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1. 发明专利

JP2014220415A 基板表面処理方法及び装置有权
标题翻译：基板表面处理方法和装置
公开(公告)号：JP2014220415A
公开(公告)日：2014-11-20
申请号：JP2013099380
申请日：2013-05-09
申请人：須賀唯知 , Tadatomo Suga , 唯知須賀 , ボンドテック株式会社 , Bondtech Inc
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/02 , B23K20/00 , B23K20/24 , C23C14/46 , H01L21/304
CPC分类号： B23K20/00 , B23K20/24 , C23C14/46 , H01L21/02 , H01L21/30
摘要：【課題】一方の基板に対する表面処理により飛散するスパッタ粒子が他方の基板に影響をあたえずに、ライン式粒子ビーム源を用いた基板表面の処理方法及び処理装置を提供することを目的とする。【解決手段】2つの対向する基板の間に配置されたライン式粒子ビーム源を用いて、一方の基板の表面に対してビーム照射を行うことと、ビーム照射の際に、2つの基板の間に配置された遮蔽部材を用いて、一方の基板から放出される物質が他方の基板に付着することを防ぐことと、を備える基板表面処理方法。【選択図】図1
摘要翻译：要解决的问题：提供一种使用线型粒子束源的基板表面的处理方法和处理装置，其中通过一个基板的表面处理散射的溅射颗粒不影响另一个基板。解决方案：基板表面处理方法包括通过使用布置在彼此面对的两个基板之间的线型粒子束源来对一个基板的表面进行光束照射，并且在光束照射期间通过使用屏蔽构件来防止从一个基板释放的物质与另一个基板的粘附布置在两个基板之间。

