专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

KR101800914B1 평면 캐비티 ＭＥＭＳ 및 관련 스트럭처, 그 제조 방법 및 디자인 스트럭처 有权
标题翻译：平面腔体MEMS及相关结构，其制造方法及其设计结构
公开(公告)号：KR101800914B1
公开(公告)日：2017-11-23
申请号：KR1020127033926
申请日：2011-06-08
申请人： 인터내셔널 비지네스 머신즈 코포레이션
发明人： 던바,조지,에이. , 허,중-샹 , 몰링,제프리,씨. , 머피,윌리암,제이. , 스탬퍼,앤서니,케이.
IPC分类号： H01L29/84
CPC分类号： B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
摘要： 적어도하나의미세전자기계시스템 (MEMS)를형성하는방법은기판상에하부배선층을형성하는단계를포함한다. 상기방법은상기하부배선층으로부터복수의분리된와이어들 (14)를형성하는단계를더 포함한다. 상기방법은상기복수의분리된와이어들위에전극빔 (38)을형성하는단계를더 포함한다. 상기전극빔과상기복수의분리된와이어들을형성하는단계중 적어도하나는후속실리콘증착 (50)에서힐록(hillock)들과트리플포인트(triple point)들을최소화하는레이아웃으로형성된다.
摘要翻译：形成至少一个微机电系统（MEMS）的方法包括在衬底上形成下布线层。该方法还包括从下互连层形成多个分立导线（14）。该方法进一步包括在多个分立线上形成电极梁（38）。形成电极梁和多个分立导线的步骤中的至少一个步骤形成为使随后的硅沉积（50）中的小丘和三重点最小化的布局。

2. 发明公开

KR1020130020685A 평면 캐비티 ＭＥＭＳ 및 관련 스트럭처, 그 제조 방법 및 디자인 스트럭처 无效
标题翻译：平面CAVITY MEMS及相关结构，制造方法和设计结构
公开(公告)号：KR1020130020685A
公开(公告)日：2013-02-27
申请号：KR1020127031138
申请日：2011-06-08
申请人： 인터내셔널 비지네스 머신즈 코포레이션
发明人： 헤린,러셀,티. , 잔스,크리스토퍼,브이. , 스탬퍼,앤서니,케이. , 화이트,에릭,제이.
IPC分类号： B81C1/00 , B81B3/00 , H01H59/00
CPC分类号： B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
摘要： 적어도 하나의 미세전자기계시스템 (MEMS) 캐비티 (60b)를 형성하는 방법은 배선층 (14)와 기판 (10) 위에 제1 희생 캐비티 층 (18)을 형성하는 단계를 포함한다. 상기 방법은 제1 희생 캐비티 층 위에 절연물 층 (40)을 형성하는 단계를 더 포함한다. 상기 방법은 상기 절연물 층에 리버스 다마신 에치백 공정을 수행하는 단계를 더 포함한다. 상기 방법은 상기 절연물 층과 제1 희생 캐비티 층을 평탄화하는 단계를 더 포함한다. 상기 방법은 상기 MEMS의 제1 캐비티 (60b)의 평면의 표면까지 제1 희생 캐비티 층을 벤팅 또는 스트리핑하는 단계를 더 포함한다.

3. 发明公开

KR1020110099161A 스위치 및 그 제조 방법 및 릴레이 失效
标题翻译：开关及其制造方法及继电器
公开(公告)号：KR1020110099161A
公开(公告)日：2011-09-07
申请号：KR1020110007598
申请日：2011-01-26
申请人： 오므론 가부시키가이샤
发明人： 마스다타카히로 , 요시타케나오키 , 히누마켄이치 , 야마모토준야 , 후지사와타카시 , 후지와라타케시
IPC分类号： H01H59/00 , B81B3/00 , H01H49/00
CPC分类号： H01H1/06 , B81B2201/014 , B81C1/00166 , B81C2201/0177 , B81C2201/0181 , B81C2201/0184 , H01H1/0036 , H01H2001/0052 , Y10T29/49105
摘要： A switch and a relay include a contact with a smooth contacting surface. A side surface of a fixed contact faces a side surface of a movable contact. The fixed contact has an insulating layer and a base layer stacked on a fixed contact substrate, and a first conductive layer formed thereon through electrolytic plating. The side surface of the first conductive layer that faces the movable contact becomes the fixed contact (contacting surface). The movable contact has an insulating layer and a base layer stacked on the movable contact substrate, and a movable contact formed thereon through electrolytic plating. A side surface of a second conductive layer that faces the fixed contact becomes the movable contact (contacting surface). The fixed contact and the movable contact have surfaces that contact the side surfaces of the mold portion when growing the first and second conductive layers through electrolytic plating.

