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    • 1. 发明公开
    • Flip-chip light-emitting device and method of manufacturing the same
    • 闪光灯发光装置及其制造方法
    • KR20120002130A
    • 2012-01-05
    • KR20100062863
    • 2010-06-30
    • SEOUL OPTO DEVICE CO LTD
    • LEE KYU HOYOON YEO JINKIM KYOUNG WANCHOI JAE RYANG
    • H01L33/10H01L33/44
    • H01L33/46H01L33/10H01L33/20H01L33/22H01L33/32
    • PURPOSE: A flip-chip light-emitting device and a method of manufacturing the same are provided to improve the optical extraction efficiency of a light emitting device by reflecting light circulating inside the light emitting device outside. CONSTITUTION: In a flip-chip light-emitting device and a method of manufacturing the same, an N type semiconductor layer(1210), an active layer(1230), and a p-type semiconductor layer(1250) are formed on a transparent substrate(1100). A transparent electrode layer(1510) is formed on the p-type semiconductor layer. A P-type electrode pad(1550) is formed on the transparent electrode layer. An insulating layer(1390) is formed between the P-type electrode pad and n type electrode pads(1310,1330). Under bump metals(1410,1430,1450) are formed on the N type electrode and the P-type electrode pad.
    • 目的:提供一种倒装芯片发光器件及其制造方法,以通过将发光器件内部循环的光反射到外部来提高发光器件的光学提取效率。 构成:在倒装芯片的发光装置及其制造方法中,在透明的(透明的)形成有N型半导体层(1210),有源层(1230)和p型半导体层(1250) 衬底(1100)。 在p型半导体层上形成透明电极层(1510)。 在透明电极层上形成P型电极焊盘(1550)。 在P型电极焊盘和n型电极焊盘之间形成绝缘层(1390)(1310,1330)。 在N型电极和P型电极焊盘上形成凹凸金属(1410,1430,1450)。
    • 2. 发明公开
    • LIGHT EMITTING DIODE HAVING EXTENSIONS OF ELECTRODES FOR CURRENT SPREADING
    • 具有电流扩展电极的发光二极管
    • KR20090060271A
    • 2009-06-11
    • KR20097003347
    • 2009-02-18
    • SEOUL OPTO DEVICE CO LTD
    • YOON YEO JINKIM DAE WON
    • H01L33/36
    • A light emitting diode is provided to maximize current spreading by arranging bottom extension parts and top extension parts into a rotation symmetry structure. A bottom semiconductor layer(13) is formed on a substrate. A top semiconductor layer is positioned on a top part of the bottom semiconductor layer in order to expose edge regions of the bottom semiconductor layer. The top semiconductor layer has an indentation part(18d). An active layer is interposed between the bottom semiconductor layer and the top semiconductor layer. A bottom electrode(21) is formed on the bottom semiconductor layer exposed of a first edge part of the substrate. A transparent electrode layer(19) is formed on the top semiconductor layer. A top electrode(31) is formed on the transparent electrode layer of a second edge part of the substrate. Bottom extension parts(25d) are extended from the bottom electrode, and are formed on edge regions of the exposed bottom semiconductor layer and regions of the bottom semiconductor layer exposed by the indentation part. Top extension parts are formed on the transparent electrode layer, and are extended from the top electrode.
    • 提供发光二极管以通过将底部延伸部分和顶部延伸部分布置成旋转对称结构来最大化电流扩展。 底部半导体层(13)形成在基板上。 顶部半导体层位于底部半导体层的顶部以便露出底部半导体层的边缘区域。 顶部半导体层具有压痕部分(18d)。 在底部半导体层和顶部半导体层之间插入有源层。 底部电极(21)形成在衬底的第一边缘部分露出的底部半导体层上。 在顶部半导体层上形成透明电极层(19)。 在基板的第二边缘部分的透明电极层上形成顶部电极(31)。 底部延伸部分(25d)从底部电极延伸,并且形成在暴露的底部半导体层的边缘区域和由凹陷部分露出的底部半导体层的区域。 顶部延伸部分形成在透明电极层上,并从顶部电极延伸。
    • 8. 发明公开
    • Light emitting diode chip and method of fabricating the same
    • 发光二极管芯片及其制造方法
    • KR20120048331A
    • 2012-05-15
    • KR20100109919
    • 2010-11-05
    • SEOUL OPTO DEVICE CO LTD
    • SEO WON CHEOLYOON YEO JIN
    • H01L33/00
    • PURPOSE: A light emitting diode chip and a manufacturing method thereof are provided to minimize loss of a light emission region due to a separation region of light emitting cells by minimizing a cell separation region between the light emitting cells. CONSTITUTION: A buffer layer(112) is formed on one-side of a substrate(110). A semiconductor structure(120) comprises a first conductivity type semiconductor layer(122), an active layer(124), and a second conductivity type semiconductor layer(126). The first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer are divided into a plurality of light emitting cells(140) by a cell separation region. The cell separation region comprises a groove region(132) and a gap region(134). The groove region divides the first conductivity type semiconductor layer and the active layer.
    • 目的:提供发光二极管芯片及其制造方法,以通过使发光单元之间的细胞分离区域最小化来最小化由于发光单元的分离区域引起的发光区域的损失。 构成:在衬底(110)的一侧上形成缓冲层(112)。 半导体结构(120)包括第一导电类型半导体层(122),有源层(124)和第二导电类型半导体层(126)。 第一导电类型半导体层,有源层和第二导电类型半导体层被细胞分离区分成多个发光单元(140)。 细胞分离区域包括沟槽区域(132)和间隙区域(134)。 沟槽区域分割第一导电类型半导体层和有源层。
    • 9. 发明公开
    • Luminescence device
    • 发光装置
    • KR20100083111A
    • 2010-07-21
    • KR20100053820
    • 2010-06-08
    • SEOUL OPTO DEVICE CO LTD
    • YOON YEO JINOH DUCK HWAN
    • H01L33/38H01L33/42
    • H01L33/38H01L33/22H01L33/42
    • PURPOSE: A light emitting device is provided to improve the external quantum efficiency of the light emitting device by forming a concavo-convex part with preset roughness on the surface of an N type semiconductor layer. CONSTITUTION: An N type semiconductor layer(120) is formed on a sapphire substrate(110). An active layer(130) is formed on the N type semiconductor layer. A P type semiconductor layer(140) is formed on the active layer. A transparent electrode layer(150) is formed on the P type semiconductor layer. A concavo-convex part is formed on the substrate of the transparent electrode layer.
    • 目的:提供一种发光器件,通过在N型半导体层的表面上形成具有预设粗糙度的凹凸部来提高发光器件的外部量子效率。 构成:在蓝宝石衬底(110)上形成N型半导体层(120)。 在N型半导体层上形成有源层(130)。 在活性层上形成P型半导体层(140)。 在P型半导体层上形成透明电极层(150)。 在透明电极层的基板上形成凹凸部。