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    • 10. 发明授权
    • Defect assessing apparatus and method, and semiconductor manufacturing method
    • 缺陷评估装置和方法以及半导体制造方法
    • US06226079B1
    • 2001-05-01
    • US09161393
    • 1998-09-29
    • Kazuo TakedaMakoto OhkuraSeiichi IsomaeKyoko MinowaMuneo MaeshimaShigeru MatsuiYasushi MatsudaHirofumi Shimizu
    • Kazuo TakedaMakoto OhkuraSeiichi IsomaeKyoko MinowaMuneo MaeshimaShigeru MatsuiYasushi MatsudaHirofumi Shimizu
    • G01N2100
    • G01N21/9501G01N21/47
    • A defect assessing apparatus and method and a semiconductor manufacturing method for revealing the relationship between the size and depth of defects is disclosed. A detecting optical system is provided for detecting the intensity of scattered light from a defect generated by the shorter wavelength one of the light rays of at least two different wavelengths emitted from irradiating optical systems and that of scattered light from the defect generated by the longer wavelength one of same. A calculating means is provided for determining, from the scattered light intensity derived from the shorter wavelength ray and that derived form the longer wavelength ray, both detected by the detecting optical system, a value corresponding to the defect size and another value corresponding to the defect depth. A display means is provided for displaying a distribution revealing the relationship between defect size and defect depth on the basis of the value corresponding to the defect size and the value corresponding to the defect depth, both determined by the calculating means.
    • 公开了一种用于揭示缺陷的尺寸和深度之间的关系的缺陷评估装置和方法以及半导体制造方法。 提供了一种检测光学系统,用于检测由照射光学系统发射的至少两种不同波长的较短波长的一个光线产生的缺陷的散射光的强度,以及来自由较长波长产生的缺陷的散射光 一个是相同的 提供了一种计算装置,用于根据由检测光学系统检测的来自较短波长的衍射的散射光强度和由较长波长的光导出的值,确定对应于缺陷尺寸的值和对应于缺陷的另一个值 深度。 提供显示装置,用于根据由计算装置确定的缺陷尺寸和对应于缺陷深度的值,显示出显示缺陷尺寸和缺陷深度之间的关系的分布。