4. 发明公开

KR1020080087730A ＭＥＭＳ 디바이스 및 상기 ＭＥＭＳ 디바이스를 구비한휴대용 통신 단말기 失效
标题翻译：具有标定MEMS器件的MEMS器件和便携式通信终端
公开(公告)号：KR1020080087730A
公开(公告)日：2008-10-01
申请号：KR1020080027787
申请日：2008-03-26
申请人： 가부시끼가이샤 도시바
发明人： 가와꾸보다까시 , 나가노도시히꼬 , 니시가끼미찌히꼬
IPC分类号： B81B7/02 , B81B7/00 , H04B1/40
CPC分类号： H01L41/094 , B81B3/001 , B81B2201/014 , H01G5/18 , H01H59/0009 , H01H2057/006 , H01H2059/0072
摘要： A MEMS(Micro-Electro-Mechanical System) device and a portable communication terminal with the same are provided to achieve a highly reliable DC-type MEMS switch having low driving voltage and low contact resistance. A MEMS device includes a substrate(1), a supporting unit(7), a fixed electrode(10), an actuator, and a stopper(9). The supporting unit and the fixed electrode are formed on the substrate. The actuator includes first and second electrodes, and a first piezoelectric layer. The first piezoelectric layer is formed on the first electrode. The second electrode is formed on the first piezoelectric layer. The supporting unit fixes one end of the actuator on the substrate. The stopper is formed on a line connecting the supporting unit and the fixed electrode and faces the first electrode.
摘要翻译：提供了一种具有低驱动电压和低接触电阻的高可靠性DC型MEMS开关的MEMS（微电子机械系统）装置及其便携式通信终端。 MEMS器件包括基板（1），支撑单元（7），固定电极（10），致动器和止动件（9）。支撑单元和固定电极形成在基板上。致动器包括第一和第二电极以及第一压电层。第一压电层形成在第一电极上。第二电极形成在第一压电层上。支撑单元将致动器的一端固定在基板上。止动件形成在连接支撑单元和固定电极并且面对第一电极的线上。

5. 发明公开

KR1020030013130A 고감도 초소형 캔틸레버 센서 및 제조 방법 失效
标题翻译：高灵敏度微型CANTILEVER传感器及其制造方法
公开(公告)号：KR1020030013130A
公开(公告)日：2003-02-14
申请号：KR1020010047464
申请日：2001-08-07
申请人： 한국과학기술연구원
发明人： 김태송 , 김형준 , 김용범
IPC分类号： B81B7/02
CPC分类号： B81B7/02 , B81B3/0021 , B81B2201/014 , B81B2201/02 , B81B2203/0118 , B81C1/00134 , H01L41/22
摘要： PURPOSE: A high sensitivity micro cantilever sensor and a method for manufacturing the same are provided to reduce the size of a system by sensing an electric signal and obtain prompt response to sensing. CONSTITUTION: A high sensitivity micro cantilever sensor includes a cantilever, an upper substrate formed of one piezoelectric cell at the upper surface of the cantilever and the other piezoelectric cell at the lower surface of the cantilever, wherein the piezoelectric cells include a piezoelectric film(62) and electrodes(61,63) formed at the upper and lower surfaces of the piezoelectric film, a lower substrate(32) having a cavity(34) in regular depth, wherein the piezoelectric cell lower surface of the upper substrate is adhered to the surface of the lower substrate in which the cavity is formed.
摘要翻译：目的：提供高灵敏度微悬臂传感器及其制造方法，以通过感测电信号并获得对感测的迅速响应来减小系统的尺寸。构成：高灵敏度微悬臂传感器包括悬臂，在悬臂的上表面由一个压电单元形成的上基板和在悬臂的下表面处的另一个压电单元，其中压电单元包括压电薄膜（62 ）和形成在压电膜的上表面和下表面的电极（61,63），具有规则深度的空腔（34）的下基板（32），其中上基板的压电单元下表面粘附到形成空腔的下基板的表面。

