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1. 发明专利

JP4475160B2 Method of manufacturing an electronic device 有权
公开(公告)号：JP4475160B2
公开(公告)日：2010-06-09
申请号：JP2005115625
申请日：2005-04-13
申请人：株式会社デンソー
发明人：撤男中野 , 幸宏前田
IPC分类号： H05K1/18 , H01L25/04 , H01L25/18
CPC分类号： H05K3/3405 , H01L2224/16225 , H01L2924/00014 , H01L2924/19105 , H01L2924/19107 , H05K3/0061 , H05K3/3415 , H05K3/3421 , H05K5/0069 , H05K2201/09745 , H05K2201/10189 , H05K2201/10446 , H05K2203/0173 , H01L2224/0401
摘要： An electronic apparatus has a wiring board and connector units which are mounted at a case unit. The connector unit has an external connection surface connected with the external and a terminal installation surface, which is substantially flat and positioned at an opposite side to the external connection surface. A terminal of the connector unit is electrically connected with a pad positioned at a first surface of the wiring board via a connection member. The wiring board and the connector unit which are integrated are mounted at the case unit, with the first surface and the terminal installation surface facing the case unit. The case unit has an installation surface at which a recess for accommodating therein the connection member is arranged.

2. 发明专利

JP2005252049A Substrate-holding device, and printer for jointing material and printing method 有权
标题翻译：基板保持装置和打印机，用于接合材料和印刷方法
公开(公告)号：JP2005252049A
公开(公告)日：2005-09-15
申请号：JP2004061772
申请日：2004-03-05
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMAUCHI MASARU , SHIRAI JUN , IWASAKI MASANORI
IPC分类号： H05K13/04 , B05D5/00 , B05D5/10 , B41F15/08 , H05K3/12 , H05K3/30 , H05K3/34 , H05K13/00
CPC分类号： H05K13/0069 , H05K3/1216 , H05K3/3415 , H05K2203/0165 , H05K2203/0173 , H05K2203/1572
摘要： PROBLEM TO BE SOLVED: To provide a substrate-holding device by which a substrate is surely chucked and held, even if each of a plurality of diversified components of various kinds are mounted on the substrate at high densities, in holding the support position of the substrate, while supporting the substrate on a surface at a components mounting side on which a plurality of the components are mounted. SOLUTION: The substrate holding device includes a substrate-holding block, having the holding member of a substrate peripheral portion, wherein the holding member includes a support face supporting the peripheral portion, through contact with the peripheral portion in the surface at the components mounting side, and an adsorbing hole formed on the support face; a substrate-holding member which is fixed to the substrate-holding block and supports a non-mounting region, by coming into contact with the non-mounting region of each of the component, in the vicinity of nearly the center of the surface at the component-mounting side; and a components adsorbing member, which is fixed to the substrate holding block near the substrate supporting member and adsorbs surfaces of the components mounted on the surface at the component-mounting side. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种基板保持装置，通过该基板保持装置可靠地夹持和保持基板，即使将各种各样的多种多样的部件以高密度安装在基板上，在保持支撑件同时在安装有多个部件的部件安装侧的表面上支撑基板。＆lt; P＆gt;解决方案：基板保持装置包括具有基板周边部分的保持部件的基板保持块，其中保持部件包括支撑周边部分的支撑面，通过与表面中的周边部分接触，部件安装侧和形成在支撑面上的吸附孔; 基板保持部件，其固定到基板保持块，并且支撑非安装区域，通过与部件的每个的非安装区域接触，在表面的几乎中心附近部件安装侧; 以及部件吸附部件，其固定到基板支撑部件附近的基板保持块，并吸附安装在部件安装侧的表面上的部件的表面。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2015050384A 半導体装置有权
标题翻译：半导体器件
公开(公告)号：JP2015050384A
公开(公告)日：2015-03-16
申请号：JP2013182363
申请日：2013-09-03
申请人：ルネサスエレクトロニクス株式会社 , Renesas Electronics Corp
发明人： TAKAHASHI SATOSHI , KARIYAZAKI SHUICHI
IPC分类号： H01L23/12 , H01L23/02 , H01L25/00
CPC分类号： H01L23/04 , H01L21/50 , H01L23/3675 , H01L23/3736 , H01L23/49838 , H01L23/50 , H01L23/544 , H01L23/562 , H01L24/09 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L24/74 , H01L24/97 , H01L25/165 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2224/0401 , H01L2224/04042 , H01L2224/0913 , H01L2224/13101 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2924/00014 , H01L2924/01029 , H01L2924/01079 , H01L2924/0132 , H01L2924/13091 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H05K1/0266 , H05K3/3442 , H05K3/3489 , H05K2201/066 , H05K2201/09781 , H05K2201/1056 , H05K2201/10636 , H05K2203/0169 , H05K2203/0173 , H05K2203/167 , H05K2203/168 , Y02P70/611 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2924/014
摘要：【課題】配線基板に対する電子部品の搭載位置に誤差が生じることを抑制する。【解決手段】第1半導体チップSC1は、主面SFC3及び裏面SFC4を有している。裏面SFC4は、主面SFC3の反対側の面である。配線基板ISUBは矩形であり、主面SFC1及び裏面SFC2を有している。主面SFC1には、第1半導体チップSC1が搭載されている。リッドLIDは、配線基板ISUBの主面SFC1及び第1半導体チップSC1を覆う。電子部品ELP1は、配線基板ISUBの裏面SFC2に搭載されている。そして、配線基板ISUBの主面SFC1は、少なくとも互いに対向する2つの角に、リッドLIDに覆われていない非被覆領域を有している。【選択図】図2
摘要翻译：要解决的问题：抑制相对于布线板的电子部件安装位置的误差的发生。解决方案：半导体器件包括：具有主表面SFC3和后表面SFC4的第一半导体芯片SC1，其中后表面SFC4是与主表面SFC3相反的一侧的表面; 在第一半导体芯片SC1安装在主面SFC1上的具有矩形形状和主面SFC1和后面SFC2的布线板ISUB; 覆盖布线板ISUB的主面SFC1和第一半导体芯片SC1的盖子LID; 以及安装在布线板ISUB的背面SFC2上的电子部件ELP1。布线板ISUB的主表面SFC1至少在彼此相对的两个角上未被盖子LID覆盖的未覆盖区域。