2. 发明专利

JP2011119717A Bonding system and bonding method 有权
标题翻译：粘接系统和粘接方法
公开(公告)号：JP2011119717A
公开(公告)日：2011-06-16
申请号：JP2010247508
申请日：2010-11-04
申请人： Bondtech Inc , Tadatomo Suga , ボンドテック株式会社 , 唯知須賀
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60
CPC分类号： H01L24/80 , H01L24/81 , H01L2224/13021 , H01L2224/16111 , H01L2224/80895 , H01L2224/80896 , H01L2224/81895 , H01L2224/81896
摘要： PROBLEM TO BE SOLVED: To provide a bonding technology capable of securing the favorable bonding strength of both objects to be bonded without forming a resin layer necessarily when both the objects to be bonded are connected electrically.
SOLUTION: In a bonding system, two objects 91 and 92 to be bonded each having a bonding part PT1 composed of one of Au(gold), Cu(copper) and Al(aluminum) and a bonding part PT2 composed of one of one of Si(silicon), SiO
2 (silicon dioxide) or glass on bonding surfaces thereof are bonded. In the bonding system, each bonding surface of two objects 91 and 92 to be bonded is subjected to hydrophilic treatment by an energy wave, and then the two objects 91 and 92 to be bonded are pressed and bonded in a state that the bonding parts PT1 of the two objects 91 and 92 to be bonded and the bonding parts PT2 of the two objects 91 and 92 to be bonded are brought into contact with each other.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种接合技术，其能够在要被接合的物体两端电连接的同时，在不形成树脂层的情况下确保两接合物的良好的接合强度。解决方案：在接合系统中，要结合的两个物体91和92具有由Au（金），Cu（铜）和Al（铝）之一组成的接合部分PT1和由一个的Si（硅），SiO 2 （二氧化硅）之一或其结合面上的玻璃。在接合系统中，要接合的两个物体91和92的每个接合表面通过能量波进行亲水处理，然后在待接合的两个物体91和92被压接和接合在接合部分PT1 要接合的两个物体91和92的两个物体91和92的接合部分PT2彼此接触。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2008093801A Sealing joint performance evaluation device, manufacturing method for sealing joint performance evaluation device, sealing joint performance evaluation method and sealing joint performance evaluation system 有权
标题翻译：密封性能评估装置，密封性能评估装置的制造方法，密封性能评估方法和密封性能评估系统
公开(公告)号：JP2008093801A
公开(公告)日：2008-04-24
申请号：JP2006280174
申请日：2006-10-13
申请人： Matsushita Electric Works Ltd , Tadatomo Suga , 松下電工株式会社 , 唯知須賀
发明人： BABA TORU , SUZUKI YUJI , SANAGAWA YOSHIHARU , SUGA TADATOMO , ITO HISAHIRO , OKADA HIRONAO
IPC分类号： B81B3/00 , B81C99/00 , H01L23/02
摘要： PROBLEM TO BE SOLVED: To easily evaluate sealing performance of sealing joint.
SOLUTION: The sealing joint performance evaluation device is provided with a frame part 4 having an opening 3; a plurality of vibration bodies 5a, 5b, 5c supported in the opening 3 of the frame part 4; a light-transmitting cap part 6 formed on an upper surface of the frame part 4; and a silicon substrate 7 joined to a lower surface of the frame part 4. The opening 3 is air-tightly sealed by the cap part 6 and the silicon substrate 7. Further, the vibration bodies 5a, 5b, 5c are vibrated, the vibration bodies 5a, 5b, 5c are irradiated with a light through the cap part 6, and the light reflected in the vibration bodies 5a, 5b, 5c is received. Resonance characteristic of the vibration bodies is measured from the received light, and a vacuum degree in the opening 3 is calculated from the measured resonance characteristic.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：容易评估密封接头的密封性能。解决方案：密封接头性能评估装置设置有具有开口3的框架部分4; 支撑在框架部分4的开口3中的多个振动体5a，5b，5c; 形成在框架部4的上表面上的透光帽部6; 以及与框架部4的下表面接合的硅基板7.开口部3由盖部6和硅基板7气密地密封。此外，振动体5a，5b，5c振动，振动主体5a，5b，5c通过盖部6照射光，并且接收在振动体5a，5b，5c中反射的光。从接收的光测量振动体的共振特性，并根据测量的谐振特性计算开口3中的真空度。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007110050A Bump forming method 有权
标题翻译： BUMP形成方法
公开(公告)号：JP2007110050A
公开(公告)日：2007-04-26
申请号：JP2005302144
申请日：2005-10-17
申请人： Namics Corp , Tadatomo Suga , Katsuhide Tsukamoto , ナミックス株式会社 , 勝秀塚本 , 唯知須賀
发明人： SUGA TADATOMO , TSUKAMOTO KATSUHIDE , YOSHII AKITO , KITAMURA MASAHIRO , YAMAGUCHI HIROSHI
IPC分类号： H01L21/60
CPC分类号： H01L2224/11 , H01L2924/01322 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a fine bump forming method indispensable to high density packaging, especially a bump forming method which is cheap as compared with cases based on a photolithographic technique and a plating technique, and is less subject to an environmental side since many chemicals and water are not used.
SOLUTION: The bump forming method comprises the steps of forming conductive resin layers covering a substrate and an electrode front surface on the substrate; removing the conductive resin layer on the substrate by a laser, while leaving the conductive resin layer on the electrode front surface on the substrate; and forming a bump consisting of conductive resin.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供与高密度封装不可缺少的微小凸起形成方法，特别是与基于光刻技术和电镀技术的情况相比便宜的凸块形成方法，并且较少受环境影响因为许多化学品和水不被使用。解决方案：凸块形成方法包括以下步骤：在基板上形成覆盖基板的导电树脂层和电极前表面; 通过激光去除基板上的导电树脂层，同时将导电树脂层留在基板上的电极前表面上; 并形成由导电树脂组成的凸块。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2004327718A Method of mounting electronic component 有权
标题翻译：安装电子元件的方法
公开(公告)号：JP2004327718A
公开(公告)日：2004-11-18
申请号：JP2003120408
申请日：2003-04-24
申请人： Fujitsu Ltd , Hitachi Ltd , Matsushita Electric Ind Co Ltd , Mitsubishi Electric Corp , Nec Corp , Oki Electric Ind Co Ltd , Rohm Co Ltd , Sanyo Electric Co Ltd , Sharp Corp , Shinko Electric Ind Co Ltd , Sony Corp , Tadatomo Suga , Toshiba Corp , シャープ株式会社 , ソニー株式会社 , ローム株式会社 , 三洋電機株式会社 , 三菱電機株式会社 , 富士通株式会社 , 新光電気工業株式会社 , 日本電気株式会社 , 松下電器産業株式会社 , 株式会社日立製作所 , 株式会社東芝 , 沖電気工業株式会社 , 唯知須賀
发明人： SUGA TADATOMO , ITO HISAHIRO , NAKAZAWA HIDETO , AKAGAWA MASATOSHI