6. 发明公开

KR1020030013129A 고감도 초소형 캔틸레버 센서 및 그 제조방법 失效
标题翻译：高灵敏度微型CANTILEVER传感器及其制造方法
公开(公告)号：KR1020030013129A
公开(公告)日：2003-02-14
申请号：KR1020010047463
申请日：2001-08-07
申请人： 한국과학기술연구원
发明人： 김태송 , 김형준 , 김용범
IPC分类号： B81B7/02
CPC分类号： B81B7/02 , B81B3/0021 , B81B2201/014 , B81B2201/02 , B81B2203/0118 , B81C1/00134 , H01L41/22
摘要： PURPOSE: A high sensitivity micro cantilever sensor and a method for manufacturing the same are provided to reduce the size of a system by sensing an electric signal, speed up response rate by executing driving and sensing at the same time, and improve sensing property. CONSTITUTION: A high sensitivity micro cantilever sensor includes a cantilever, an upper substrate formed of one or two piezoelectric cells including a piezoelectric film(36) at the lower surface of the cantilever and electrodes(35,37) formed at the upper and lower surfaces of the piezoelectric film, a lower substrate(32) having a cavity(34) in regular depth, wherein the piezoelectric cell lower surface of the upper substrate is adhered to the surface of the lower substrate in which the cavity is formed.
摘要翻译：目的：提供高灵敏度微悬臂传感器及其制造方法，以通过感测电信号来减小系统的尺寸，同时通过执行驱动和感测来加快响应速度，并提高感测特性。构成：高灵敏度微悬臂传感器包括悬臂，由一个或两个压电单元形成的上基板，包括在悬臂的下表面处的压电膜（36）和形成在上表面和下表面的电极（35,37），具有规则深度的空腔（34）的下基板（32），其中上基板的压电单元下表面粘附到形成有空腔的下基板的表面。

7. 发明公开

KR1020130118228A 평면 캐비티 ＭＥＭＳ 및 관련 스트럭처, 그 제조 방법 및 디자인 스트럭처 有权
标题翻译：平面腔体MEMS及相关结构，其制造方法及其设计结构
公开(公告)号：KR1020130118228A
公开(公告)日：2013-10-29
申请号：KR1020127033926
申请日：2011-06-08
申请人： 인터내셔널 비지네스 머신즈 코포레이션
发明人： 던바,조지,에이. , 허,중-샹 , 몰링,제프리,씨. , 머피,윌리암,제이. , 스탬퍼,앤서니,케이.
IPC分类号： H01L29/84
CPC分类号： B81B3/0072 , B81B3/0021 , B81B2201/01 , B81B2201/014 , B81B2203/0118 , B81B2203/0315 , B81B2203/04 , B81C1/0015 , B81C1/00365 , B81C1/00476 , B81C1/00619 , B81C1/00626 , B81C1/00666 , B81C2201/0109 , B81C2201/013 , B81C2201/0167 , B81C2201/017 , B81C2203/0136 , B81C2203/0172 , G06F17/5068 , G06F17/5072 , H01H1/0036 , H01H57/00 , H01H59/0009 , H01H2057/006 , H01L41/1136 , H01L2924/0002 , Y10S438/937 , Y10T29/42 , Y10T29/435 , Y10T29/49002 , Y10T29/49105 , Y10T29/49121 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/5313 , H01L2924/00
摘要： 적어도 하나의 미세전자기계시스템 (MEMS)를 형성하는 방법은 기판상에 하부 배선 층을 형성하는 단계를 포함한다. 상기 방법은 상기 하부 배선 층으로부터 복수의 분리된 와이어들 (14)를 형성하는 단계를 더 포함한다. 상기 방법은 상기 복수의 분리된 와이어들 위에 전극빔 (38)을 형성하는 단계를 더 포함한다. 상기 전극빔과 상기 복수의 분리된 와이어들을 형성하는 단계 중 적어도 하나는 후속 실리콘 증착 (50)에서 힐록(hillock)들과 트리플 포인트(triple point)들을 최소화하는 레이아웃으로 형성된다.

8. 发明公开

KR1020100041710A 양방향 마이크로전기기계소자 및 기계적 크리프 감소 방법 无效
标题翻译：具有双向元件的MEMS器件
公开(公告)号：KR1020100041710A
公开(公告)日：2010-04-22
申请号：KR1020097027214
申请日：2008-06-26
申请人： 알카텔-루센트 유에스에이 인코포레이티드
发明人： 가스패리안아르만 , 게이츠존반아타 , 시몬마리아엘리나
IPC分类号： B81B3/00
CPC分类号： H01H1/0036 , B81B3/0024 , B81B2201/014 , B81B2201/031 , H01H37/00 , H01H2001/0047 , H01H2037/008 , H01H2061/006 , H01H2061/008
摘要： The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.
摘要翻译：本发明提供一种双向微电子机械元件，包括双向元件的微机电开关，以及减少双向元件中机械蠕变的方法。在一个实施例中，双向微机电元件包括具有自由端的冷梁和连接到冷束锚的第一端。冷梁锚附接到基板。第一束对通过自由端系绳连接到冷束，并且被构造成在被加热时延伸到比冷束的温度更大的温度。第二光束对位于与第一光束对的冷光束的相对侧上，并且通过自由端系绳耦合到第一光束对和冷光束。第二束对被配置成在被加热时延长到更高的温度。

