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    • 1. 发明专利
    • Component jointing device
    • 组件连接设备
    • JP2014179421A
    • 2014-09-25
    • JP2013051681
    • 2013-03-14
    • Alpha- Design Kkアルファーデザイン株式会社Tadatomo Suga唯知 須賀Masataka Mizukoshi正孝 水越
    • SHIRATORI TOSHIYUKIKAWASAKI KYOSUGA TADATOMOMIZUKOSHI MASATAKA
    • H01L21/60
    • H01L24/95H01L24/75H01L24/83
    • PROBLEM TO BE SOLVED: To miniaturize a device and improve productivity of the device while securing a good jointing state of an electrode terminal of an electronic component and an electrode of a substrate.SOLUTION: The component jointing device comprises: a base case 2 that has a first base 3 and a second base 4 that can be coupled with and separated from each other, and in which an arrangement space 7 for arranging a substrate 51 and plural electronic components 52 with different height inside while the first base is coupled with the second base is formed; oil 22 sealed in the arrangement space; an oil sealing material 19 sealing the oil in the arrangement space and deformed according to pressure of the oil; an oil hydraulic change part 14 for changing the pressure of the oil; and heaters 8, 24 for heating the base case 2. When the substrate and the plural electronic components are arranged in the arrangement space, heating is done and the plural electronic components are pressurized by the oil sealing material. Each electrode terminal 52a of the electronic component is pressed to each electrode 51a of each substrate, so that each electrode terminal is jointed to each electrode.
    • 要解决的问题:为了使装置小型化并提高装置的生产率,同时确保电子部件的电极端子和基板的电极的良好的接合状态。解决方案:部件接合装置包括:基部壳体2,其具有 可以彼此耦合并分离的第一基座3和第二基座4,并且其中布置空间7用于布置基板51和具有不同高度的多个电子部件52,同时第一基座与第二基座 基地形成; 油22密封在安排空间; 密封材料19,其密封所述布置空间中的油并根据油的压力而变形; 用于改变油压的油压变化部分14; 以及用于加热基底壳体2的加热器8,24。当基板和多个电子部件布置在布置空间中时,进行加热,并且多个电子部件被油封材料加压。 电子部件的每个电极端子52a被按压到每个基板的每个电极51a,使得每个电极端子被连接到每个电极。
    • 3. 发明专利
    • Component mounting device, and method and program for mounting component by component mounting device
    • 组件安装设备,以及通过组件安装设备安装组件的方法和程序
    • JP2014096543A
    • 2014-05-22
    • JP2012248771
    • 2012-11-12
    • Alpha- Design Kkアルファーデザイン株式会社
    • SHIOIRI TSUTOMU
    • H05K13/04
    • PROBLEM TO BE SOLVED: To prevent a component from breaking or cracking inside and to improve mounting precision of the component.SOLUTION: A component mounting device includes: an elevation base 3 which has a stopper 11 and is supported on a support base 2 to freely move up and down in a vertical direction; a component mounting part 4 which has a mounting head 14 for mounting the component 100 on a mounted object 200, and is supported on the elevation base movably in up/down directions and restricted by the stopper from moving down to the elevation base; a load reduction part 5 which applies upward force to the component mounting part so as to reduce the gravitational downward load of the component; and a voice coil motor 6 which places a downward load on the component mounting part, the downward load being changed. The elevation base and component mounting part are moved down to mount the component on the mounted object by the mounting head, and the load of a voice coil motor on the component mounting part is changed halfway in the operation to mount the component by the downward movement of the elevation base and component mounting part.
