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    • 1. 发明公开
    • Flip-chip light-emitting device and method of manufacturing the same
    • 闪光灯发光装置及其制造方法
    • KR20120002130A
    • 2012-01-05
    • KR20100062863
    • 2010-06-30
    • SEOUL OPTO DEVICE CO LTD
    • LEE KYU HOYOON YEO JINKIM KYOUNG WANCHOI JAE RYANG
    • H01L33/10H01L33/44
    • H01L33/46H01L33/10H01L33/20H01L33/22H01L33/32
    • PURPOSE: A flip-chip light-emitting device and a method of manufacturing the same are provided to improve the optical extraction efficiency of a light emitting device by reflecting light circulating inside the light emitting device outside. CONSTITUTION: In a flip-chip light-emitting device and a method of manufacturing the same, an N type semiconductor layer(1210), an active layer(1230), and a p-type semiconductor layer(1250) are formed on a transparent substrate(1100). A transparent electrode layer(1510) is formed on the p-type semiconductor layer. A P-type electrode pad(1550) is formed on the transparent electrode layer. An insulating layer(1390) is formed between the P-type electrode pad and n type electrode pads(1310,1330). Under bump metals(1410,1430,1450) are formed on the N type electrode and the P-type electrode pad.
    • 目的:提供一种倒装芯片发光器件及其制造方法,以通过将发光器件内部循环的光反射到外部来提高发光器件的光学提取效率。 构成:在倒装芯片的发光装置及其制造方法中,在透明的(透明的)形成有N型半导体层(1210),有源层(1230)和p型半导体层(1250) 衬底(1100)。 在p型半导体层上形成透明电极层(1510)。 在透明电极层上形成P型电极焊盘(1550)。 在P型电极焊盘和n型电极焊盘之间形成绝缘层(1390)(1310,1330)。 在N型电极和P型电极焊盘上形成凹凸金属(1410,1430,1450)。
    • 4. 发明公开
    • Light emitting diode with improved light extraction efficiency
    • 具有改进的光提取效率的发光二极管
    • KR20120015651A
    • 2012-02-22
    • KR20100077924
    • 2010-08-12
    • SEOUL OPTO DEVICE CO LTD
    • YANG JEONG HEEKIM KYOUNG WANYOON YEO JINKIM JAE MOOLEE KEUM JU
    • H01L33/44H01L33/00H01L33/46
    • H01L33/08H01L33/007H01L33/10H01L33/20H01L33/24H01L33/38H01L33/42H01L33/46H05B33/06
    • PURPOSE: A light emitting diode having improved optical extraction efficiency is provided to prevent a current to be excessively focused on the crystal defect of light emission regions by partitioning a light-emitting structure into a plurality of light emitting regions. CONSTITUTION: A light-emitting structure including light emitting regions(LE1,LE2) is formed in the top of a substrate. The light-emitting structure comprises a first electrical conductive semiconductor layer, an active layer, and a second electrical conductive semiconductor layer. A first electrode pad(35) is electrically connected to the first electrical conductive semiconductor layer. A second electrode pad(33) is located on the upper side of the substrate. An insulation reflecting layer(31) separates the second electrode pad from the light-emitting structure. A pattern(LEE) of optical extraction elements is located on the upper side of the second electrical conductive semiconductor layer.
    • 目的:提供具有提高的光提取效率的发光二极管,以通过将发光结构分隔成多个发光区域来防止电流过度聚焦于发光区域的晶体缺陷。 构成:在衬底的顶部形成包括发光区域(LE1,LE2)的发光结构。 发光结构包括第一导电半导体层,有源层和第二导电半导体层。 第一电极焊盘(35)电连接到第一导电半导体层。 第二电极焊盘(33)位于衬底的上侧。 绝缘反射层(31)将第二电极焊盘与发光结构分离。 光提取元件的图案(LEE)位于第二导电半导体层的上侧。