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    • 93. 发明授权
    • Electron device manufacturing method, a pattern forming method, and a photomask used for those methods
    • 电子器件制造方法,图案形成方法和用于这些方法的光掩模
    • US06653052B2
    • 2003-11-25
    • US09810194
    • 2001-03-19
    • Toshihiko TanakaNorio HasegawaHiroshi ShiraishiHidetoshi Satoh
    • Toshihiko TanakaNorio HasegawaHiroshi ShiraishiHidetoshi Satoh
    • G03F750
    • G03F1/30
    • A method of manufacturing an electron device provided with minute structure such as a semiconductor integrated circuit using projection exposure technique and phase shift mask technique, maintaining a high yield is disclosed. In an electron device manufacturing method according to the invention, a desired electron device is manufactured by printing a light shielding film pattern on a photosensitive film provided on the surface of a workpiece by a projection tool using a mask where a phase shifter having predetermined thickness is partially formed on the flat surface of a transparent plate and a light shielding film having a predetermined pattern and made of non-metal is partially provided with the film covering the end of the shifter and developing the photosensitive film. Further, concretely, the above pattern is printed using a mask where the light shielding film made of non-metal is partially extended on the surface of the shifter and the transparent plate including the end of the shifter by the projection tool. According to the electron device manufacturing method according to the invention, an electron device provided with minute structure can be precisely manufactured maintaining a high yield.
    • 公开了一种制造具有微小结构的电子器件的方法,例如使用投影曝光技术和相移掩模技术的半导体集成电路,保持高产率。 在根据本发明的电子器件制造方法中,通过使用具有预定厚度的移相器的掩模通过投影工具在设置在工件表面上的感光膜上印刷遮光膜图案来制造所需的电子器件 部分地形成在透明板的平坦表面上和具有预定图案并由非金属制成的遮光膜部分地设置有覆盖移位器的端部并显影感光膜的膜。 此外,具体地,使用由非金属制成的遮光膜在移位器的表面上部分地延伸的掩模和通过投影工具包括移位器的端部的透明板来打印上述图案。 根据本发明的电子器件制造方法,可以精确地制造具有微小结构的电子器件,保持高产率。
    • 97. 发明授权
    • Semiconductor integrated circuit and method of fabricating the same
    • 半导体集成电路及其制造方法
    • US06483136B1
    • 2002-11-19
    • US09446302
    • 2000-04-14
    • Makoto YoshidaTakahiro KumauchiYoshitaka TadakiIsamu AsanoNorio HasegawaKeizo Kawakita
    • Makoto YoshidaTakahiro KumauchiYoshitaka TadakiIsamu AsanoNorio HasegawaKeizo Kawakita
    • H01L2972
    • H01L27/10852H01L27/10817
    • An active region (L) with a metal insulator semiconductor field effect transistor (MISFET) (Qs) formed therein for selection of a DRAM memory cell, which makes up a memory cell of the DRAM, is arranged to have an island-like pattern that linearly extends in an X direction on one principal surface of a semiconductor substrate (1). The memory-cell selection MISFET (Qs) has an insulated gate electrode (7) (word line WL) that extends along a Y direction on the principal surface of the semiconductor substrate (1) with the same width kept along the length thereof, which gate electrode is arranged to oppose another gate electrode (7) (word line WL) adjacent thereto at a prespecified distance or pitch that is narrower than said width. In addition, a bit line (BL) is provided overlying the memory-cell select MISFET (Qs) in a manner such that the bit line extends in the X direction on the principal surface of the semiconductor substrate (1) with the same width and opposes its neighboring bit line (BL) at a distance or pitch that is wider than said width.
    • 在其中形成有用于选择构成DRAM的存储单元的DRAM存储单元的金属绝缘体半导体场效应晶体管(MISFET)(Qs)的有源区域(L)被布置成具有岛状图案, 在半导体衬底(1)的一个主表面上沿X方向线性地延伸。 存储单元选择MISFET(Qs)具有在半导体衬底(1)的主表面上沿着Y方向延伸的绝缘栅电极(字线WL),沿着其长度保持相同的宽度, 栅电极被布置成以比所述宽度窄的预定距离或间距与与其相邻的另一个栅电极(7)(字线WL)相对。 此外,位线(BL)以这样的方式设置在存储单元选择MISFET(Qs)上,使得位线在半导体衬底(1)的主表面上沿X方向以相同的宽度延伸,并且 以比所述宽度更宽的距离或间距来对置其相邻位线(BL)。
    • 99. 发明授权
    • Semiconductor device having a shielding conductor
    • 具有屏蔽导体的半导体器件
    • US06278148B1
    • 2001-08-21
    • US09040457
    • 1998-03-18
    • Takao WatanabeTakuya FukudaNorio Hasegawa
    • Takao WatanabeTakuya FukudaNorio Hasegawa
    • H01L27108
    • H01L27/10897G11C5/063G11C7/02G11C11/4097H01L23/5225H01L23/552H01L27/10805H01L27/10882H01L2924/0002H01L2924/00
    • The present invention relates to a semiconductor device that includes a dynamic memory and logic circuits that are integrated on a single chip and that can avoid noise problems and signal delay. The portion above the memory is shielded with a shielding conductor that is biased to an equipotential. Wirings between logical blocks and bonding pads or between logical blocks are passed over the conductive layer. Wiring for logic circuits can be done in the same metal wiring layer in which the shielding conductor is provided. The shielding conductor can have a mesh-like structure to improve its integrity and wirings can be passed over conductive portions of the shielding layer to be protected from noise. In addition to the dynamic memory, other memories and analog circuits can be used instead of or in combination with the dynamic memory.
    • 本发明涉及一种半导体器件,其包括集成在单个芯片上并且可以避免噪声问题和信号延迟的动态存储器和逻辑电路。 存储器上方的部分用被偏置到等电位的屏蔽导体屏蔽。 逻辑块和焊盘之间或逻辑块之间的布线通过导电层。 逻辑电路的布线可以在设置有屏蔽导体的同一金属布线层中完成。 屏蔽导体可以具有网状结构以改善其完整性,并且布线可以穿过屏蔽层的导电部分以防止噪声。 除了动态存储器之外,可以使用其他存储器和模拟电路来代替动态存储器或与动态存储器组合使用。