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    • 11. 发明公开
    • 상변환 기억셀들 및 그 제조방법들
    • 相变记忆细胞及其制备方法
    • KR1020040036426A
    • 2004-04-30
    • KR1020020065456
    • 2002-10-25
    • 삼성전자주식회사
    • 이세호
    • H01L27/115
    • H01L45/06G11C2213/52H01L27/2436H01L45/1233H01L45/126H01L45/144H01L45/1666
    • PURPOSE: Phase changeable memory cells are provided to prevent a phase changeable material layer at the edge of a contact surface from being converted into an amorphous state by supplementing the heat loss at the edge of the contact surface with the heat transferred from a lower contact surface. CONSTITUTION: Lower electrodes(52) are formed on a semiconductor substrate. An interlayer dielectric(54) is formed on the semiconductor substrate having the lower electrode. A plurality of data storage elements extend through the interlayer dielectric and are connected to the respective lower electrodes. Each data storage element extends to a predetermined depth of the lower electrode so that a part of the sidewall of each data storage element comes in contact with the lower electrode.
    • 目的:提供相变存储器单元,以防止接触表面边缘处的相变材料层通过补偿接触表面边缘处的热损失与从下接触表面传递的热量而转变为非晶状态 。 构成:在半导体衬底上形成下电极(52)。 在具有下电极的半导体衬底上形成层间电介质(54)。 多个数据存储元件延伸穿过层间电介质并且连接到相应的下电极。 每个数据存储元件延伸到下电极的预定深度,使得每个数据存储元件的侧壁的一部分与下电极接触。