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1. 发明授权

US09603256B2 Process for producing articles having an electrically conductive coating 有权
公开(公告)号：US09603256B2
公开(公告)日：2017-03-21
申请号：US12064769
申请日：2006-05-15
申请人： Andreas Gellrich
发明人： Andreas Gellrich
IPC分类号： H01B1/20 , H05K3/12 , B05D3/02 , B05D5/12 , B05D7/04 , B05D3/12 , H05K1/09
CPC分类号： H05K3/12 , B05D3/0254 , B05D3/12 , B05D5/12 , B05D7/04 , B05D2601/28 , H01B1/20 , H05K1/095 , H05K2203/0143 , H05K2203/0278 , H05K2203/0786
摘要： The present invention relates to a process for producing articles having on at least part of their surface an electrically conductive coating by at least partly coating a substrate with a composition comprising finely divided electrically conductive metal particles and a binder and subjecting the coated substrate to at least one treatment with water in the presence of a halide ion source at a temperature in the range from ambient temperature to 200° C. The process of the invention allows articles having an electrically conductive coating to be produced in a simple, rapid and mild way.

2. 发明授权

US09496229B2 Transient electronic devices comprising inorganic or hybrid inorganic and organic substrates and encapsulates 有权
标题翻译：包含无机或杂化无机和有机底物并封装的瞬态电子器件
公开(公告)号：US09496229B2
公开(公告)日：2016-11-15
申请号：US14250671
申请日：2014-04-11
申请人： The Board of Trustees of the University of Illinois
发明人： John A. Rogers , Seung-Kyun Kang , SukWon Hwang , Jianjun Cheng , Yanfeng Zhang , Hanze Ying
IPC分类号： H05K1/02 , H05K5/06 , H01L21/70 , H01L21/56 , H01L23/29 , H01L23/32 , A61B5/00 , H01L23/00 , H05K13/00 , H01L23/06 , A61M5/44 , G06K19/077 , H05K3/22 , H05K3/28 , H05K1/03
CPC分类号： H05K1/185 , A61B5/686 , A61B2562/125 , A61M5/44 , G06K19/0775 , H01L21/02164 , H01L21/0217 , H01L21/02274 , H01L21/0228 , H01L21/31111 , H01L21/31133 , H01L21/56 , H01L23/291 , H01L23/3121 , H01L23/3192 , H01L23/49894 , H01L25/0655 , H01L2924/0002 , H05K1/0275 , H05K1/0286 , H05K1/0306 , H05K3/22 , H05K3/285 , H05K3/287 , H05K3/288 , H05K5/069 , H05K13/00 , H05K2201/10151 , H05K2201/10196 , H05K2201/10212 , H05K2203/0271 , H05K2203/0292 , H05K2203/0769 , H05K2203/0776 , H05K2203/0786 , H05K2203/17 , H05K2203/175 , H05K2203/178 , Y10T29/49124 , Y10T137/0318 , Y10T428/239 , H01L2924/00
摘要： The invention provides transient devices, including active and passive devices that physically, chemically and/or electrically transform upon application of at least one internal and/or external stimulus. Incorporation of degradable device components, degradable substrates and/or degradable encapsulating materials each having a programmable, controllable and/or selectable degradation rate provides a means of transforming the device. In some embodiments, for example, transient devices of the invention combine degradable high performance single crystalline inorganic materials with selectively removable substrates and/or encapsulants.
摘要翻译：本发明提供瞬态装置，包括在应用至少一个内部和/或外部刺激时物理地，化学地和/或电转换的有源和无源装置。每个具有可编程，可控和/或可选择的降解速率的可降解装置组件，可降解底物和/或可降解封装材料的结合提供了改变装置的手段。在一些实施例中，例如，本发明的瞬态装置将可降解的高性能单晶无机材料与选择性可移除的基底和/或密封剂结合。

