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1. 发明专利

JP2010269970A Nitride semiconductor substrate 审中-公开
标题翻译：氮化物半导体基板
公开(公告)号：JP2010269970A
公开(公告)日：2010-12-02
申请号：JP2009123018
申请日：2009-05-21
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： YAMAMOTO SHUNSUKE
IPC分类号： C30B29/38 , C23C16/01 , C23C16/02 , C30B25/18 , H01L21/205
CPC分类号： H01L21/0262 , C30B25/02 , C30B29/406 , H01L21/0242 , H01L21/02458 , H01L21/0254 , Y10T83/0405
摘要： PROBLEM TO BE SOLVED: To provide a nitride semiconductor substrate capable of growing an epitaxial film uniform in characteristics such as film thickness, by increasing its adhesion to a substrate holder so as to achieve a uniform temperature distribution within the substrate plane when growing the film on the nitride semiconductor substrate. SOLUTION: The nitride semiconductor substrate 28 is characterized in that, when defining warpages concave and convex toward a surface plane of the substrate 28 as negative and positive, respectively, drawing a line segment from one end of a rear plane 28a of the substrate to the other end of the rear plane 28a of the substrate via a center line L of the substrate, cutting the substrate 28 along the line segment in the thickness direction, defining the largest value among shortest distances between given points on the drawn line segment and an outline of the cut plane on the rear plane as a warpage H in the diameter direction, obtaining values of the warpage H in the diameter direction in the circumferential direction of the substrate and defining the largest and smallest values among the same as Hmax and Hmin, respectively, the warpage H in the diameter direction is specified so as to satisfy the relation: Hmax-Hmin≤30 μm. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种氮化物半导体衬底，其能够通过增加其对衬底保持器的粘附性而使诸如膜厚度的特性生长均匀的氮化物半导体衬底，以便当生长时在衬底平面内实现均匀的温度分布该氮化物半导体衬底上的膜。解决方案：氮化物半导体基板28的特征在于，当分别将基板28的表面平面凹凸的翘曲定义为负的和正的时，从该基板28的后平面28a的一端基板经由基板的中心线L与基板的后平面28a的另一端相连，沿着线段在厚度方向上切割基板28，在绘制线段上的给定点之间的最短距离内定义最大值以及作为直径方向的翘曲H的后平面上的切割面的轮廓，求出基板的周向的直径方向的翘曲H的值，并将与Hmax相同的最大值和最小值定义为 Hmin中，规定了直径方向的翘曲H，以满足关系：Hmax-Hmin≤30μm。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2010103493A Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electronic element wafer module, method of manufacturing electronic element module, electronic element module, and electronic information device 有权
标题翻译：光学元件，光学元件，光学元件，光学元件模块，制造光学元件模块的方法，电子元件波形模块，制造电子元件模块的方法，电子元件模块和电子信息装置
公开(公告)号：JP2010103493A
公开(公告)日：2010-05-06
申请号：JP2009199049
申请日：2009-08-28
申请人： Sharp Corp , シャープ株式会社
发明人： YANO YUJI , HIRANO KANEFUMI
IPC分类号： H01L27/14 , G02B7/02 , G02B13/00 , G02B13/18 , H04N5/335
CPC分类号： B29D11/00432 , G02B3/0056 , G02B3/0068 , G02B13/003 , G02B13/0085 , H01L27/14625 , H01L27/14685 , H01L31/02325 , Y10T83/0405 , Y10T156/1062
摘要： PROBLEM TO BE SOLVED: To obtain satisfactory optical characteristics by stabilizing lens-to-lens intervals. SOLUTION: For example, an optical surface A is provided at the center of a first lens 61 as a lens region, and projections 61a, 61b are provided at the outer-peripheral side of the optical surface A as a spacer section having a prescribed thickness. In a sensor module 10 for modularizing the two of the first lens 61 and a second one 62 for use, a binder 7 is arranged only at a space portion surrounded by bottom sections 61e, 62e provided at a farther outer-peripheral side of a flat surface at the spacer section via a tapered sections 61d, 62d. The binder 7 is not disposed at the space by at least tapered sections 61d, 62d, and a sufficient space for pressing the binder 7 for spread in bonding is absorbed by the space, by at least the tapered sections 61d, 62d, thus the lens-to-lens intervals from affecting, by interposing the binder 7 as conventionally, and the upper. Thus the upper and lower spacer sections are prevented from mutually abutting. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过稳定透镜到透镜的间隔来获得令人满意的光学特性。解决方案：例如，在作为透镜区域的第一透镜61的中心处设置有光学面A，在光学面A的外周侧设置突起61a，61b作为间隔部，规定厚度。在用于使第一透镜61和第二透镜61中的两个模块化的传感器模块10中，粘合剂7仅布置在由设置在平面的更远的外周侧的底部61e，62e包围的空间部分在间隔部分的表面经由锥形部分61d，62d。粘合剂7不通过至少锥形部分61d，62d设置在该空间处，并且用于按压粘合剂7以用于粘合的扩展的足够空间被空间吸收至少锥形部分61d，62d，因此透镜透镜间隔影响通过如前所述插入粘合剂7和上部。因此，防止了上下隔离件相互抵接。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2010103490A Optical element, optical element wafer, optical element wafer module, optical element module, method of manufacturing optical element module, electron device wafer module, method of manufacturing electronic device module, electronic element module, and electronic information device 有权
标题翻译：光学元件，光学元件波长，光学元件波长模块，光学元件模块，制造光学元件模块的方法，电子设备波形模块，制造电子设备模块的方法，电子元件模块和电子信息设备
公开(公告)号：JP2010103490A
公开(公告)日：2010-05-06
申请号：JP2009199021
申请日：2009-08-28
申请人： Sharp Corp , シャープ株式会社
发明人： YANO YUJI , YASUKAWA SHIGERU
IPC分类号： H01L27/14 , G02B3/00
CPC分类号： B26D1/00 , C04B28/02 , G02B7/021 , G02B13/003 , G02B13/0085 , H01L27/14625 , H01L27/14685 , H04N5/2254 , H04N5/2257 , Y10T83/0405 , C04B16/08 , C04B18/027 , C04B24/26 , C04B24/383 , C04B2103/0071 , C04B24/08 , C04B2103/0046 , C04B2103/10
摘要： PROBLEM TO BE SOLVED: To maintain clean surface of an optical element, such as, the surface of a convex lens that functions optically. SOLUTION: An annular top flat surface (flat surface of an annular projection 61a) of an edge at the outer-peripheral side of the surface of the convex lens is provided at a position higher than a high position at the center of the surface of the convex lens in a first lens 61, at a side opposite to the side of an image pickup device 2. Although conventionally, a force is applied in a direction for peeling off a cutting holding tape 9 on the convex lenses, the cutting holding tape 9 is stuck to the top flat surface (a flat surface of the annular projection 61a) at the edge for reception, thus preventing stress from being applied to the cutting holding tape 9, there is no cutting of the holding tape 9 from being readily peeled off, the paste of the cutting holding tape 9 from adhering to the surface of the convex lens, and the surface of the convex lens from being stained by the entry of cutting water into the cutting holding tape 9. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：保持光学元件的清洁表面，例如光学功能的凸透镜的表面。解决方案：凸透镜表面的外周侧的边缘的环形顶部平坦表面（环形突起61a的平坦表面）设置在高于中心的高位置的位置处凸透镜的表面在与图像拾取装置2侧相反的一侧的第一透镜61中。尽管通常，沿着用于剥离凸透镜上的切割保持带9的方向施加力，切割保持带9在接收边缘处粘附到顶部平坦表面（环形突起61a的平坦表面），从而防止施加到切割保持带9的应力，不会使保持带9被切割容易剥离，切割保持带9的糊剂粘附到凸透镜的表面，并且凸透镜的表面被切入水进入切割保持带9中而被污染。版权所有：（C）2010，JPO＆INPIT

