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    • 1. 发明授权
    • Method of an apparatus for programming an integrated fuse element to high resistance in low voltage technology
    • 用于在低电压技术中将集成熔丝元件编程为高电阻的装置的方法
    • US06420217B1
    • 2002-07-16
    • US09632375
    • 2000-08-03
    • Alexander KalnitskyPavel PoplevineAlbert Bergemont
    • Alexander KalnitskyPavel PoplevineAlbert Bergemont
    • H01L2182
    • H01L23/5256H01L27/101H01L2924/0002H01L2924/00
    • An integrated fuse element is capable of being programmed to high resistance in low voltage process technology. The fuse includes a stack of an undoped polysilicon layer and a silicide layer. A voltage applied across the stack is increases until a first agglomeration event occurs, whereby a discontinuity is formed in the silicide layer. The current is further increased to cause a second agglomeration event whereby the size of the discontinuity is increased. Each agglomeration event increases the resistance of the fuse. An extended-drain MOS transistor, capable of sustaining high voltage, is connected in series with the fuse for programming the fuse. The transistor includes: a well region in a substrate, the well region forming the drain of the transistor; an insulating trench in the well; and a polysilicon gate extending over a portion of the substrate, a portion of the well and a portion of the trench, wherein upon reverse-biasing the junction between the well and the substrate a depletion region is formed which encompasses at least the entire portion of the surface region of the well over which the polysilicon extends.
    • 集成的熔丝元件能够被编程为低电压工艺技术中的高电阻。 熔丝包括未掺杂的多晶硅层和硅化物层的堆叠。 施加在堆叠上的电压增加直到发生第一附聚事件,由此在硅化物层中形成不连续性。 电流进一步增加以引起第二聚集事件,从而增加不连续性的大小。 每个附聚事件会增加保险丝的电阻。 能够保持高电压的延伸漏极MOS晶体管与保险丝串联连接,以对熔丝进行编程。 晶体管包括:衬底中的阱区,形成晶体管的漏极的阱区; 井中的绝缘沟槽; 以及在所述衬底的一部分上延伸的多晶硅栅极,所述阱的一部分和所述沟槽的一部分,其中在反向偏置所述阱和所述衬底之间的结点时,形成耗尽区,所述耗尽区至少包括 多晶硅延伸的阱的表面区域。
    • 5. 发明授权
    • Extended drain MOSFET for programming an integrated fuse element to high resistance in low voltage process technology
    • 扩展漏极MOSFET,用于在低电压工艺技术中将集成保险丝元件编程为高电阻
    • US06525397B1
    • 2003-02-25
    • US09376161
    • 1999-08-17
    • Alexander KalnitskyPavel PoplevineAlbert Bergemont
    • Alexander KalnitskyPavel PoplevineAlbert Bergemont
    • H01L2900
    • H01L23/5256H01L27/101H01L2924/0002H01L2924/00
    • An integrated fuse element is capable of being programmed to high resistance in low voltage process technology. The fuse includes a stack of an undoped polysilicon layer and a silicide layer. A voltage applied across the stack is increases until a first agglomeration event occurs, whereby a discontinuity is formed in the silicide layer. The current is further increased to cause a second agglomeration event whereby the size of the discontinuity is increased. Each agglomeration event increases the resistance of the fuse. An extended-drain MOS transistor, capable of sustaining high voltage, is connected in series with the fuse for programming the fuse. The transistor includes: a well region in a substrate, the well region forming the drain of the transistor; an insulating trench in the well; and a polysilicon gate extending over a portion of the substrate, a portion of the well and a portion of the trench, wherein upon reverse-biasing the junction between the well and the substrate a depletion region is formed which encompasses at least the entire portion of the surface region of the well over which the polysilicon extends.
    • 集成的熔丝元件能够被编程为低电压工艺技术中的高电阻。 熔丝包括未掺杂的多晶硅层和硅化物层的堆叠。 施加在堆叠上的电压增加直到发生第一附聚事件,由此在硅化物层中形成不连续性。 电流进一步增加以引起第二聚集事件,从而增加不连续性的大小。 每个附聚事件会增加保险丝的电阻。 能够保持高电压的延伸漏极MOS晶体管与保险丝串联连接,以对熔丝进行编程。 晶体管包括:衬底中的阱区,形成晶体管的漏极的阱区; 井中的绝缘沟槽; 以及在所述衬底的一部分上延伸的多晶硅栅极,所述阱的一部分和所述沟槽的一部分,其中在反向偏置所述阱和所述衬底之间的结点时,形成耗尽区,所述耗尽区至少包括 多晶硅延伸的阱的表面区域。
    • 8. 发明授权
    • Electrostatic discharge protection device
    • 静电放电保护装置
    • US06169310A
    • 2001-01-02
    • US09205110
    • 1998-12-03
    • Alexander KalnitskyPavel PoplevineAlbert BergemontHengyang (James) Lin
    • Alexander KalnitskyPavel PoplevineAlbert BergemontHengyang (James) Lin
    • H01L2362
    • H01L27/0288
    • An ESD protection device for use with an integrated circuit that provides a low impedance resistive path between IC pads (including Vdd and Vss pads) when power to the IC is off, while assuring adequate isolation between the IC pads when the power is on. The device includes a semiconductor substrate (typically a p-type Si substrate) and at least two vertically integrated pinch resistors formed in the semiconductor substrate. Each of the vertically integrated pinch resistors is connected to a common electrical discharge line and to a pad. Each of the vertically integrated pinch resistors includes a deep well region and a first surface well region, both of the second conductivity type (typically n-type). The first surface well region circumscribes the deep well region, thereby forming a narrow channel region of the first conductivity type (e.g. p-type) therebetween. When no potential is applied to the first surface well regions (i.e. power is off), the two vertically integrated pinch resistors connected by the common electrical discharge line provide a low impedance resistive path between the pads for shunting ESD current. When a potential is applied to the first surface well region by the IC power supply (i.e. power is on), however, the width of the narrow channel region is pinched-off due to a potential-produced depletion region in the narrow channel region, thereby isolating the pads from each other. A process for the formation of the ESD protection device involves sequential formation of each of the device regions in a semiconductor substrate.
