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    • 6. 发明公开
    • 게이트 적층물에 OHA막을 구비하는 비 휘발성 반도체메모리 장치 및 그 제조방법
    • 具有OHA层的非挥发性半导体存储器件在栅格堆叠结构中提高操作速度
    • KR1020040093606A
    • 2004-11-06
    • KR1020030027543
    • 2003-04-30
    • 삼성전자주식회사
    • 채수두김정우이정현김문경황현상
    • H01L21/8247
    • H01L29/792H01L21/28194H01L21/28282H01L27/11568H01L29/513H01L29/517H01L29/518H01L29/66833
    • PURPOSE: A non-volatile semiconductor memory device is provided to control effectively trap density according to doping concentration and to improve operation speed by forming an OHA(Oxide-Hafnium oxide Aluminium oxide) layer in a gate stack structure. CONSTITUTION: A semiconductor substrate(40) includes a source(S) and a drain(D) spaced apart from each other. A gate stack structure for contacting the source and drain is formed on the semiconductor substrate. The gate stack structure is composed of a tunneling layer(42), the first trap material layer(44), the first insulating layer(46) and a gate electrode(48). The first trap material layer and the first insulating layer have larger permittivity than a nitride layer. The first oxide layer is formed between the tunneling layer and the first trap material layer. The second oxide layer is formed between the first trap material layer and the first insulating layer. The first oxide layer is made of Al2O3. The first insulating layer is made of one selected from a group consisting of HfO2, ZrO2, Ta2O5, and TiO2.
    • 目的:提供一种非易失性半导体存储器件,用于根据掺杂浓度有效地控制阱密度,并通过在栅极堆叠结构中形成OHA(氧化物 - 氧化铪氧化铝)层来提高操作速度。 构成:半导体衬底(40)包括彼此间隔开的源极(S)和漏极(D)。 用于接触源极和漏极的栅极堆叠结构形成在半导体衬底上。 栅极堆叠结构由隧道层(42),第一陷阱材料层(44),第一绝缘层(46)和栅电极(48)组成。 第一陷阱材料层和第一绝缘层具有比氮化物层更大的介电常数。 第一氧化物层形成在隧道层和第一捕集材料层之间。 第二氧化物层形成在第一捕集材料层和第一绝缘层之间。 第一氧化物层由Al2O3制成。 第一绝缘层由选自HfO 2,ZrO 2,Ta 2 O 5和TiO 2的一种制成。
    • 7. 发明授权
    • 게이트 전극과 단전자 저장 요소 사이에 양자점을구비하는 단전자 메모리 소자 및 그 제조 방법
    • 发送给朋友电子邮件说明
    • KR100408520B1
    • 2003-12-06
    • KR1020010025569
    • 2001-05-10
    • 삼성전자주식회사
    • 채수두김병만김문경채희순류원일
    • H01L29/788B82Y10/00
    • B82Y10/00G11C2216/08H01L21/28273H01L29/7888
    • A single electron memory device comprising quantum dots between a gate electrode and a single electron storage element and a method for manufacturing the same are provided. The single electron memory device includes a substrate (40) on which a nano scale channel region (C) is formed between a source (42) and a drain (44), and a gate lamination pattern (P) including quantum dots (50a) on the channel region (C). The gate lamination pattern (P) includes a lower layer (46) formed on the channel region (C), a single electron storage medium (48) storing a single electron tunneling through the lower layer formed on the lower layer (46), an upper layer (50) including quantum dots (50a) formed on the single electron storage medium (48), and a gate electrode (52) formed on the upper layer (50) to be in contact with the quantum dots (50a).
    • 提供了一种在栅电极和单电子存储元件之间包括量子点的单电子存储器件及其制造方法。 单电子存储器件包括其上在源极(42)和漏极(44)之间形成纳米级沟道区(C)的衬底(40)以及包括量子点(50a)的栅极叠层图案(P) 在通道区域(C)上。 栅极叠层图案(P)包括形成在沟道区域(C)上的下层(46),存储穿过形成在下层(46)上的下层的隧穿单电子的单电子存储介质(48), 包括形成在单个电子存储介质(48)上的量子点(50a)的上层(50)以及形成在上层(50)上以与量子点(50a)接触的栅电极(52)。 <图像>