4. 发明专利

JP2006501934A Catheter guide wire lamp is formed 有权
公开(公告)号：JP2006501934A
公开(公告)日：2006-01-19
申请号：JP2004543254
申请日：2003-08-25
申请人：シメッドライフシステムズ、インコーポレーテッド
发明人：カーリロオスカー , イーウィンドヘウザージェームス , ピーボウティレットミシェル
IPC分类号： A61M25/00 , A61M25/01 , A61M29/02
CPC分类号： A61M25/0172 , A61M25/0029 , A61M25/0108 , A61M2025/0008 , A61M2025/004 , A61M2025/0177 , A61M2025/0183 , A61M2025/0188 , A61M2025/107 , B26D7/00 , Y10T83/0405
摘要：ルーメン壁がガイド・ワイヤー・ルーメンの全周に延設する実質的に密閉された部分を含むガイド・ワイヤー・ルーメン（６０）及びカテーテルの外部に対しルーメンを開口するチャンネルを含むチャンネル部からなり、チャンネルの幅はチャンネル部の最大幅より狭いことを特徴とする迅速な交換が可能なカテーテル（３０）であり、ガイド・ワイヤー・ランプ（６２）がチャンネル部に延設し、該ランプの遠端が近付くにつれ、該ランプは更に該チャンネル部のルーメンに延設する。