3. 发明申请

US20140367620A1 METHOD FOR IMPROVING PATTERNED SILVER CONDUCTIVITY 审中-公开
标题翻译：改进图案银电导率的方法
公开(公告)号：US20140367620A1
公开(公告)日：2014-12-18
申请号：US13919203
申请日：2013-06-17
申请人： Ronald Anthony Gogle , Thomas Edward Lowe , Terrence Robert O'Toole , Michael Phillip Youngblood
发明人： Ronald Anthony Gogle , Thomas Edward Lowe , Terrence Robert O'Toole , Michael Phillip Youngblood
IPC分类号： H05K3/22
CPC分类号： H05K3/22 , C08K3/08 , C08L89/06 , C23C18/06 , C23C18/08 , G06F3/041 , G06F2203/04103 , H01B1/02 , H05K1/097 , H05K3/106 , H05K2203/0786 , H05K2203/121
摘要： A method is used to improve the conductivity of silver disposed on a substrate. This silver is generally in the form of silver metal particles. The silver is treated with an aqueous solution comprising a conductivity enhancing agent to provide treated silver metal particles that are increased in conductivity. The treated silver metal particles are then dried. These two essential steps of treating and drying are repeated in at least one additional treatment cycle, in sequence, using the same or different conductivity enhancing agent, thereby improving the conductivity of the silver metal particles from one treatment cycle to another. This method can be carried out using an apparatus having a series of stations for carrying out each step in each treatment cycle.
摘要翻译：使用一种方法来改善设置在基板上的银的导电性。这种银通常是银金属颗粒的形式。用包含导电性增强剂的水溶液处理银以提供导电性提高的经处理的银金属颗粒。然后将经处理的银金属颗粒干燥。处理和干燥的这两个必要步骤在至少一个额外的处理循环中依次使用相同或不同的电导率增强剂重复，从而提高银金属颗粒从一个处理循环到另一处理周期的电导率。该方法可以使用具有用于在每个处理周期中执行每个步骤的一系列站的装置来执行。

4. 发明申请

US20120177817A1 METHOD FOR PRODUCING A CONDUCTIVE FILM 审中-公开
标题翻译：制造导电膜的方法
公开(公告)号：US20120177817A1
公开(公告)日：2012-07-12
申请号：US13176320
申请日：2011-07-05
申请人： Tsukasa TOKUNAGA
发明人： Tsukasa TOKUNAGA
IPC分类号： B05D5/12
CPC分类号： H05K3/22 , H05K1/095 , H05K3/106 , H05K9/0096 , H05K2203/0786 , H05K2203/088 , Y10T29/49155
摘要： A method for producing a conductive film, having the steps: forming, on a support, a conductive metal portion containing a conductive material and a binder; bringing the conductive metal portion into contact with vapor or a hot water; and immersing the conductive metal portion into hot water having a temperature of 40° C. or higher.
摘要翻译：一种导电膜的制造方法，其特征在于，具有以下工序：在载体上形成含有导电性材料和粘合剂的导电性金属部分; 使导电金属部分与蒸气或热水接触; 并将导电金属部分浸渍在温度为40℃以上的热水中。

5. 发明授权

US08012676B2 Process for preparing conductive material 有权
标题翻译：制备导电材料的方法
公开(公告)号：US08012676B2
公开(公告)日：2011-09-06
申请号：US12305929
申请日：2007-06-22
申请人： Takenobu Yoshiki , Shigeki Shino , Kazuhisa Kobayashi
发明人： Takenobu Yoshiki , Shigeki Shino , Kazuhisa Kobayashi
IPC分类号： G03C1/00 , G03C1/005 , G03C5/26 , G03C1/06 , G03F7/00
CPC分类号： H05K3/106 , H05K2203/0786 , H05K2203/1157 , H05K2203/122
摘要： It is to provide a process for preparing a conductive material in which transparency and conductivity are both high, and storage stability is high, and further, in a process for preparing a conductive material utilizing ultra fine silver particles, to provide a process for preparing a conductive material having high conductivity without requiring a calcination step which has conventionally been required.A process for preparing a conductive material having a conductive pattern containing silver on a support, which process for preparing a conductive material comprises acting at least one of the following mentioned (I) to (IV) on the pattern portion containing silver provided on the support:(I) a reducing substance,(II) a water-soluble phosphorus oxo acid compound,(III) a water-soluble halogen compound,(IV) warm water of 55° C. or higher.
摘要翻译：本发明提供一种制备透明性和导电性均高，储存稳定性高的导电材料的方法，此外，在制备使用超细银粒子的导电材料的方法中，提供制备具有高导电性的导电材料，而不需要通常需要的煅烧步骤。一种用于制备具有在载体上含有银的导电图案的导电材料的方法，该制备导电材料的方法包括在设置在载体上的含有银的图案部分上起到以下提及的（I）至（IV）中的至少一种作用：（I）还原物质，（II）水溶性磷含氧化合物，（III）水溶性卤素化合物，（IV）55℃以上的温水。

