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    • 2. 发明授权
    • SET 소자 제작 방법
    • SET소자제작방법
    • KR100455279B1
    • 2004-11-06
    • KR1020000024212
    • 2000-05-06
    • 삼성전자주식회사
    • 김병만이조원김미영김문경
    • H01L21/336
    • H01L29/66439B82Y10/00B82Y30/00H01L29/7613Y10S438/927Y10S438/962Y10S438/979
    • A method of fabricating a single electron tunneling (SET) device, the method including forming a source electrode and a drain electrode a predetermined distance apart from each other on an insulating substrate, forming a metal layer having a thickness on the order of nanometers between the source and drain electrodes, and forming quantum dots between the source and drain electrodes due to the movement of metal atoms/ions within the metal layer caused by applying a predetermined voltage to the source and drain electrodes. In the manufacture of an SET device, quantum dots can be formed by a simple method instead of an self assembled monolayer (SAM) method or lithographic methods. Thus, SET devices fabricated in this way have no material dependency, and are also applicable to large scale integration (LSI) structures. Also, since quantum dots are obtained by deposition and electromigration, SET devices having the above-described advantages can be mass-produced.
    • 一种制造单电子隧穿(SET)器件的方法,所述方法包括:在绝缘基板上以预定距离彼此分开形成源电极和漏电极;在所述第一电子隧穿(SET)器件和所述第二电子隧穿器件之间形成具有纳米级厚度的金属层; 源电极和漏电极,并且由于通过向源电极和漏电极施加预定电压而引起的金属层内的金属原子/离子的移动,在源电极与漏电极之间形成量子点。 在SET装置的制造中,可以通过简单的方法而不是自组装单层(SAM)方法或光刻方法来形成量子点。 因此,以这种方式制造的SET器件不具有材料依赖性,并且也适用于大规模集成(LSI)结构。 而且,由于量子点通过沉积和电迁移获得,具有上述优点的SET器件可以大量生产。