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    • 5. 发明公开
    • 비휘발성 메모리 소자 및 이의 제조 방법
    • 非易失性存储器件及其制造方法
    • KR1020120105112A
    • 2012-09-25
    • KR1020110022695
    • 2011-03-15
    • 심재훈
    • 심재훈
    • H01L27/115H01L21/8247
    • H01L27/228G11C5/063G11C11/1659G11C13/0004G11C13/0007G11C13/0023G11C2213/79G11C2213/82H01L27/2436G11C11/165H01L27/2463
    • PURPOSE: A non-volatile memory device and a manufacturing method thereof are provided to form a highly integrated memory cell by forming the memory cell on the location lower than a word line and a bit line. CONSTITUTION: A source terminal a transistor is electrically connected to a source line(SL). A gate terminal is electrically connected to a word line(WL1) through a word line contact point(110). A drain terminal is connected to one end of a memory device(140). The other end of the memory device is electrically connected to a bit line(BL0) through a bit line contact point(120). A gate terminal of the transistor is formed into a gate oxide contacting the word line contact point. The word line contact point is placed on the bottom of the word line. The bit line contact point is placed on the bottom of the bit line.
    • 目的:提供非易失性存储器件及其制造方法,以通过在低于字线和位线的位置形成存储单元来形成高度集成的存储单元。 构成:源极端子晶体管电连接到源极线(SL)。 栅极端子通过字线接触点(110)电连接到字线(WL1)。 漏极端子连接到存储器件(140)的一端。 存储器件的另一端通过位线接触点(120)电连接到位线(BL0)。 晶体管的栅极端子形成为与字线接触点接触的栅极氧化物。 字线接触点放置在字线的底部。 位线接触点位于位线的底部。