IPC分类号： H05K1/18 , H01L21/52 , H01L21/60 , H01L23/498 , H05K3/34
CPC分类号： H01L24/81 , H01L23/49816 , H01L2224/05568 , H01L2224/05573 , H01L2224/13111 , H01L2224/13144 , H01L2224/16 , H01L2224/81054 , H01L2224/81191 , H01L2224/81192 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2224/81894 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H05K3/3436 , H05K2203/085 , H05K2203/086 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149 , Y10T29/49197 , H01L2224/05624 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a mounting method for connecting electronic components to a board through normal temperature jointing, without applying severe pretreatment for a connection surface due to CMP (chemical mechanical polish) or electrolytic polishing, in order to suppress dispersions in roughness or the height of connection surfaces of the electronic components, such as semiconductor chips, semiconductor packages or the like or bumps on the mounting board. SOLUTION: A connection member of at least one of the electronic component and the substrate is formed of a solder material, and the electronic component is contacted with the connecting member of the substrate at a normal temperature. As the solder material, a material, in which a load upon showing the changing amount of 8μm in the direction of the height of a spherical bump, having a diameter of 130μm in a direction parallel to an electronic component body is not larger than 100g, when a vertical load is applied, is employed. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供通过常温接合将电子部件连接到电路板的安装方法，而不对CMP（化学机械抛光）或电解抛光对连接表面进行严格的预处理，以便抑制分散体粗糙度或电子部件的连接表面的高度，例如半导体芯片，半导体封装等或安装板上的凸块。解决方案：电子部件和基板中的至少一个的连接部件由焊料材料形成，并且电子部件在常温下与基板的连接部件接触。作为焊料材料，在与电子部件主体平行的方向上具有直径为130μm的球状凸块的高度方向上显示8μm的变化量的负载的材料不大于100g，当施加垂直载荷时。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004093451A Probe method and probe device 审中-公开
公开(公告)号：JP2004093451A
公开(公告)日：2004-03-25
申请号：JP2002256746
申请日：2002-09-02
申请人： Hisahiro Ito , Kenichi Kataoka , Katsuya Okumura , Tadatomo Suga , Tokyo Electron Ltd , 伊藤寿浩 , 奥村勝弥 , 東京エレクトロン株式会社 , 片岡憲一 , 須賀唯知
发明人： SUGA TADATOMO , OKUMURA KATSUYA , ITO HISAHIRO , KATAOKA KENICHI , KOMATSU SHIGEKAZU , ABE YUICHI
IPC分类号： G01R1/06 , G01R1/067 , G01R1/073 , G01R31/28 , H01L21/66
CPC分类号： G01R1/07314 , G01R1/06766 , G01R31/2831 , G01R31/2886
摘要： PROBLEM TO BE SOLVED: To provide a probe method and a probe device as improvement of a conventional inspecting method in which a stylus pressure is given to break an oxide film of an electrode pad involving such a problem that the stylus pressure from a contact shoe may change the electric characteristics such as the transistor characteristics and a stylus pressure as large as breaking the oxide film of the electrode pad can not be given in case a soft material such as Low-k material having a low diffraction factor is used in the sub-layer of the electrode pad.
SOLUTION: The probe method consists of three processes, one in which the electrode pad P of a wafer W is subjected to a reduction process using a foaming gas, another in which the electrode pad P and a probe 144 are put in contact, and a third in which the electrode pad P and the probe 144 are put in electric continuity using fritting phenomenon.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2014179420A Method for bonding electronic component 有权
标题翻译：用于绑定电子元件的方法
公开(公告)号：JP2014179420A
公开(公告)日：2014-09-25
申请号：JP2013051680
申请日：2013-03-14
申请人： Alpha- Design Kk , アルファーデザイン株式会社 , Tadatomo Suga , 唯知須賀 , Masataka Mizukoshi , 正孝水越
发明人： SHIRATORI TOSHIYUKI , KAWASAKI KYO , SUGA TADATOMO , MIZUKOSHI MASATAKA
IPC分类号： H01L21/603 , B23K20/00 , B23K20/24 , H01L21/60
CPC分类号： H01L2224/16225 , H01L2224/73253
摘要： PROBLEM TO BE SOLVED: To secure a good bonding state between an electronic component and an electrode terminal, to improve productivity, and to downsize a substrate.SOLUTION: A method for bonding an electronic component comprises the steps of: mounting electrode terminals 4a of electronic components 4 having different heights on a plurality of electrodes 2a of a substrate 1 (component mounting step); mounting an organic film 5 thicker than a height difference between the highest electronic component and the lowest electronic component among a plurality of electronic components on the plurality of electronic components (organic film mounting step); uniforming the height of a pressed surface 5a of the organic film by applying a first pressure to the electronic component side by pressing a tabular pressing surface 58a of the pressing member 58 heated to a prescribed temperature against the organic film (organic film pressurizing step); and bonding each electrode terminal of the plurality of electronic components to each electrode of the substrate by applying a second pressure to the electric component side by the pressing member by pressing a tabular pressurizing surface 58a of a pressurizing member 58 against the pressed surface and heating the electronic component side for a prescribed time (bonding step).
摘要翻译：要解决的问题：确保电子部件和电极端子之间的良好的接合状态，以提高生产率并且使基板小型化。解决方案：一种用于接合电子部件的方法包括以下步骤：安装电子部件的电极端子4a 在基板1的多个电极2a上具有不同高度的部件4（部件安装步骤）; 在多个电子部件的多个电子部件之中安装比最高电子部件与最低电子部件的高度差更厚的有机膜5（有机膜安装工序）; 通过对被加热到预定温度的加压构件58的平板状的按压面58a压在有机膜上（有机膜加压步骤），通过向电子部件侧施加第一压力来均匀化有机膜的压制表面5a的高度; 并且通过将加压构件58的平板状加压面58a压靠在被按压面上，通过对按压部件施加第二压力而将多个电子部件的各个电极端子接合到基板的各个电极，并加热电子部件侧规定时间（接合工序）。

