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1. 发明授权

KR1019950009067B1 음영으로부터 이음새의 모양 결정을 이용하는 납땜 이음 검사 방법 및 장치 失效
标题翻译：用于检查使用形状确定的焊接接头的方法和方法
公开(公告)号：KR1019950009067B1
公开(公告)日：1995-08-14
申请号：KR1019910005570
申请日：1991-04-03
申请人： 레이티언 컴파니
发明人： 커트라이저
IPC分类号： G01B11/00
CPC分类号： H05K13/08 , G01N21/95684 , G01N2021/8816 , G01N2021/8845 , G01N2021/8887 , G01N2021/95646 , G01N2201/102
摘要： 내용 없음.

2. 发明公开

KR1020090125057A 단일 및 다중-스펙트럼 조명 시스템 및 방법 无效
标题翻译：单和多光谱照明系统和方法
公开(公告)号：KR1020090125057A
公开(公告)日：2009-12-03
申请号：KR1020097016562
申请日：2008-01-03
申请人： 일리노이즈 툴 워크스 인코포레이티드
发明人： 프린스,데이비드,피.
IPC分类号： B41F15/06 , G01B11/24 , B23K35/14
CPC分类号： H05K3/1216 , G01N21/8806 , G01N21/95684 , G01N2021/8825 , G01N2021/95646 , H05K1/0268 , H05K2203/163 , Y10T29/5193
摘要： A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste onto the electronic substrate, an imaging system constructed and arranged to capture an image of the electronic substrate, and a controller coupled to the imaging system and configured to control movement of the imaging system to capture the image. The imaging system comprises a camera element configured to capture the image of at least the portion of the surface of the electronic substrate, and a first illumination element comprising a long-wavelength light source configured to illuminate at least the portion of the surface of the electronic substrate by generating long-wavelength light. Other embodiments and methods are disclosed.
摘要翻译：一种用于将焊膏沉积到电子基板的表面上的模版印刷装置，包括框架，耦合到框架的模板，具有多个孔的模板，耦合到框架的分配器，模板和分配器被配置将所述焊膏沉积到所述电子基板上，所述成像系统被构造和布置成捕获所述电子基板的图像;以及控制器，耦合到所述成像系统并被配置为控制所述成像系统的拍摄以捕获图像。成像系统包括被配置为捕获电子基板的表面的至少一部分的图像的相机元件，以及第一照明元件，其包括长波长光源，该长波长光源被配置为照亮电子基板的表面的至少一部分底物通过产生长波长的光。公开了其他实施例和方法。

3. 发明公开

KR1020000016969A 기판 납땜 검사용 조명 및 광학 장치 失效
标题翻译：用于基板焊接试验的光和光学装置
公开(公告)号：KR1020000016969A
公开(公告)日：2000-03-25
申请号：KR1019990030511
申请日：1999-07-27
申请人： 삼성전자주식회사
发明人： 김재선
IPC分类号： H05K13/08
CPC分类号： G01N21/8806 , G01N21/95684 , G01N2021/8835 , G01N2021/95646 , G01N2201/06153 , G01N2201/062 , H05K13/08
摘要： PURPOSE: An optical apparatus for a substrate soldering tester is provided to improve a text speed and a test reliability corresponding to a size variation of a text object part by taking a picture of the test object part through two cameras having different magnification. CONSTITUTION: The optical apparatus for a substrate soldering tester comprises: a first light part (31) which lights a test object part attached to a substrate, vertically on the basis of a little inclined axis from a view axis of a camera; a second light part (32) which is installed so as to light almost horizontally differently from a light angle of the first light part; a reflected light transfer part (43) which divides and outputs a reflected light from the test object part by two and has an adjustment part for controlling an intensity of illumination of the first and second light parts and a power on/off; a large view camera and a small view camera which take a picture of reflected lights divided by the transfer part, respectively; a large view lens and a small view lens which adjust a size of a view taken by the cameras into a large view and a small view.
摘要翻译：目的：提供一种用于基板焊接测试仪的光学装置，通过通过具有不同放大倍数的两个相机拍摄测试对象部分的图片来提高与文本对象部分的尺寸变化相对应的文本速度和测试可靠性。构成：基板焊接试验机的光学装置包括：第一光部（31），其基于相机的视轴的一点倾斜的轴垂直地点亮附着于基板的被检体部; 第二光部件（32），其安装成几乎水平地与第一光部件的光角不同地发光; 反射光传输部分43，其将来自测试对象部分的反射光分离并输出两个，并具有用于控制第一和第二光部分的照明强度的调节部分和电源开/关; 分别通过转印部分分别反射的照片的大型观看照相机和小型照相机; 将相机拍摄的视野的大小调整为大视野和小视野的大视角透镜和小视野镜。