6. 发明专利

JPS6048319B2 JPS6048319B2 - 失效
公开(公告)号：JPS6048319B2
公开(公告)日：1985-10-26
申请号：JP23510982
申请日：1982-12-27
申请人： Gaabaa Gaamento Tekunorojii Inc
发明人： HEINZU JOZEFU GAABAA
IPC分类号： B26D7/02 , B25B11/00 , B26D7/01 , B26D7/06 , B26D7/20 , B26F1/38
CPC分类号： B26D7/20 , B25B11/005 , B26D7/018 , B26D7/0675 , B26F1/3813 , Y10S83/941 , Y10T83/0405 , Y10T83/0476 , Y10T83/207 , Y10T83/748

7. 发明专利

JP5553666B2 Sheet cutting device and a sheet cutting method 有权
公开(公告)号：JP5553666B2
公开(公告)日：2014-07-16
申请号：JP2010087892
申请日：2010-04-06
申请人：キヤノン株式会社
发明人：正仁吉田 , 哲弘新田 , 幸太内田 , 隆之岡本
IPC分类号： B65H35/04 , B26D5/20 , B26D7/06 , B26D7/18 , B41J11/42 , B41J11/70
CPC分类号： B65H35/06 , B26D1/085 , B26D5/28 , B26D7/08 , B65H43/00 , B65H2220/09 , B65H2301/51212 , B65H2404/14 , B65H2511/51 , B65H2513/10 , B65H2513/108 , B65H2513/40 , B65H2801/06 , Y10T83/0405 , Y10T83/2022 , Y10T83/4529 , B65H2220/01 , B65H2220/02
摘要： A sheet is cut between a first conveying unit and a second conveying unit in a state in which the first and second conveying units halt and in which an upstream conveying unit conveys the sheet at a first speed; after the sheet is cut, the first conveying unit conveys the sheet at a second speed higher than the first speed to reduce a slack formed during the halting; after the sheet is cut, the second conveying unit conveys the downstream-side sheet at a third speed higher than the first speed; if the third conveying unit is nipping the sheet during cutting, the third conveying unit conveys the sheet at the third speed; and if the third conveying unit is not nipping the sheet, the third conveying unit conveys the sheet at the third speed or a fourth speed after the detecting unit detects the sheet.

9. 发明专利

JP4849993B2 Pressure-sensitive adhesive sheet, production method and a method of cutting the laminated ceramic sheet that 有权
公开(公告)号：JP4849993B2
公开(公告)日：2012-01-11
申请号：JP2006220839
申请日：2006-08-14
申请人：日東電工株式会社
发明人：大輔下川 , 正明佐藤 , 知子岸本 , 高正平山 , 幸生有満 , 一之木内
IPC分类号： C09J7/02 , C09J11/06 , C09J11/08 , C09J133/00
CPC分类号： H01L21/6836 , C08K7/22 , C09J7/29 , C09J7/385 , C09J2201/162 , C09J2203/326 , C09J2205/106 , C09J2205/11 , C09J2433/00 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2924/19041 , H01L2924/30105 , Y10T83/0405 , Y10T428/25
摘要： The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 µm, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 µm. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.

10. 发明专利

JP2010525182A How to provide a coil shaved metal fiber 有权
公开(公告)号：JP2010525182A
公开(公告)日：2010-07-22
申请号：JP2010504391
申请日：2008-04-25
申请人：ナムローゼ・フエンノートシャップ・ベカート・ソシエテ・アノニムNv Bekaert Sa
发明人：シルダーマンス，インゲ , ドゥ・ボン，ステファーン
IPC分类号： D01F9/08
CPC分类号： B23P17/06 , B21C37/047 , B22F1/004 , B22F3/002 , Y10T29/14 , Y10T29/142 , Y10T29/143 , Y10T82/10 , Y10T83/0405 , Y10T428/12424 , Y10T428/12431
摘要： A method for providing coil shaved metal fibers according to the present invention comprises the steps of -providing a metal composite foil, the metal composite foil comprising o at least two metal layers (Lx) for being converted into metal fibers, o each pair of adjacent metal layers are mutually separated by a sacrificial layer (Sy) provided from a sacrificial metal, each sacrificial layer (Sy) having a first and second surface, whereby for each sacrificial layer, the first surface contacts one of the pair of adjacent metal layers, the second surface is contacting the other of the pair of adjacent metal layers; -coiling said metal composite foil on a shaft thereby providing a metal coil having one free end surface; -rotating the metal coil and cutting the free end surface of the metal coil by means of a cutting tool, thereby providing a bundle of composite fibers; -removing the sacrificial metal of the sacrificial layers from the composite fibers thereby providing a bundle of metal fibers, each metal fiber being obtained from one of the metal layers (Lx).

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