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1. 发明申请

US20180352678A1 APPARATUS AND METHOD FOR RECONFIGURABLE THERMAL MANAGEMENT USING FLOW CONTROL OF LIQUID METAL 审中-公开
公开(公告)号：US20180352678A1
公开(公告)日：2018-12-06
申请号：US15611138
申请日：2017-06-01
申请人： Raytheon Company
发明人： Jason D. Adams
IPC分类号： H05K7/20 , F28F13/16 , H01L23/473
CPC分类号： H01L23/473 , H01L23/3677 , H05K1/0272 , H05K1/0286
摘要： An apparatus includes a substrate and a matrix having multiple cells embedded within the substrate. The matrix is configured to generate electrostatic fields to define at least one flow path for liquid metal. The apparatus also includes a pump configured to create movement of the liquid metal through the at least one flow path defined by the matrix. The matrix is configured to transport the liquid metal through the at least one flow path in order to remove thermal energy from one or more areas of the substrate. The matrix could include a matrix of capacitors, and polarities of charges stored on the capacitors could define which cells allow passage of the liquid metal and which cells block or restrict passage of the liquid metal. The cells that block or restrict passage of the liquid metal could be configured to increase a viscosity of the liquid metal.

2. 发明授权

US10057982B2 Solderless breadboard 有权
公开(公告)号：US10057982B2
公开(公告)日：2018-08-21
申请号：US15399924
申请日：2017-01-06
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Fraser I. MacIntosh
IPC分类号： H05K1/02 , H05K1/11
CPC分类号： H05K1/0286 , H05K1/0287 , H05K1/0293 , H05K1/115 , H05K3/326 , H05K3/4046 , H05K2201/10053 , H05K2201/10303 , H05K2201/10363 , H05K2201/10401
摘要： Embodiments of the invention provide a solderless breadboard for prototyping electrical circuits. The breadboard includes a plurality of electrically conductive lines arranged parallel to each other on an electrically non-conductive breadboard structure. An electrically conductive line includes a plurality of electrical insertion positions and at an electrical insertion position a moveable electrically conductive line section which is operable for breaking the electrically conductive line in moving from a closed to an open position. A plurality of pegs are inserted into the breadboard structure at electrical insertion positions to contact the moveable sections. A peg is rotatable after insertion and includes a head portion and a cylindrical shaft extending from the head portion to a terminating foot. The shaft includes a centrally arranged channel extending from an opening in the head portion towards the terminating foot.

3. 发明授权

US09782686B2 Kit for electrifying an assembly of bricks in a brick building system 有权
公开(公告)号：US09782686B2
公开(公告)日：2017-10-10
申请号：US15260438
申请日：2016-09-09
申请人： Hellenga Projects, Inc.
发明人： Rachel Hellenga
IPC分类号： H01B5/14 , A63H33/04 , H05K1/09 , H05K1/03 , A63H33/14 , A63H33/08
CPC分类号： A63H33/042 , A63H33/08 , H05K1/0286 , H05K1/038 , H05K1/09
摘要： One variation of a conductive construction tape for electrifying a stack of bricks in a studded-brick building system includes: a tape substrate defining a first linear array of perforations that each define a circular cross-section configured to receive a stud extending from a brick in the studded-brick building system and offset from an adjacent perforation in the linear array by a standard stud offset distance between studs extending from the brick; and a conductive tape layer applied over the tape substrate; an electrically-conductive material extending along the first linear array of perforations and cooperating with the tape substrate to define a total nominal thickness less than a thickness of the studded building brick; wherein the perforated conductive tape is configured to transiently install horizontally between bricks in the stack of bricks to communicate electrical current laterally across the stack of bricks.

