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    • 4. 发明授权
    • 포지티브형 포토레지스트 막의 제조방법
    • 포지티브형포토레지스트막의제조방법
    • KR100455652B1
    • 2004-11-06
    • KR1019990037690
    • 1999-09-06
    • 동우 화인켐 주식회사삼성전자주식회사
    • 주진호이유경박홍식나윤정김기수강성철
    • H01L21/027
    • G03F7/0048G03F7/0226G03F7/162
    • A method for preparing a positive photoresist layer is provided. In this method, a photoresist composition is drop-wise applied on an insulator layer or a conductive metal layer formed on a substrate. The photoresist composition includes a polymer resin, a sensitizer for changing solubility of the photoresist layer when exposed and a solvent. The coated substrate is rotated at the speed of 1,250 to 1,350 rpm for 4.2 to 4.8 seconds. The coated substrate is then dried and the dried substrate is exposed to some form of radiation. Next, the exposed portion is removed by using an alkaline developing solution. The solvent preferably includes 3-methoxybutyl acetate and 4-butyrolactone, or includes 3-methoxybutyl acetate, 2-heptanone, and 4-butyrolactone.
    • 提供了制备正型光刻胶层的方法。 在该方法中,将光致抗蚀剂组合物逐滴施加在形成在基板上的绝缘层或导电金属层上。 光致抗蚀剂组合物包含聚合物树脂,用于改变曝光时光致抗蚀剂层的溶解性的敏化剂和溶剂。 涂布的基材以1250至1350rpm的速度旋转4.2至4.8秒。 然后干燥涂覆的基材并将干燥的基材暴露于某种形式的辐射。 接下来,使用碱性显影液除去曝光部分。 溶剂优选包括乙酸3-甲氧基丁酯和4-丁内酯,或者包括乙酸3-甲氧基丁酯,2-庚酮和4-丁内酯。
    • 5. 发明公开
    • 포지티브형 포토레지스트 막의 제조방법
    • 制作光电子层的方法
    • KR1020010026391A
    • 2001-04-06
    • KR1019990037690
    • 1999-09-06
    • 동우 화인켐 주식회사삼성전자주식회사
    • 주진호이유경박홍식나윤정김기수강성철
    • H01L21/027
    • G03F7/0048G03F7/0226G03F7/162
    • PURPOSE: A method for manufacturing a positive photoresist layer is provided to shorten process time, by operating a spin coater at a high speed, and by carrying out sufficient exposure even with a little quantity of exposure. CONSTITUTION: A positive photoresist composition includes polymer resin, a photosensitive compound and a solvent. The polymer resin is formed on an insulating layer or conductive metal layer formed on a substrate. The photosensitive compound changes solubility of a photoresist layer by exposure. The photoresist composition is coated by accelerating the substrate for 4.2 to 4.8 seconds to make the substrate rotate at a rate from 1250 to 1350 revolutions per minute. The coated composition is dried. An exposure process is performed regarding the dried composition. The composition near the exposure portion is eliminated by using alkaline developing liquid.