    • 一种与集成电路一起使用的ESD保护装置,当IC通电时,在IC焊盘(包括Vdd和Vss焊盘)之间提供低阻抗阻抗路径,同时在电源打开时确保IC焊盘之间的充分隔离。 该器件包括形成在半导体衬底中的半导体衬底(通常为p型Si衬底)和至少两个垂直集成的夹持电阻器。 每个垂直集成的夹持电阻器连接到公共放电线和焊盘。 每个垂直集成的夹持电阻器包括深阱区域和第二表面阱区域,第二导电类型(通常为n型)。 第一表面阱区域围绕深阱区域,从而在其间形成第一导电类型(例如p型)的窄通道区域。 当没有电位施加到第一表面阱区域(即电源关闭)时,通过公共放电线连接的两个垂直集成的夹持电阻器在焊盘之间提供了阻抗ESD阻抗的低阻抗路径,用于分流ESD电流。 然而,当通过IC电源将电势施加到第一表面阱区域(即,电源接通)时,窄通道区域的宽度由于窄沟道区域中的潜在产生的耗尽区而被截断, 从而将焊盘彼此隔离。 用于形成ESD保护装置的方法包括在半导体衬底中顺序地形成每个器件区域。
    • 9. 发明授权
    • Starter current source device with automatic shut-down capability and
method for its manufacture
    • 具有自动停机功能的起动电流源装置及其制造方法
    • US6078094A
    • 2000-06-20
    • US196458
    • 1998-11-19
    • Pavel PoplevineAlexander KalnitskyAlbert Bergemont
    • Pavel PoplevineAlexander KalnitskyAlbert Bergemont
    • H01L27/06H01L21/8238H01L27/092H01L29/80H01L29/00
    • H01L21/823892H01L27/092
    • An analog circuit starter current source device with automatic shut-down capability. The device includes a semiconductor substrate (typically p-type) with a deep well region (typically n-type) below its surface, a first surface well region (typically n-type) on the surface of the substrate that circumscribes the deep well region, and a narrow channel region (typically p-type) separating the deep well region from the first surface well region. The device also includes a first contact region for connecting the first surface well region to the analog circuit, and a second contact region for connecting a substrate region above the deep well to the analog circuit. The configuration provides a variable-width vertical resistor current path capable of starting an analog circuit and then being automatically shut-down by application of a potential to the first contact region sufficient to produce a depletion region that pinches-off the narrow channel region. A process for forming the starter current source device is also provided. The process includes first providing a semiconductor substrate (e.g. p-type), then forming a deep well region (e.g. n-type) below its surface. This is followed by the formation of a first surface well region (e.g. n-type) on the surface of the substrate such that the first surface well region circumscribes the deep well region, thereby producing a narrow channel (e.g. p-type) therebetween. Finally, a first contact region is formed on the surface of the first surface well region, while a second contact region is formed on the surface of semiconductor substrate above the deep well region.
    • 具有自动关机功能的模拟电路起动器电流源装置。 该器件包括在其表面下方具有深阱区(通常为n型)的半导体衬底(通常为p型),在衬底的表面上限定深阱区的第一表面阱区(通常为n型) 以及将深阱区域与第一表面阱区域分离的窄通道区域(通常为p型)。 该装置还包括用于将第一表面阱区域连接到模拟电路的第一接触区域和用于将深井上方的衬底区域连接到模拟电路的第二接触区域。 该配置提供了可变宽度的垂直电阻器电流路径,其能够启动模拟电路,然后通过向第一接触区域施加足以产生夹紧窄沟道区域的耗尽区域的电势自动关闭。 还提供了一种用于形成起动器电流源装置的工艺。 该方法包括首先提供半导体衬底(例如p型),然后在其表面下方形成深阱区域(例如n型)。 接着在衬底的表面上形成第一表面阱区域(例如n型),使得第一表面阱区域围绕深阱区域,从而在其间产生窄通道(例如p型)。 最后,在第一表面阱区域的表面上形成第一接触区域,而在深阱区域上方的半导体衬底的表面上形成第二接触区域。