4. 发明申请

US20170273178A1 HIGH-FREQUENCY SIGNAL LINE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE 有权
公开(公告)号：US20170273178A1
公开(公告)日：2017-09-21
申请号：US15617067
申请日：2017-06-08
申请人： Murata Manufacturing Co., Ltd.
发明人： Noboru KATO
IPC分类号： H05K1/02 , H01P3/08 , H05K3/00 , H05K1/14 , H05K3/46
CPC分类号： H05K1/0286 , H01P3/085 , H05K1/0225 , H05K1/0253 , H05K1/0298 , H05K1/147 , H05K3/00 , H05K3/4632 , H05K2201/0141 , H05K2201/09618 , H05K2201/09727 , H05K2201/10189 , Y10T156/10
摘要： A high-frequency signal line includes a laminate of a plurality of insulator layers, a signal line provided on a first principal surface of one of the insulator layers, a first ground conductor provided on a second principal surface of the insulator layer provided with the signal line, the first ground conductor including openings that overlap with the signal conductor, and a second ground conductor provided in or on the laminate so as to be opposed to the first ground conductor with the signal conductor positioned therebetween.

5. 发明授权

US09596752B2 Panel with electric devices 有权
标题翻译：面板带电器
公开(公告)号：US09596752B2
公开(公告)日：2017-03-14
申请号：US14464006
申请日：2014-08-20
申请人： Ambianti B.V.
发明人： Georgios Metaxas
IPC分类号： H05K5/00 , H05K1/02 , G06F3/14 , G09G3/20 , H05K3/00
CPC分类号： H05K1/0292 , G06F3/1446 , G09G3/20 , G09G3/2085 , G09G3/2088 , G09G2300/026 , G09G2300/0426 , G09G2310/0278 , G09G2310/0281 , G09G2330/08 , G09G2340/0492 , G09G2360/141 , G09G2370/18 , H05K1/0286 , H05K3/0052 , H05K2201/09972 , H05K2201/10507
摘要： A panel of rectangular shape comprising a plurality of electric devices spread over the panel, a control unit including a microprocessor and a power supply, drivers for driving the electric devices based on control information received from the control unit and electric wiring connecting the control unit, the drivers and the electric devices, the shape of the panel being adaptable by removing one or more parts of the panel by cutting, sawing, milling, drilling or other suitable methods, wherein the control unit and the drivers are positioned closer to a first side of the panel than to a second side opposite the first side. The drivers and electric devices are partitioned into groups that each comprises one driver that exclusively drives the electric devices in that group.
摘要翻译：一种矩形形状的面板，包括分布在面板上的多个电气设备，包括微处理器和电源的控制单元，基于从控制单元接收的控制信息和连接控制单元的电线驱动电气设备的驱动器，驱动器和电气设备，通过切割，锯切，铣削，钻孔或其它合适的方法来移除面板的一个或多个部分来适应面板的形状，其中控制单元和驱动器位于更靠近第一侧与第一侧相对的第二侧。驱动器和电气设备被分成组，每个组包括专门驱动该组中的电气设备的一个驱动器。

6. 发明申请

US20160360613A1 SYSTEMS AND METHODS FOR BREADBOARD SYTLE PRINTED CIRCUIT BOARD 审中-公开
标题翻译：用于印刷电路板印刷电路板的系统和方法
公开(公告)号：US20160360613A1
公开(公告)日：2016-12-08
申请号：US15173408
申请日：2016-06-03
申请人： Samuel P. Kho
发明人： Samuel P. Kho
IPC分类号： H05K1/02 , H05K1/09 , H05K3/00 , H05K1/11 , H05K3/40
CPC分类号： H05K1/0289 , H05K1/0215 , H05K1/0269 , H05K1/0286 , H05K1/029 , H05K1/0292 , H05K1/0293 , H05K1/09 , H05K1/11 , H05K3/1216 , H05K2201/0305 , H05K2201/09254 , H05K2201/09563 , H05K2201/09572 , H05K2201/09609 , H05K2203/166
摘要： The present invention relates generally to electric circuit testing, building, or implementing using a breadboard style PCB. Aspects of the present invention include eliminating the need to use hookup wires when building and testing electric circuits on PCBs. In embodiments, a PCB system having rows and columns of signal tie points connected in a breadboard layout and using an embedded wire and a solder bridge to form partial connections between signal tie points. In embodiments, the embedded wire and solder bridge is capable of connecting a column of signal tie points. In embodiments, the embedded wire and solder bridge is capable of connecting a power rail to a signal tie point. Thus, a circuit can be implemented and tested by applying a small amount of solder to the solder bridge without the need for hookup wires.
摘要翻译：本发明一般涉及使用面包板式PCB的电路测试，构建或实现。本发明的方面包括在PCB上构建和测试电路时消除了使用连接线的需要。在实施例中，PCB系统具有以面包板布局连接的信号连接点的行和列，并且使用嵌入的线和焊接桥来形成信号连接点之间的部分连接。在实施例中，嵌入式线和焊接桥能够连接一列信号连接点。在实施例中，嵌入式线和焊接桥能够将电力轨连接到信号连接点。因此，可以通过在焊料桥上施加少量焊料来实现和测试电路，而不需要连接线。