    • 目的:提供一种用于制造正性光致抗蚀剂层的方法,以通过高速操作旋转涂布机,以及甚至在少量曝光的情况下进行足够的曝光来缩短处理时间。 构成:正性光致抗蚀剂组合物包括聚合物树脂,光敏化合物和溶剂。 聚合物树脂形成在形成在基板上的绝缘层或导电金属层上。 光敏化合物通过曝光改变光致抗蚀剂层的溶解度。 通过将基板加速4.2至4.8秒来涂覆光致抗蚀剂组合物,以使基板以1250至1350转每分钟的速度旋转。 将涂覆的组合物干燥。 对干燥的组合物进行曝光处理。 通过使用碱性显影液来消除曝光部分附近的组成。
    • 8. 发明公开
    • 포지티브형 포토레지스트 조성물
    • 正极型光电组合物
    • KR1020010019745A
    • 2001-03-15
    • KR1019990036321
    • 1999-08-30
    • 동우 화인켐 주식회사삼성전자주식회사
    • 주진호이유경박홍식나윤정김기수강성철
    • G03F7/039
    • G03F7/0048G03F7/0226
    • PURPOSE: Provided is a positive type photoresist composition useful in formation of photoresist film for liquid crystal display circuit and/or microcircuit used in semiconductor area by comprising polymer resin and sensitive compound and reducing bad smell. CONSTITUTION: A positive type photoresist composition comprises polymer resin to form photoresist film, sensitive compound to alterate solubility of the film and solvent such as 3-methoxybutylacetate and 4-butyrolactone. The composition preferably contains novolak resin as the polymer resin, diazide compound as the sensitive compound. The 3-methoxybutylacetate and 4-butyrolactone are blended, by weight part, in a ratio of 60-80 : 2-10. The positive type photoresist composition effects industrial application because of its excellent properties such as sensing rate, residual rate, resolution and/or adhesiveness to substrate.
    • 目的:提供一种正型光致抗蚀剂组合物,其可用于形成用于半导体领域的液晶显示电路和/或微电路的光致抗蚀剂膜,其包含聚合物树脂和敏感化合物,并减少不良气味。 构成:正型光致抗蚀剂组合物包含聚合物树脂以形成光致抗蚀剂膜,敏化剂以改变膜的溶解性和溶剂如3-甲氧基丁酸乙酯和4-丁内酯。 组合物优选含有酚醛清漆树脂作为聚合物树脂,重氮化合物作为敏感化合物。 将3-甲氧基丁酸乙酯和4-丁内酯按重量比例混合,比例为60-80:2-10。 正型光致抗蚀剂组合物由于其优异的性能如感光速率,残留率,分辨率和/或对基材的粘附性而具有工业应用。
    • 9. 发明公开
    • 포지티브형 포토레지스트 조성물
    • 正极型光电组合物
    • KR1020010019744A
    • 2001-03-15
    • KR1019990036320
    • 1999-08-30
    • 동우 화인켐 주식회사삼성전자주식회사
    • 주진호이유경박홍식나윤정김기수강성철
    • G03F7/039
    • G03F7/0048G03F7/0226
    • PURPOSE: A positive type photoresist composition is useful in formation of photoresist film for liquid crystal display circuit and/or microcircuit used in semiconductor area by improving sensing rate and residual rate and reducing bad smell. CONSTITUTION: A positive type photoresist composition comprises polymer resin to form photoresist film, sensitive compound to alterate solubility of the film and solvent such as 3-methoxybutylacetate, 2-heptanone and 4-butyrolactone. The composition preferably contains novolak resin as the polymer resin, diazide compound as the sensitive compound. The 3-methoxybutylacetate, 2-heptanone and 4-butyrolactone are blended, by weight part, in a ratio of 50-70:5-15:2-10. The diazide compound is prepared by reacting polyhydroxy benzophenone and 1,2-naphthoquinone diazide, 2-diazo- 1-naphthol-5-sulphonic acid.
    • 目的:正型光致抗蚀剂组合物可用于形成用于半导体领域的液晶显示电路和/或微电路的光致抗蚀剂膜,通过提高感测速率和残留率,减少不良气味。 构成:正型光致抗蚀剂组合物包含聚合物树脂以形成光致抗蚀剂膜,敏化化合物以改变膜的溶解性和溶剂,例如3-甲氧基丁酸乙酯,2-庚酮和4-丁内酯。 组合物优选含有酚醛清漆树脂作为聚合物树脂,重氮化合物作为敏感化合物。 将3-甲氧基丁酸乙酯,2-庚酮和4-丁内酯以50-70:5-15:2-10:10的比例重量份混合。 二叠氮化合物通过多羟基二苯甲酮和1,2-重氮萘-1-磺酸1,2-重氮萘醌反应来制备。