4. 发明专利

JP2014179419A Method for bonding electronic component 审中-公开
标题翻译：用于绑定电子元件的方法
公开(公告)号：JP2014179419A
公开(公告)日：2014-09-25
申请号：JP2013051679
申请日：2013-03-14
申请人： Alpha- Design Kk , アルファーデザイン株式会社 , Tadatomo Suga , 唯知須賀 , Masataka Mizukoshi , 正孝水越
发明人： SHIRATORI TOSHIYUKI , KAWASAKI KYO , SUGA TADATOMO , MIZUKOSHI MASATAKA
IPC分类号： H01L21/60 , H05K13/04
CPC分类号： H05K3/32 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/95 , H01L25/50 , H01L2224/29006 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29318 , H01L2224/2932 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/32013 , H01L2224/75281 , H01L2224/75315 , H01L2224/75317 , H01L2224/7598 , H01L2224/83001 , H01L2224/83192 , H01L2224/83203 , H01L2224/83205 , H01L2224/83409 , H01L2224/83411 , H01L2224/83413 , H01L2224/83418 , H01L2224/8342 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8382 , H01L2224/8384 , H01L2924/12041 , H05K13/046 , H05K2203/0173 , H05K2203/0278 , H05K2203/1131 , H01L2924/00 , H01L2924/00014 , H01L2924/00015
摘要： PROBLEM TO BE SOLVED: To secure a good bonding state between an electronic component and an electrode terminal, to improve productivity, and to downsize a substrate.SOLUTION: A method for bonding an electronic component comprises steps of: applying a metal fine powder paste 4 to each of a plurality of electrodes 2 provided on a substrate 1 (application step); mounting each of a plurality of electronic components 5 having different heights on the plurality of electrodes (component mounting step); mounting an organic film 6 on the plurality of electronic components; uniforming the height of the organic film by applying a first pressure to the electronic component side by a pressing member 58 (organic film pressurizing step); and bonding each electrode terminal of the plurality of electronic components to each electrode of the substrate by applying a second pressure to the electronic component side by a pressurizing member 58 and by sintering the metal fine powder paste by heating the electronic component side for a prescribed time (bonding step).
摘要翻译：要解决的问题：确保电子部件和电极端子之间的良好的接合状态，以提高生产率和减小基板的尺寸。解决方案：一种用于接合电子部件的方法包括以下步骤：将金属细粉末膏4 到设置在基板1上的多个电极2的各个（涂敷工序）。在多个电极上安装具有不同高度的多个电子部件5中的每一个（部件安装步骤）; 将有机膜6安装在所述多个电子部件上; 通过按压部件58向电子部件侧施加第一压力使有机膜的高度均匀化（有机膜加压工序）; 并且通过加压构件58向电子部件侧施加第二压力并且通过将电子部件侧加热规定时间来烧结金属细粉末糊料，将多个电子部件的各电极端子接合到基板的各个电极（接合工序）。