6. 发明申请

US20100243301A1 Organic polymer coating for protection against creep corrosion 有权
标题翻译：有机聚合物涂层，用于防止蠕变腐蚀
公开(公告)号：US20100243301A1
公开(公告)日：2010-09-30
申请号：US12383650
申请日：2009-03-27
申请人： KESHENG FENG , NILESH KAPADIA , WITOLD PAW
发明人： KESHENG FENG , NILESH KAPADIA , WITOLD PAW
IPC分类号： H05K1/09 , H05K3/28
CPC分类号： C23C22/52 , C09D5/12 , C23C22/83 , H05K3/282 , H05K2203/0786 , H05K2203/124 , Y10T428/24917
摘要： A process is described for treating metal surfaces printed wiring boards and similar substrates to provide improved creep corrosion resistance on such surfaces. A modified organic solderability preservative composition is used in combination with an emulsion polymer to provide a modified polymer coating on the metal surface finish via a chemical reaction to provide enhanced corrosion protection of the surface.
摘要翻译：描述了一种用于处理金属表面印刷线路板和类似基底的方法，以在这些表面上提供改善的耐蠕变腐蚀性。改性有机可焊性防腐剂组合物与乳液聚合物组合使用，以通过化学反应在金属表面光洁度上提供改性聚合物涂层，以提供增强的表面腐蚀保护。

7. 发明申请

US20080173699A1 Method for Attachment of Solder Powder to Electronic Circuit Board and Solder-Attached Electronic Circuit Board 有权
标题翻译：将焊粉附着到电子电路板和焊接电子电路板上的方法
公开(公告)号：US20080173699A1
公开(公告)日：2008-07-24
申请号：US12013246
申请日：2008-01-11
申请人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
发明人： Takashi Shoji , Takekazu Sakai , Tetsuo Kubota
IPC分类号： B23K1/20 , B23K31/00
CPC分类号： H05K3/3478 , H05K3/282 , H05K2203/0285 , H05K2203/0425 , H05K2203/0786 , H05K2203/124
摘要： A method for the attachment of solder powder includes the steps of treating an exposed metallic surface of an electronic circuit board with a tackifier compound, thereby imparting tackiness thereto to form a tackified part, attaching solder powder by a dry or wet process to the tackified part, and then removing excessively adhering solder powder in a liquid that is water, deoxidized water or deoxidized water added with an antirust.
摘要翻译：用于焊接粉末的附着方法包括以下步骤：用增粘剂处理电子电路板的暴露的金属表面，由此赋予粘合性以形成增粘部分，通过干法或湿法将焊料粉末附着到增粘部分，然后除去添加有防锈剂的水，脱氧水或脱氧水的液体中过度粘附的焊料粉末。

