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    • 4. 发明公开
    • 음각처리를 이용한 도금방법
    • 使用多层镍沉淀工艺的镀层方法
    • KR1020130126233A
    • 2013-11-20
    • KR1020120050167
    • 2012-05-11
    • 현대자동차주식회사
    • 이창섭
    • C23C28/00C23C18/16C23F1/00
    • C25D5/40C25D5/02C25D5/14C25D5/48
    • The invention relates to a plating method by using a multi-layer nickel intaglio process among material surface processes, and to a method for plating a metal on a surface of material comprising: a step for forming a copper plated layer and a semi-gloss nickel plated layer on a surface of a raw material; a step for forming a gloss nickel plated layer on the semi-gloss nickel plated layer; a step for forming a matt nickel plated layer on the gloss nickel plated layer; a step for masking a masking jig of a plate shape, in which an arbitrary graphic is punched, on the matt nickel plated layer; a step for engraving the masked matt nickel plated layer; a step for removing the masking jig from the matt nickel plated layer; a step for forming an MP nickel plated layer on the engraved matt nickel plated layer; and a step for forming a chrome plated layer on the MP nickel plated layer. The plating method by using a multi-layer nickel intaglio process improves an appearance of an outer, and gives a differentiation to a product by implementing a graphic, in which a gloss and a matt are contrasted by processing an intaglio including an acid treatment or a sand blast etc.
    • 本发明涉及通过在材料表面工艺中使用多层镍凹版印刷方法的镀覆方法以及用于在材料表面上镀覆金属的方法,包括:形成镀铜层和半光泽镍 在原料表面上镀覆层; 在半光泽镀镍层上形成光泽镀镍层的步骤; 在光泽镀镍层上形成无光泽镀镍层的步骤; 在平板镀镍层上掩蔽其中冲压有任意图形的板状掩模夹具的步骤; 用于雕刻掩模的无光镀镍层的步骤; 从无光镀镍层除去掩模夹具的步骤; 在雕刻的无光镀镍层上形成MP镍镀层的步骤; 以及在MP镀镍层上形成镀铬层的步骤。 通过使用多层镍凹版工艺的电镀方法改善了外观的外观,并且通过实施图形来赋予产品的区分,其中光泽和无光泽通过加工包括酸处理或凹版的凹版来对比 喷沙等
    • 6. 发明公开
    • 초임계유체를 이용한 박막 니켈 도금방법 및 그에 따른 장치
    • 通过使用超临界流体作为溶剂进行镀层,可以减少废水产生和形成高品质的镀层的装置和方法
    • KR1020050021630A
    • 2005-03-07
    • KR1020030058611
    • 2003-08-25
    • 학교법인 성균관대학
    • 이용철김문선홍교민
    • C25D3/12
    • C25D5/003C23G5/00C25D3/12C25D5/40C25D17/00C25D21/12C25D21/18C25F1/00
    • PURPOSE: To provide an apparatus and a method for performing plating using super critical fluid to substantially reduce generation of wastewater, thereby reduce the bad effect of environmental pollution and form a plating film having compact nickel plating structure and excellent plating quality. CONSTITUTION: The apparatus for plating a thin nickel film using super critical fluid comprises: a first storage tank(2) for storing the super critical fluid; a cooler(3) transferring the super critical fluid after cooling the super critical fluid flown in from the first storage tank; a second storage tank(9) for storing a mixed solvent of solvent, electrolyte and surfactant; a transfer part(4) comprising a mixer(42) and a transfer pump(44) for mixing the super critical fluid transferred from the first storage tank and the cooler with the mixed solvent transferred from the second storage tank; a plating pot(7) in which a nickel plate that is a plating body and a metal plate that is a plating object are stationed, and to which a power supply is impressed to perform plating reaction on the super critical fluid and the mixed solvent transferred from the transfer part; a third storage tank(6) communicated with the plating pot to recover the super critical fluid remained in the plating pot after finishing plating; a recovery pipe(10) communicated with the plating pot to recover the mixed solvent remained in the plating pot to the cooler after finishing plating; a controller(5) for controlling inflow amounts of the super critical fluid and the mixed solvent, reaction conditions in the plating pot and recovery of the super critical fluid and the mixed solvent remained after finishing plating; and a video unit(8) for observing reaction process of the plating pot.
    • 目的:提供使用超临界流体进行电镀的装置和方法,以显着减少废水的产生,从而减少环境污染的不良影响,形成具有紧凑的镍电镀结构和优异的电镀质量的电镀膜。 构成:使用超临界流体镀镍薄膜的设备包括:用于储存超临界流体的第一储罐(2); 冷却器(3)在冷却从第一储罐流入的超临界流体之后传送超临界流体; 用于储存溶剂,电解质和表面活性剂的混合溶剂的第二储罐(9) 转移部分(4),包括混合器(42)和输送泵(44),用于将从第一储罐和冷却器转移的超临界流体与从第二储罐转移的混合溶剂混合; 设置作为电镀体的镍板和作为电镀对象的金属板的电镀槽(7),向超临界流体和转移的混合溶剂施加电源施加电镀反应 从转移部分; 与电镀槽连通的第三储罐(6),以回收在电镀后残留在镀槽中的超临界流体; 与电镀槽连通以回收混合溶剂的回收管(10)在电镀完成后残留在电镀槽中至冷却器; 用于控制超临界流体和混合溶剂的流入量的控制器(5),电镀槽中的反应条件和超临界流体和混合溶剂的回收在电镀后残留; 以及用于观察电镀锅的反应过程的视频单元(8)。