5. 发明专利

JP2006032401A Mounting structure and method of electronic component 有权
标题翻译：电子元件的安装结构和方法
公开(公告)号：JP2006032401A
公开(公告)日：2006-02-02
申请号：JP2004204639
申请日：2004-07-12
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： WATANABE YASUSHI , HIBINO IKUO
IPC分类号： H05K1/18 , H05K3/32
CPC分类号： H05K3/32 , H05K1/183 , H05K3/28 , H05K2201/10636 , H05K2203/0173 , H05K2203/1469 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting structure and a mounting method which can realize reduction in cost by surely positioning electronic components on a film substrate and simultaneously mounting electronic components at the time of forming a conductive pattern on the film substrate. SOLUTION: The film substrate 2 related to the electronic component mounting structure 1 allows the formation of positioning holes 2a, 2b for positioning through insertion of electronic components 3, 4. In the electronic components 3, 4 positioned through insertion into these positioning holes 2a, 2b, end surfaces 3b, 4b are projected from one surface 2c of the film substrate 2, while the other end surfaces 3c, 4c are located within the positioning holes 2a, 2b. The conductive pattern 5 is formed to the other surface 2d of the film substrate 2 and is electrically connected with the other surfaces 3c, 4c of the electric components 3, 4 located in the positioning holes 2a, 2b. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电子部件安装结构和安装方法，其可以通过将电子部件确定地定位在薄膜基板上并且在薄膜上形成导电图案时同时安装电子部件来实现成本降低基质。＆lt; P＆gt;解决方案：与电子部件安装结构1相关的膜基板2允许形成用于通过插入电子部件3,4定位的定位孔2a，2b。在通过插入到这些定位中定位的电子部件3,4中孔2a，2b，端面3b，4b从薄膜基板2的一个表面2c突出，而另一个端面3c，4c位于定位孔2a，2b内。导电图案5形成在薄膜基板2的另一个表面2d上，并且与位于定位孔2a，2b中的电气部件3,4的其它表面3c，4c电连接。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP4966156B2 Cradle and wiring board of the connection device using the same wiring board, connection method 有权
公开(公告)号：JP4966156B2
公开(公告)日：2012-07-04
申请号：JP2007275184
申请日：2007-10-23
申请人：ソニーケミカル&インフォメーションデバイス株式会社
发明人：雅男斉藤
IPC分类号： H05K3/36 , H05K3/00
CPC分类号： H05K3/361 , H05K3/323 , H05K2203/0173 , H05K2203/0195 , H05K2203/0278 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/5317