4. 发明授权

KR1019960002545B1 프린트기판상의 랜드의 최소고리폭 검사 방법 및 장치 失效
标题翻译：检查印刷电路板上土地最小极值宽度的方法和装置
公开(公告)号：KR1019960002545B1
公开(公告)日：1996-02-22
申请号：KR1019910020986
申请日：1991-11-22
申请人： 가부시키가이샤 스크린 홀딩스
发明人： 기타카도류우지 , 쓰지나카히사유키 , 호키테쓰오 , 오오마에다카오
IPC分类号： G06T1/00
CPC分类号： G06T7/0006 , G01N21/956 , G01N2021/95646 , G01N2021/95653 , G01R31/309 , G06T7/62 , G06T2207/30141
摘要： 내용 없음.
摘要翻译：印刷图案设置有布线图案，该布线图案具有由陆片包围的平台和通孔。布线图案和通孔由光电图像传感器读取，以分别获得图案图像和孔图像。图案图像由图案图像定义，从孔图像获得具有环状形状的孔规图像。图案规格图像的反转图像和孔规信号之间的逻辑积产生突出区域图像。将操作者应用于突出图像。由于孔规图像具有各向同性轮廓，因此检测出平台的最小环形宽度，而与通孔偏离平台的方向无关。

5. 发明授权

KR101867796B1 땜납 재료, 땜납 이음 및 땜납 재료의 검사 방법 有权
公开(公告)号：KR101867796B1
公开(公告)日：2018-06-15
申请号：KR1020187002608
申请日：2016-06-23
申请人： 센주긴조쿠고교 가부시키가이샤
发明人： 가와사키히로요시 , 니시노도모아키 , 롭폰기다카히로 , 사토이사무 , 가와마타유지
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34 , B22F1/02
CPC分类号： B23K35/0244 , B22F1/00 , B22F1/0048 , B22F1/0085 , B22F1/02 , B22F1/025 , B23K35/0227 , B23K35/0238 , B23K35/025 , B23K35/262 , B23K35/302 , B23K35/3033 , B23K35/3046 , B23K35/3602 , B23K35/365 , C22C13/00 , G01N21/951 , G01N21/95684 , G01N2021/95646 , H01L23/49816 , H01L24/00 , H01L24/13 , H01L2224/13016 , H01L2224/13582 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2924/20105
摘要： 산화되기어려운땜납재료를정확하게분별한다. Cu 핵볼은, 소정의크기를갖고반도체패키지와프린트기판사이에서간격을확보하는 Cu 볼과, Cu 볼을피복하는땜납층을구비하고있다. Cu 핵볼은, 온도가 25℃, 습도가 40%인실내에있어서의 150℃의항온조에서의 72시간의연소시험후의 Lab표색계에있어서의명도가 62.5 이상이고, 연소시험전의땜납재료의 Lab표색계에있어서의명도가 65 이상, 또한 Lab표색계에있어서의황색도가 7.0 이하이다.

