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    • 91. 发明授权
    • Extended drain MOSFET for programming an integrated fuse element to high resistance in low voltage process technology
    • 扩展漏极MOSFET,用于在低电压工艺技术中将集成保险丝元件编程为高电阻
    • US06525397B1
    • 2003-02-25
    • US09376161
    • 1999-08-17
    • Alexander KalnitskyPavel PoplevineAlbert Bergemont
    • Alexander KalnitskyPavel PoplevineAlbert Bergemont
    • H01L2900
    • H01L23/5256H01L27/101H01L2924/0002H01L2924/00
    • An integrated fuse element is capable of being programmed to high resistance in low voltage process technology. The fuse includes a stack of an undoped polysilicon layer and a silicide layer. A voltage applied across the stack is increases until a first agglomeration event occurs, whereby a discontinuity is formed in the silicide layer. The current is further increased to cause a second agglomeration event whereby the size of the discontinuity is increased. Each agglomeration event increases the resistance of the fuse. An extended-drain MOS transistor, capable of sustaining high voltage, is connected in series with the fuse for programming the fuse. The transistor includes: a well region in a substrate, the well region forming the drain of the transistor; an insulating trench in the well; and a polysilicon gate extending over a portion of the substrate, a portion of the well and a portion of the trench, wherein upon reverse-biasing the junction between the well and the substrate a depletion region is formed which encompasses at least the entire portion of the surface region of the well over which the polysilicon extends.
    • 集成的熔丝元件能够被编程为低电压工艺技术中的高电阻。 熔丝包括未掺杂的多晶硅层和硅化物层的堆叠。 施加在堆叠上的电压增加直到发生第一附聚事件,由此在硅化物层中形成不连续性。 电流进一步增加以引起第二聚集事件,从而增加不连续性的大小。 每个附聚事件会增加保险丝的电阻。 能够保持高电压的延伸漏极MOS晶体管与保险丝串联连接,以对熔丝进行编程。 晶体管包括:衬底中的阱区,形成晶体管的漏极的阱区; 井中的绝缘沟槽; 以及在所述衬底的一部分上延伸的多晶硅栅极,所述阱的一部分和所述沟槽的一部分,其中在反向偏置所述阱和所述衬底之间的结点时,形成耗尽区,所述耗尽区至少包括 多晶硅延伸的阱的表面区域。
    • 92. 发明授权
    • Methods of fabricating floating gate semiconductor device with reduced erase voltage
    • 制造具有降低的擦除电压的浮栅半导体器件的方法
    • US06368917B1
    • 2002-04-09
    • US09721604
    • 2000-11-21
    • Alexander KalnitskyAlbert Bergemont
    • Alexander KalnitskyAlbert Bergemont
    • H01L21336
    • H01L29/66825H01L27/11553
    • The present invention provides a method for forming a shaped floating gate on an integrated circuit substrate. A trench is etched in a surface of the integrated circuit substrate such that a tip is formed. The tip may be defined by a first sidewall that is approximately perpendicular to the surface of the integrated circuit substrate and a second sidewall that is disposed at an angle to the surface of the integrated circuit substrate. A dielectric layer is then formed over the substrate surface and conforming to the trench. Next, a conductive layer is deposited above the dielectric layer such that it fills the trench. The conductive layer is then etched such that a floating gate is defined. A bottom portion of the floating gate is then contained by the trench. The resulting floating gate and semiconductor device includes a dielectric layer disposed above an integrated circuit substrate surface. The substrate surface defines a trench having a tip that may be defined by a first sidewall and a second sidewall. A conductive layer is formed above the dielectric layer such that it fills the trench and defines a floating gate having a tip contained by the trench. In addition, a diffusion region may be disposed in the integrated circuit substrate such that the tip of the floating gate points into the diffusion region.
    • 本发明提供一种在集成电路基板上形成成形浮栅的方法。 在集成电路基板的表面中蚀刻沟槽,从而形成尖端。 尖端可以由大致垂直于集成电路基板的表面的第一侧壁和与集成电路基板的表面成角度设置的第二侧壁限定。 然后在衬底表面上形成电介质层并且与沟槽一致。 接下来,在电介质层上方沉积导电层,使其填充沟槽。 然后蚀刻导电层,使得限定浮动栅极。 然后,浮动栅极的底部被沟槽包围。 所得的浮栅和半导体器件包括设置在集成电路衬底表面上方的电介质层。 衬底表面限定了具有可由第一侧壁和第二侧壁限定的尖端的沟槽。 导电层形成在电介质层之上,使得它填充沟槽并且限定具有由沟槽包含的尖端的浮动栅极。 此外,可以在集成电路基板中设置扩散区域,使得浮动栅极的尖端指向扩散区域。
    • 95. 发明授权
    • Process for fabricating EEPROM memory cell array embedded on core CMOS
    • 用于制造嵌入在核心CMOS上的EEPROM存储单元阵列的工艺
    • US06238979B1
    • 2001-05-29
    • US09599052
    • 2000-06-21
    • Albert Bergemont
    • Albert Bergemont
    • H01L218247
    • H01L27/11521G11C2216/10H01L27/115H01L27/11558
    • A process of fabricating an electrically erasable programmable read only memory cell embedded on core complementary metal oxide silicon for analog applications. First, a P-well region is formed. A first N-well region is formed within the P-well, and a second N-well region is formed within the P-well spaced apart from the first N-well. A first field oxide layer is deposited over the P-well, the first N-well, and the second N-well. A high-voltage oxide layer is grown over the first field oxide layer. A first photoresist mask which defines a tunneling window is then overlaid. The first field oxide layer and the high-voltage oxide layer are then etched. Afterwards, the first photoresist mask is stripped. A tunnel oxide layer is grown. A polysilicon layer is grown on top of the tunnel oxide layer and then doped. A second photoresist mask which defines a floating gate is overlaid on top of the polysilicon layer. The polysilicon layer is then etched, and the second photoresist mask is stripped away.
    • 制造嵌入在用于模拟应用的核心互补金属氧化物硅上的电可擦除可编程只读存储器单元的工艺。 首先,形成P阱区域。 在P阱内形成第一N阱区,并且在与第一N阱间隔开的P阱内形成第二N阱区。 第一场氧化物层沉积在P阱,第一N阱和第二N阱上。 在第一场氧化物层上生长高电压氧化物层。 然后覆盖限定隧道窗的第一光致抗蚀剂掩模。 然后蚀刻第一场氧化物层和高电压氧化物层。 之后,剥去第一光致抗蚀剂掩模。 生长隧道氧化物层。 在隧道氧化物层的顶部生长多晶硅层,然后掺杂。 限定浮动栅极的第二光致抗蚀剂掩模覆盖在多晶硅层的顶部上。 然后蚀刻多晶硅层,剥离第二光致抗蚀剂掩模。