8. 发明专利

JP2013251405A Bonding method of substrate having metal region 审中-公开
标题翻译：具有金属区域的基板的接合方法
公开(公告)号：JP2013251405A
公开(公告)日：2013-12-12
申请号：JP2012125246
申请日：2012-05-31
申请人： Tadatomo Suga , 唯知須賀 , Bondtech Inc , ボンドテック株式会社
发明人： SUGA TADATOMO , YAMAUCHI AKIRA
IPC分类号： H01L21/60 , B23K20/00 , B23K20/24 , H01L21/603
摘要： PROBLEM TO BE SOLVED: To provide a technique for mutually bonding substrates having a junction interface having metal regions.SOLUTION: The method of mutually bonding substrates having a junction interface having metal regions includes a step (S1) for polishing a junction interface having metal regions, a step (S2) for performing surface activation by colliding particles having predetermined kinetic energy against a polished junction interface, and further performing hydrophilic treatment by depositing the water, a step (S3) for forming a substrate assembly by bonding the junction interfaces of the substrates so that the metal regions subjected to surface activation and hydrophilic treatment come into contact with each other, and a step (S4) for heating the substrate assembly.
摘要翻译：要解决的问题：提供一种用于相互粘合具有金属区域的接合界面的基板的技术。解决方案：具有金属区域的具有接合界面的基板的相互粘合的方法包括用于抛光具有金属区域的接合界面的步骤（S1），用于通过使具有预定动能的颗粒与抛光的接合界面碰撞来进行表面活化的步骤（S2），以及进一步通过沉积水来进行亲水处理;步骤（S3），用于通过将所述接合界面的接合界面基板，使得经受表面活化和亲水处理的金属区域彼此接触;以及用于加热基板组件的步骤（S4）。

