡环效应）导致聚多巴胺的窄线图案（宽4μm）。印刷图案通过位置选择性Cu化学镀处理在受控温度（30℃）下进行金属化，以改变浴时间。电镀Cu线的最低电阻率值比Cu的体电阻率大约6倍。该方法在低温和低成本下呈现出用于制造柔性电子器件的Cu导电精细图案的工业上可行的方法。

129. 发明申请

US20160047741A1 METHOD AND APPARATUS FOR MONITORING AND CONTROLLING A CLEANING PROCESS 审中-公开
标题翻译：用于监测和控制清洁过程的方法和装置
公开(公告)号：US20160047741A1
公开(公告)日：2016-02-18
申请号：US14501552
申请日：2014-09-30
申请人： Kyzen Corporation
发明人： David T. Lober , Haley Nicole Jones , Jonathon Afugu , Kyle J. Doyel , Ram Wissel , Michael L. Bixenman
IPC分类号： G01N21/3577 , G05D11/13
CPC分类号： G01N21/3577 , G01N21/359 , G01N2021/3595 , G01N2201/129 , G05D11/138 , H05K3/0085 , H05K3/26 , H05K2203/0786 , H05K2203/163
摘要： A method of accurately measuring the concentration of at least one of an aqueous cleaning agent and soil in an aqueous cleaning process which includes providing a source of near infrared light emitting useful amounts of light with wavelengths between approximately 0.8 μm and 2.5 μm, transmitting the near infrared light from the light source to a probe, contacting the probe with a cleaning bath sample such that one of the absorption and the reflection of the light at one or more wavelengths can be measured, transmitting the light that has interacted with the sample to a detector, measuring the change in light intensity at one or more wavelengths in the near infrared region using a near infrared detector, generating an electronic signal that is representative of the change in intensity, applying chemometric techniques to quantitatively determine the concentration of the cleaning agent and or soil, and outputting the measured cleaning agent or soil concentration. The light source is connected to the probe via a fiber-optic cable and the probe is connected to the detector via a fiber-optic cable.
摘要翻译：一种在水性清洗过程中精确测量水性清洁剂和污垢中的至少一种的浓度的方法，该方法包括提供近红外光源，其发射波长在约0.8μm和2.5μm之间的有用量的光，透射近从光源到探头的红外光，使探针与清洗浴样品接触，使得能够测量在一个或多个波长处的光的吸收和反射之一，将与样品相互作用的光透射到检测器，使用近红外检测器测量近红外区域中的一个或多个波长处的光强度的变化，产生代表强度变化的电子信号，应用化学计量技术定量测定清洁剂的浓度，以及或土壤，并输出测量的清洁剂或土壤浓度。光源通过光纤电缆连接到探头，探头通过光纤电缆连接到检测器。

130. 发明申请

US20150305163A1 HYBRID ELECTRONIC SHEETS 有权
标题翻译：混合电子表
公开(公告)号：US20150305163A1
公开(公告)日：2015-10-22
申请号：US14325928
申请日：2014-07-08
申请人： Korea Institute Of Science And Technology
发明人： Hyunjung YI , Ki Young LEE , Chaun JANG , Joonyeon CHANG
IPC分类号： H05K3/00 , C12N11/14 , H05K3/10
CPC分类号： H05K3/007 , C08L5/08 , C12N11/14 , H05K3/10 , H05K2203/0786 , H05K2203/12 , H05K2203/122 , H05K2203/1305 , H05K2203/1333
摘要： In accordance with the present disclosure, a hybrid electronic sheet which exhibits superior electrical property and allows biomaterial functionalization and flexible device patterning may be provided by binding a graphitic material in colloidal state to a biomaterial capable of binding thereto specifically and nondestructively. Since the electronic sheet is an electronic sheet wherein a biomaterial and an electrical material (graphitic material) are hybridized, it exhibits good compatibility with biomaterials and can be further functionalized with, for example, an enzyme that selectively reacts with a biochemical substance. Accordingly, an electrical material and a chemical or biological material may be effectively nanostructurized and it can be realized as a multi-functional, high-performance electronic sheet.
摘要翻译：根据本公开，可以通过将具有胶体状态的石墨材料与能够非破坏性地结合的生物材料结合来表现出优异的电性能并且允许生物材料功能化和柔性器件图案化的混合电子薄片。由于电子薄片是生物材料和电气材料（石墨材料）杂化的电子薄片，它与生物材料表现出良好的相容性，并且可以用例如选择性地与生物化学物质反应的酶进一步官能化。因此，电气材料和化学或生物材料可以有效地纳米结构化，并且可以实现为多功能，高性能的电子薄片。

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