9. 发明公开

KR1020080091140A 3차원 마이크로구조 및 3차원 마이크로구조의 형성 방법 无效
标题翻译：三维微结构的三维微结构和方法制作三维微结构
公开(公告)号：KR1020080091140A
公开(公告)日：2008-10-09
申请号：KR1020087016893
申请日：2006-12-19
申请人： 폼팩터, 인코포레이티드
发明人： 매티유개탄엘 , 팡트렐리안트 , 홉스에릭디
IPC分类号： H01L21/20 , H01L21/00
CPC分类号： B81C1/0046 , B33Y10/00 , B81B2201/014 , B81B2203/0118 , B81C2201/0184 , B81C2201/0197 , C23C18/1608 , C23C18/1844 , C25D1/003 , C25D1/12 , C25D5/02 , G01R1/06755 , G01R3/00 , H01L21/288 , H01L21/76873 , H01L2924/0001 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01055 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/1461 , H05K3/1275 , H01L2224/13099 , H01L2924/00
摘要： Systems and methods for depositing a plurality of droplets in a three-dimensional array are disclosed. The array can comprise a first type of droplets disposed to form a support structure and a second type of droplets forming a conductive seed layer on the support structure. A structure material can be electrodeposited onto the seed layer to create a three-dimensional structure.
摘要翻译：公开了用于在三维阵列中沉积多个液滴的系统和方法。阵列可以包括设置成形成支撑结构的第一类型的液滴和在支撑结构上形成导电种子层的第二类型的液滴。可以将结构材料电沉积到种子层上以产生三维结构。

10. 发明公开

KR1020060017499A ＭＥＭＳ 액추에이터 无效
标题翻译： MEMS执行器
公开(公告)号：KR1020060017499A
公开(公告)日：2006-02-23
申请号：KR1020057020130
申请日：2004-04-15
申请人： 심플러 네트웍스, 인코포레이티드
发明人： 메나르,스테파네 , 라송드,노르망 , 빌레네브,쟝-끌로드
IPC分类号： B81B7/02 , B81C1/00 , B81B3/00 , B81B7/00
CPC分类号： H01H61/04 , B81B3/0024 , B81B2201/014 , B81B2203/0118 , B81B2203/051 , B81B2203/053 , F03G7/06 , H01H2001/0047 , H01H2001/0078 , H01H2061/006 , H01H2061/008
摘要： The MEMS cantilever actuator (10) is designed to be mounted on a substrate (12). The actuator (10) comprises an elongated hot arm member (20) having two spaced-apart portions (22), each provided at one end with a corresponding anchor pad (24) connected to the substrate (12). The portions (22) are connected together at a common end (26) that is opposite the anchor pads (24). It further comprises an elongated cold arm member (30) adjacent to and substantially parallel of the hot arm member (20), the cold arm member (30) having at one end an anchor pad (32) connected to the substrate (12), and a free end (34) that is opposite the anchor pad (32) thereof. A dielectric tether (40) is attached over the common end (26) of the portions (22) of the hot arm member (20) and the free end (34) of the cold arm member (30). This actuator (10) allows improving the performance, reliability and manufacturability of MEMS switches (100).
摘要翻译： MEMS悬臂致动器（10）设计成安装在基板（12）上。致动器（10）包括具有两个间隔开的部分（22）的细长的热臂构件（20），每个部分（22）的一端设置有连接到基板（12）的相应的锚固垫（24）。部分（22）在与锚垫（24）相对的共同端（26）处连接在一起。其还包括与热臂构件（20）相邻并且基本平行的细长的冷臂构件（30），冷臂构件（30）在一端具有连接到衬底（12）的锚垫（32）和与其固定垫（32）相对的自由端（34）。介质系绳（40）安装在热臂构件（20）的部分（22）和冷臂构件（30）的自由端（34）的共同端部（26）上。该致动器（10）允许改善MEMS开关（100）的性能，可靠性和可制造性。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式