9. 发明专利

JP2013221175A Method for removing surface oxide using organic acid gas under existence of metal catalyst or inert gas atmosphere, and joining device 有权
标题翻译：在金属催化剂或惰性气体环境存在下使用有机酸气体除去表面氧化物的方法和接合装置
公开(公告)号：JP2013221175A
公开(公告)日：2013-10-28
申请号：JP2012093437
申请日：2012-04-16
申请人： Tadatomo Suga , 唯知須賀 , Bondtech Inc , ボンドテック株式会社
发明人： SUGA TADATOMO , AKAIKE MASATAKE , YANG WENHUA , YAMAUCHI AKIRA
IPC分类号： C23G5/00 , B23K20/00 , H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/75 , H01L2924/1461 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for joining members having a metallic region and a resin region at least on its surface portion without heating at a high temperature and without degrading resin surfaces during joining.SOLUTION: A method includes the steps of: removing an oxide film on a metallic region 3 on a first member having the metallic region and a resin region at least on its surface portion and an oxide film on a metallic region 5 on a second member having the metallic region and a resin region at least on its surface portion by blowing organic gas passed through a catalyst and hydrogen generated by degrading the organic acid gas from an opening 11 of a nozzle 6; and joining the first member and the second member so that the metallic regions from which the oxide films have been removed may contact with each other.
摘要翻译：要解决的问题：提供一种在接合期间至少在其表面部分上连接具有金属区域和树脂区域的构件而不在高温下加热而不降低树脂表面的方法。方法包括以下步骤：除去在具有金属区域的第一构件和至少在其表面部分上具有树脂区域的金属区域3上的金属区域3上的氧化物膜和具有金属区域的第二构件上的金属区域5上的氧化膜和至少在其上的树脂区域通过吹入通过催化剂的有机气体的表面部分和由喷嘴6的开口11使有机酸气体降解而产生的氢; 并且将第一构件和第二构件接合，使得已经从其去除氧化膜的金属区域彼此接触。

10. 发明专利

JP2011249643A Bonding method and bonding system 有权
标题翻译：结合方法和结合系统
公开(公告)号：JP2011249643A
公开(公告)日：2011-12-08
申请号：JP2010122616
申请日：2010-05-28
申请人： Bondtech Inc , Shinko Seiki Co Ltd , Tadatomo Suga , ボンドテック株式会社 , 神港精機株式会社 , 唯知須賀
发明人： WANG CHENXI , SUGA TADATOMO , YAMAUCHI AKIRA , KAGAMI JOJI
IPC分类号： H01L21/02 , B23K20/00 , B23K20/24
摘要： PROBLEM TO BE SOLVED: To provide a bonding technology capable of minimizing occurrence of micro voids even when heat treatment is performed in a process subsequent to a bonding process.SOLUTION: A porous oxide is created on the bonding surface of at least one of two objects to be bonded by irradiating the bonding surface with an energy wave (e.g. plasma processing) (step S10). Subsequently, an appropriate amount of water molecules is stuck to the bonding surface on which the porous oxide is created (step S20). Thereafter, the two objects to be bonded are pressed while touching the bonding surfaces thereof each other in a state where water molecules are stuck to the bonding surfaces, thus bonding the two objects to be bonded (step S30).
摘要翻译：要解决的问题：即使在接合工艺之后的过程中进行热处理，也提供能够最小化微细孔的发生的接合技术。解决方案：通过用能量波（例如等离子体处理）照射接合表面，在要接合的两个物体中的至少一个的接合表面上形成多孔氧化物（步骤S10）。随后，在形成多孔氧化物的接合面上粘贴适量的水分子（步骤S20）。此后，在水分子粘附到接合表面的状态下，接触两个接合表面的同时按压两个待粘合的物体，从而粘接待接合的两个物体（步骤S30）。版权所有（C）2012，JPO＆INPIT

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