7. 发明授权

US09318156B2 Multi-chip packaged flash memory/support application specific integrated circuit for flash dual inline memory modules 有权
标题翻译：多芯片封装闪存/支持应用专用集成电路，用于闪存双列直插内存模块
公开(公告)号：US09318156B2
公开(公告)日：2016-04-19
申请号：US14016235
申请日：2013-09-03
申请人： Ruban Kanapathippillai , Kenneth Alan Okin
发明人： Ruban Kanapathippillai , Kenneth Alan Okin
IPC分类号： G06F1/16 , H05K5/00 , H05K7/00 , G11C5/04 , G11C5/14 , G11C16/08 , H05K1/18
CPC分类号： G11C16/30 , G11C5/04 , G11C5/14 , G11C16/08 , H01R12/725 , H05K1/0286 , H05K1/181 , H05K2201/10159 , H05K2201/10212 , Y02P70/611 , Y10T29/49002 , Y10T29/49117 , Y10T29/49124 , Y10T29/49128 , Y10T29/49169
摘要： In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may be mounted together into a multi-chip package for integrated circuits. The one or more flash memory chips and the memory support ASIC may be electrically coupled together by routing one or more conductors between each in the multi-chip package. The multi-chip package may be mounted onto a printed circuit board (PCB) of a flash memory DIMM to reduce the number of packages mounted thereto and reduce the height of the flash memory DIMM. The number of printed circuit board layers may also be reduced, such as by integrating address functions into the memory support ASIC.
摘要翻译：在一个实施方案中，闪存芯片被提供有工作电源电压以基本上匹配预期在双列直插存储器模块的边缘连接器处的电源电压。一个或多个闪速存储器芯片和存储器支持应用集成电路（ASIC）可以一起安装到用于集成电路的多芯片封装中。一个或多个闪存芯片和存储器支持ASIC可以通过在多芯片封装中的每一个之间布线一个或多个导体来电耦合在一起。多芯片封装可以安装在闪存DIMM的印刷电路板（PCB）上，以减少安装在其上的封装件的数量并降低闪存DIMM的高度。印刷电路板层的数量也可以减少，例如通过将地址功能集成到存储器支持ASIC中。