8. 发明专利

JP4191068B2 Substrate holding device, printing equipment and printing method of bonding material 有权
公开(公告)号：JP4191068B2
公开(公告)日：2008-12-03
申请号：JP2004061772
申请日：2004-03-05
申请人：パナソニック株式会社
发明人：大山内 , 正憲岩崎 , 純白井
IPC分类号： H05K13/04 , B05D5/00 , B05D5/10 , B41F15/08 , H05K3/12 , H05K3/30 , H05K3/34 , H05K13/00
CPC分类号： H05K13/0069 , H05K3/1216 , H05K3/3415 , H05K2203/0165 , H05K2203/0173 , H05K2203/1572

9. 发明专利

JP2017504194A 電子回路のための高度にスケーラブルな製造技術及びパッケージングデバイス有权
标题翻译：高度可扩展的制造技术和包装设备用于电子
公开(公告)号：JP2017504194A
公开(公告)日：2017-02-02
申请号：JP2016541303
申请日：2014-12-19
申请人：ザリージェンツオブザユニバーシティオブカリフォルニア , ザリージェンツオブザユニバーシティオブカリフォルニア
发明人：コールマン，トッド，プレンティス , キム，ユン，ソン , バヘマ，マイケル , ワインレブ，ロバート，エヌ．
IPC分类号： H01L21/60 , B81B7/02
CPC分类号： H05K1/118 , H01L21/4853 , H01L21/4857 , H01L21/56 , H01L23/145 , H01L23/5387 , H01L23/5389 , H01L24/24 , H01L24/25 , H01L24/82 , H01L33/62 , H01L2224/24011 , H01L2224/2402 , H01L2224/24101 , H01L2224/24137 , H01L2224/25175 , H01L2224/82005 , H01L2224/82051 , H01L2224/82106 , H01L2224/82951 , H01L2224/97 , H01L2933/0066 , H05K1/025 , H05K1/0393 , H05K1/189 , H05K3/303 , H05K3/4644 , H05K3/465 , H05K3/4682 , H05K2201/0154 , H05K2201/0162 , H05K2201/0209 , H05K2201/026 , H05K2201/10037 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2201/10166 , H05K2201/10174 , H05K2201/10522 , H05K2203/0173 , H05K2203/1316 , H05K2203/1469 , H05K3/467 , H01L2224/82
摘要：高度にスケーラブルな電子回路、デバイス及びシステムの製造方法を開示する。一側面において、製造方法は、フレキシブルな電気絶縁性材料を含む基板上の位置に電子部品を取り付けることと、電子部品及び基板の表面に順応する相の材料を堆積させることによって電子部品を収容するテンプレートを形成することと、材料を固体状態に変化させることと、基板に開口を形成し、電子部品の導電部分を露出させ、基板の選択された構成において導電部分の少なくとも幾つかに接続する電気相互接続を形成し、基板上で電気相互接続上に電気絶縁性のフレキシブル材料の層を堆積させて、回路のフレキシブルベースを形成することによって、テンプレートに収容された回路又は電子デバイスを作成することと、を含む。【選択図】図1
摘要翻译：高度公开了用于生产一个可扩展的电子电路，设备和系统的方法。在一个方面中，一种制造方法，通过沉积的电子部件附着在基板上的位置，其包括柔性的电绝缘材料，该相以容纳电子元件和基片材料的表面容纳所述电子部件和形成模板，并改变在固态材料，以在所述衬底以暴露所述电子部件的导电部分的开口，在所述车载电气的选择的配置连接到至少一些所述导电部分的以形成互连以及在衬底上沉积电绝缘柔性材料层，通过形成电路的柔性基底，形成容纳在模板的电路或电子设备电互连并且，包括。 1点域

10. 发明专利

JP4317795B2 Implementation method of the electronic parts 有权
公开(公告)号：JP4317795B2
公开(公告)日：2009-08-19
申请号：JP2004204639
申请日：2004-07-12
申请人：アルプス電気株式会社
发明人：郁夫日比野 , 靖渡辺
IPC分类号： H05K1/18 , H05K3/32
CPC分类号： H05K3/32 , H05K1/183 , H05K3/28 , H05K2201/10636 , H05K2203/0173 , H05K2203/1469 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139

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