8. 发明申请

US20060276050A1 Method for manufacturing crystalline dielectric film,crystalline dielectric film manufactured thereby and thin film capacitor having the same 审中-公开
标题翻译：制造结晶电介质膜的方法，由此制造的结晶电介质膜和具有其的薄膜电容器
公开(公告)号：US20060276050A1
公开(公告)日：2006-12-07
申请号：US11445232
申请日：2006-06-02
申请人： Won Song , Yul Chung , Hyoung Kang , Sung Lim
发明人： Won Song , Yul Chung , Hyoung Kang , Sung Lim
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L21/31691 , H01L21/02186 , H01L21/02197 , H01L21/02282 , H01L21/02356 , H05K1/162 , H05K2201/0175 , H05K2201/0179 , H05K2201/0355 , H05K2203/0786 , H05K2203/1105
摘要： The invention provides a method for manufacturing a crystalline dielectric film by which the crystalline dielectric film can be formed at a low temperature of 300° C. or less. In the manufacturing method of the invention, first, an amorphous dielectric film is formed on a substrate. Then, the amorphous dielectric film is immersed into water to be hydrothermally treated.
摘要翻译：本发明提供了一种用于制造晶体电介质膜的方法，通过该方法可以在300℃或更低的低温下形成结晶电介质膜。在本发明的制造方法中，首先，在基板上形成非晶质介电膜。然后，将非晶质介电膜浸入水中进行水热处理。

9. 发明申请

US20060249304A1 Circuit board and process for producing the same 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20060249304A1
公开(公告)日：2006-11-09
申请号：US10554660
申请日：2004-06-30
申请人： Hideaki Tanaka , Nobuyuki Sensui
发明人： Hideaki Tanaka , Nobuyuki Sensui
IPC分类号： H05K1/03
CPC分类号： H05K3/0023 , H05K3/26 , H05K3/28 , H05K3/4644 , H05K2201/0761 , H05K2201/0769 , H05K2203/0786 , H05K2203/0793 , Y10T29/49126 , Y10T29/49155
摘要： In the case of using a photosensitive insulating resin for a surface protective layer of a circuit wiring pattern, or for an insulating layer between circuit wiring conductor layers in a circuit board, Na ions adsorbed on the photosensitive insulating resin are replaced with a polyvalent metal through a treatment step containing Na ions which is executed after a heat curing step of the photosensitive insulating resin. For the polyvalent metal, a II group including Mg or Ca can be selected.
摘要翻译：在电路布线图案的表面保护层用感光绝缘树脂或电路基板的电路布线导体层之间的绝缘层的情况下，吸附在感光绝缘树脂上的Na离子被多价金属代替包含在感光绝缘树脂的热固化步骤之后执行的Na离子的处理步骤。对于多价金属，可以选择包括Mg或Ca的II族。

10. 发明申请

US20060128176A1 Selective application of conductive material to substrates by pick and place of compliant contact arrays 失效
标题翻译：通过拾取和放置柔性接触阵列，将导电材料选择性地应用于基板
公开(公告)号：US20060128176A1
公开(公告)日：2006-06-15
申请号：US11349285
申请日：2006-02-06
申请人： Morgan Johnson
发明人： Morgan Johnson
IPC分类号： H01R12/00
CPC分类号： H05K3/4015 , H05K3/027 , H05K3/341 , H05K2203/0191 , H05K2203/0769 , H05K2203/0786 , Y10T428/12493 , Y10T428/12507 , Y10T428/12514
摘要： Application of a conductive material with a compliant underlayer onto selected pads of a substrate, includes forming at least one padstack, by patterning a sheet including a stack of material layers. Padstacks may include a first conductive top layer, one or more underlying layers, and a bottom attachment layer, such as a solder layer. At least one flexible, or compliant, layer is disposed in the sheet between the top and attachment layers. The compliant layer may be a conductive elastomer. The top layer of the padstacks are adhered to a soluble tape, and this composite structure is moved into place over the circuit board by means of a pick and place operation. The placement of the padstacks is followed by a solder reflow to adhere the padstacks to the contact pads of the substrate, and by a wash cycle with a solvent to remove the soluble tape.
摘要翻译：将具有柔顺底层的导电材料施加到衬底的选定焊盘上，包括通过图案化包括一叠材料层的片材来形成至少一个衬垫堆叠。垫片可以包括第一导电顶层，一个或多个下层和底部附着层，例如焊料层。在顶部和附着层之间的片材中设置至少一个柔性或柔顺层。柔性层可以是导电弹性体。衬垫的顶层粘附到可溶性胶带上，并且通过拾取和放置操作将该复合结构移动到电路板上的适当位置。焊盘的放置之后是焊料回流，以将焊盘粘附到衬底的接触焊盘，并且通过用溶剂洗涤循环以除去可溶性带。

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