6. 发明公开

KR1020180014217A 땜납 재료, 땜납 이음 및 땜납 재료의 검사 방법 有权
标题翻译：焊料，焊点和检查焊料的方法
公开(公告)号：KR1020180014217A
公开(公告)日：2018-02-07
申请号：KR1020187002608
申请日：2016-06-23
申请人： 센주긴조쿠고교 가부시키가이샤
发明人： 가와사키히로요시 , 니시노도모아키 , 롭폰기다카히로 , 사토이사무 , 가와마타유지
IPC分类号： B23K35/26 , C22C13/00 , H05K3/34 , B22F1/02
CPC分类号： B23K35/0244 , B22F1/00 , B22F1/0048 , B22F1/0085 , B22F1/02 , B22F1/025 , B23K35/0227 , B23K35/0238 , B23K35/025 , B23K35/262 , B23K35/302 , B23K35/3033 , B23K35/3046 , B23K35/3602 , B23K35/365 , C22C13/00 , G01N21/951 , G01N21/95684 , G01N2021/95646 , H01L23/49816 , H01L24/00 , H01L24/13 , H01L2224/13016 , H01L2224/13582 , H01L2224/13611 , H01L2224/13655 , H01L2224/13657 , H01L2924/20105 , H05K3/34
摘要： 산화되기어려운땜납재료를정확하게분별한다. Cu 핵볼은, 소정의크기를갖고반도체패키지와프린트기판사이에서간격을확보하는 Cu 볼과, Cu 볼을피복하는땜납층을구비하고있다. Cu 핵볼은, 온도가 25℃, 습도가 40%인실내에있어서의 150℃의항온조에서의 72시간의연소시험후의 Lab표색계에있어서의명도가 62.5 이상이고, 연소시험전의땜납재료의 Lab표색계에있어서의명도가 65 이상, 또한 Lab표색계에있어서의황색도가 7.0 이하이다.
摘要翻译：准确区分难以被氧化的焊料。铜haekbol提供具有Cu球和覆盖具有预定尺寸，以确保半导体封装与印刷电路板之间的间隙中的Cu焊球的焊料层。铜haekbol是，温度25℃，湿度，亮度是在以150℃的恒温浴中72小时试验的燃烧后的Lab测色系统中的至少62.5，人的40％之内，在焊接材料的Lab颜色系统中燃烧试验前 Lab比色系统中的黄度为7.0或更低。

7. 发明公开

KR1020170009524A 검사 시스템 및 검사 방법 有权
标题翻译：检查系统和检查方法
公开(公告)号：KR1020170009524A
公开(公告)日：2017-01-25
申请号：KR1020150101735
申请日：2015-07-17
申请人： 주식회사 고영테크놀러지
发明人： 서승애 , 안원미 , 이혜인 , 이종휘
IPC分类号： G01B11/25 , G01B11/06 , G01B11/02 , G06T7/60 , G06T7/00
CPC分类号： G01B11/02 , G01B11/0608 , G01B11/25 , G01B11/2527 , G01N21/95684 , G01N2021/95615 , G01N2021/95646 , G06T7/00 , G06T7/0004 , G06T7/50 , G06T7/60 , G06T2207/30152 , H05K1/0269 , H05K3/3478 , H05K2203/163
摘要： 검사대상체의양호및 불량여부에따라검사대상체의윤곽에대해이미지처리를수행하고, 이미지처리된윤곽을검사대상체의양호및 불량여부를판단하기위한기준정보와중첩하여표시하는검사시스템및 검사방법이개시된다. 본발명에따른검사시스템은, 검사대상체에광을조사하여검사대상체의이미지를획득하는측정부와, 검사대상체의이미지에대해상기검사대상체의윤곽을검출하는처리부와, 윤곽을기준정보와중첩하여표시하는출력부를포함하고, 처리부는, 기준정보를바탕으로윤곽에대한양호및 불량여부를판단하여양호및 불량여부에따라윤곽에대한이미지처리를수행한다.
摘要翻译：公开了一种检查系统和检查方法，其根据被检查物体是否良好或有缺陷地对被检查物体的轮廓进行图像处理; 并且通过与用于确定被检查对象是否良好或有缺陷的参考信息重叠来显示图像处理的轮廓。根据本发明的检查系统包括：数据获取单元，用于用光照射被检查物体，以便获取待检查对象的图像数据; 处理单元，用于根据被检查对象的图像数据检测被检查对象的轮廓; 以及输出单元，用于通过与参考信息重叠来显示轮廓，其中处理单元基于参考信息来确定轮廓是否精细或有缺陷，从而根据轮廓是否精细地对轮廓进行图像处理或有缺陷。