8. 发明申请

US20160050750A1 BIODEGRADABLE MATERIALS FOR MULTILAYER TRANSIENT PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：用于多层瞬态印刷电路板的生物可降解材料
公开(公告)号：US20160050750A1
公开(公告)日：2016-02-18
申请号：US14818109
申请日：2015-08-04
申请人： The Board of Trustees of the University of Illinois
发明人： John A. ROGERS , Xian HUANG
IPC分类号： H05K1/02 , H05K3/46 , H05K1/11 , H05K1/18 , H05K1/03 , H05K1/09
CPC分类号： H05K1/0286 , A61B5/686 , H05K1/0212 , H05K1/0275 , H05K1/028 , H05K1/0283 , H05K1/0386 , H05K1/095 , H05K1/097 , H05K1/144 , H05K3/1216 , H05K3/207 , H05K3/22 , H05K3/285 , H05K3/287 , H05K3/288 , H05K3/4626 , H05K2201/0133 , H05K2201/0266 , H05K2201/041 , H05K2201/10083 , H05K2201/10098 , H05K2201/10151 , H05K2201/10196 , H05K2201/10212 , H05K2203/0271 , H05K2203/0292 , H05K2203/0514 , H05K2203/0769 , H05K2203/0776 , H05K2203/0786 , H05K2203/105 , H05K2203/1105 , H05K2203/1142 , H05K2203/175 , H05K2203/178 , Y02P70/611 , Y02P70/613 , Y10T29/49124 , Y10T137/0318 , Y10T428/239
摘要： The invention provides transient printed circuit board devices, including active and passive devices that electrically and/or physically transform upon application of at least one internal and/or external stimulus.
摘要翻译：本发明提供瞬时印刷电路板装置，包括在应用至少一个内部和/或外部刺激时电和/或物理变换的有源和无源装置。

9. 发明申请

US20160025311A1 LED LIGHTING SYSTEM INCORPORATING FOLDED LIGHT SHEETS 审中-公开
标题翻译： LED照明系统折叠折叠灯
公开(公告)号：US20160025311A1
公开(公告)日：2016-01-28
申请号：US14810630
申请日：2015-07-28
申请人： Michael A. Tischler
发明人： Michael A. Tischler
IPC分类号： F21V21/14 , F21V29/70 , F21V19/00 , F21V23/00 , F21V7/05 , F21V11/18
CPC分类号： F21S4/20 , F21K9/90 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L33/62 , H05K1/00 , H05K1/0286 , H05K1/189 , H05K2201/055 , H05K2201/09127 , H05K2201/10106
摘要： In accordance with certain embodiments, flexible light sheets are folded to define first and second portions of the light sheet divided by the fold, and the first and second portions of the light sheet may both feature light-emitting elements thereon.
摘要翻译：根据某些实施例，柔性光片被折叠以限定由折叠物分割的光片的第一和第二部分，并且光片的第一和第二部分都可以在其上具有发光元件。

10. 发明申请

US20150248846A1 CONSTRUCTION KIT FOR MODULE TYPE CIRCUIT ELEMENTS 审中-公开
标题翻译：模块型电路元件的构造套件
公开(公告)号：US20150248846A1
公开(公告)日：2015-09-03
申请号：US14698005
申请日：2015-04-28
申请人： Min Soo KANG , Mi Hee PARK
发明人： Min Soo KANG , Mi Hee PARK
IPC分类号： G09B23/18
CPC分类号： G09B23/185 , G09B23/18 , G09B23/183 , G09B25/02 , H05K1/0286 , H05K1/142 , H05K2201/049 , H05K2201/09963
摘要： According to a construction kit for module type circuit elements disclosed in the present invention, individual circuit elements for forming an electronic circuit are formed in the shape of a module, a circuit diagram and the actual elements of the circuit elements can be intuitionally identified through an upper surface and a lower surface of a circuit element block module having the shape of module, user convenience is improved by coupling the circuit element block module with a lead line connection block module without using a soldering process or a wire connection process, a connection error and a malfunction of a port occurring in existing SMD or dip type circuit elements are prevented, and the learning of the electronic circuit elements can be improved by enhancing an intuitive learning approach of a learner.
摘要翻译：根据本发明公开的用于模块型电路元件的构造套件，用于形成电子电路的各个电路元件形成为模块形状，电路图，并且可以通过以下方式直观地识别电路元件的实际元件：具有模块形状的电路元件块模块的上表面和下表面，通过将电路元件块模块与引线连接块模块耦合而不使用焊接过程或电线连接过程来改善用户便利性，连接错误并且防止在现有的SMD或浸式电路元件中发生的端口的故障，并且通过增强学习者的直觉学习方法可以提高电子电路元件的学习。

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