8. 发明公开

KR1020140060667A 기판 검사방법 有权
标题翻译：板检查方法
公开(公告)号：KR1020140060667A
公开(公告)日：2014-05-21
申请号：KR1020120127241
申请日：2012-11-12
申请人： 주식회사 고영테크놀러지
发明人： 정중기
IPC分类号： G01B11/24 , H05K13/08
CPC分类号： G01N21/956 , G01N2021/8845 , G01N2021/95646
摘要： In order to inspect a substrate, an inspection area including a solder joint of a component mounted on the substrate is irradiated with a first light having a first color, a second light having a second color other than the first color, and a third light having a third color other than the first and second colors at a first inclination angle, a second inclination angle smaller than the first inclination angle, and a third inclination angle smaller than the second inclination angle, respectively. Then, color images of the inspection area are obtained by the first, second, and third light radiated to the inspection area. Then, a defect of the solder joint is detected using the color distribution showing on the color images. In addition, the inspection results are verified using height information of the previously measured solder joint, thereby preventing inspection errors.
摘要翻译：为了检查基板，将包括安装在基板上的部件的焊接点的检查区域照射具有第一颜色的第一光，具有除了第一颜色之外的第二颜色的第二光，以及具有分别以第一倾斜角度为第一颜色和第二颜色以外的第三颜色，小于第一倾斜角度的第二倾斜角度和小于第二倾斜角度的第三倾斜角度。然后，通过照射到检查区域的第一，第二和第三光获得检查区域的彩色图像。然后，使用彩色图像上显示的颜色分布来检测焊点的缺陷。此外，使用先前测量的焊点的高度信息来验证检查结果，从而防止检查错误。

9. 发明授权

KR100345001B1 기판 납땜 검사용 조명 및 광학 장치 失效
标题翻译：用于检查印刷电路板焊接状态的照明和光学装置
公开(公告)号：KR100345001B1
公开(公告)日：2002-07-19
申请号：KR1019990030511
申请日：1999-07-27
申请人： 삼성전자주식회사
发明人： 김재선
IPC分类号： H05K13/08
CPC分类号： G01N21/8806 , G01N21/95684 , G01N2021/8835 , G01N2021/95646 , G01N2201/06153 , G01N2201/062 , H05K13/08
摘要： 개시된조명및 광학장치는표면실장장치에서기판의표면에납땜된각종전자부품들의장착및 납땜상태를자동으로검사할수 있도록균일하게조명하고검사할전자부품의크기에따라적절한시야로촬영하는것이다. 상면이수평면을이루고측면에경사면을이루는고정부재의상면에서로다른직경및 동일한높이를가지고복수의램프가복수의링 형상으로배열된제 1 조명수단을설치하여검사대상부품을조명함과아울러고정부재의경사면에설치되어서로다른직경및 상이한높이를가지고복수의램프가복수의링 형상으로배열된제 2 조명수단을설치하여제 1 조명수단에의하여얻어지는영상에대하여음영이반전된영상을얻을수 있도록검사대상부품을조명하고, 조절수단으로제 1 및제 2 조명수단의밝기와전원단속을단속하며, 고정부재의상부에는광학수단이설치되어조절수단에의해제 1 및제 2 조명수단이선택적으로조명하는검사대상부품을대시야및 소시야로촬영한다.

10. 发明授权

KR1019960005093B1 본딩와이어 검사장치 失效
标题翻译：连接线检查装置
公开(公告)号：KR1019960005093B1
公开(公告)日：1996-04-20
申请号：KR1019920022047
申请日：1992-11-23
申请人： 가부시키가이샤 신가와
发明人： 스가하라겐지
IPC分类号： H01L21/66
CPC分类号： H01L21/681 , G01N21/88 , G01N2021/8887 , G01N2021/95646 , H01L21/67138 , H01L22/12 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/05553 , H01L2224/05554 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/49175 , H01L2224/78 , H01L2224/85 , H01L2224/859 , H01L2924/00014 , H01L2924/01033 , H01L2924/01039 , H01L2924/01082 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： An apparatus for inspecting, for example, balls and crescents of wires bonded between a semiconductor chip and a lead frame including an optical system installed above an object of inspection, a vertical illuminator that illuminates the object of inspection, a CCD camera which has a photoelectric converter element provided at an imaging level of the optical system, and X, Y and Z tables which move the CCD camera in the X, Y and Z directions. Since only the photoelectric converter element of the CCD camera is movable in the X, Y and Z directions when focusing is made into the object of inspection, the size of the X, Y and Z tables can be small, and in addition, since the optical system and vertical illuminator are not movable, dirt is prevented from falling onto the object of inspection.

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