    • 要解决的问题:防止部件在内部破裂或破裂,并提高部件的安装精度。解决方案:部件安装装置包括:升降台3,其具有止动件11并被支撑在支撑基座2上以自由地 在垂直方向上下移动; 部件安装部分4具有用于将部件100安装在安装对象200上的安装头14,并且在上下方向上可移动地支撑在升降台上,并被止动器限制向下移动到升降台; 负载减少部5,向部件安装部施加向上的力,以减小部件的重力向下的载荷; 以及向组件安装部分施加向下的负载的音圈电动机6,向下的负载改变。 升降台和部件安装部分向下移动以通过安装头将部件安装在安装的对象上,并且在组件安装部分上的音圈电机的负载在通过向下移动来安装部件的操作中改变一半 的高度基座和部件安装部分。
    • 6. 发明专利
    • Method and device of wiring solar cell
    • 接线太阳能电池的方法和装置
    • JP2011181779A
    • 2011-09-15
    • JP2010045925
    • 2010-03-02
    • Alpha- Design Kkアルファーデザイン株式会社
    • ISHIDA HIDETOOKUYAMA SHOICHI
    • H01L31/042
    • Y02E10/50
    • PROBLEM TO BE SOLVED: To provide an automated wiring device for a solar cell element because conventionally the solar cell element is wired with a bus bar manually in most cases, thus the quality is unstable and the production yield is low, making it difficult to manufacture a solar cell module inexpensively. SOLUTION: An effective method of wiring the solar cell element, especially the method of placing the cell on an extension of a bus bar manufacturing line, is provided. By this method, it is possible to automatically manufacture a module of the solar cell in various sizes depending on its application, and to wire the solar cell inexpensively and with a high quality. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:为了提供一种用于太阳能电池元件的自动化接线装置,因为在大多数情况下,太阳能电池元件通常手动连接太阳能电池元件,因此质量不稳定并且生产成品率低 难以廉价地制造太阳能电池组件。 解决方案:提供一种将太阳能电池元件接线的有效方法,特别是将电池放置在母线制造线的延伸部上的方法。 通过该方法,可以根据其应用自动地制造各种尺寸的太阳能电池组件,并且以高质量廉价地连接太阳能电池。 版权所有(C)2011,JPO&INPIT
    • 7. 发明专利
    • Transfer apparatus
    • 传送装置
    • JP2010135574A
    • 2010-06-17
    • JP2008310473
    • 2008-12-05
    • Alpha- Design Kkアルファーデザイン株式会社
    • YANAGISAWA KUNIKAZU
    • H01L21/50
    • PROBLEM TO BE SOLVED: To provide a means for transferring chips accurately to a transfer destination by providing a control means that adjusts heads for chucking chips from a substrate wherein the chips to be transferred are placed and transferring them to a transfer destination, with first, second and third cameras for their mutual positions in a transfer apparatus. SOLUTION: The movement of a head 21 is imaged without stopping when a chip 16 is transferred from the transfer source 14 to the transfer destination 15, and the position of the chip is corrected while the head is moved, thereby permitting more accurate transfer work and shortening a tact time. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种用于通过提供一种控制装置来将芯片精确地传送到转移目的地的装置,该控制装置调整用于从放置待转移的芯片的基板夹持芯片的头并将其转移到转移目的地, 其中第一,第二和第三相机用于它们在传送装置中的相互位置。 解决方案:当芯片16从传送源14传送到传送目的地15时,头21的移动成像,而不停止,并且在头移动时校正芯片的位置,从而允许更准确 转移工作,缩短节拍时间。 版权所有(C)2010,JPO&INPIT
    • 8. 发明专利
    • Flip-chip bonder apparatus
    • FLIP-CHIP BONDER APPARATUS
    • JP2010114103A
    • 2010-05-20
    • JP2008282670
    • 2008-11-04
    • Alpha- Design Kkアルファーデザイン株式会社
    • KAWASAKI KYOAWAJIYA NORIHIROMINAMIYA TADASHIUEMURA TAKAO
    • H01L21/60
    • PROBLEM TO BE SOLVED: To prevent faults from occurring, by reassessing the method of adjusting parallelism in a workbench plate, since a non-conforming article is generated, if a head for work is not in parallel with the workbench plate and precision of parallelism in the workbench plate is changed by thermal effects, hen performing heating, pressurizing, and jointing of a semiconductor chip and a circuit board in a flip-cip bonding apparatus. SOLUTION: Shafts for supporting the workbench plate 20 are provided at three points (311, 312, 313) and are moved in the vertical directions, by controlling using a jacking means; the head for work is brought into contact with the workbench plate; the heights at the three points are measured for measuring parallelism; and the parallelism of the workbench plate is adjusted by a control section, thus preventing non-conforming articles from being produced. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:为了防止发生故障,通过重新评估在工作台板中调整平行度的方法,由于产生不合格制品,如果工作头不与工作台板平行并且精度 通过热效应改变工作台中的平行度,在倒装接合装置中进行半导体芯片和电路板的加热,加压和接合。 解决方案:通过使用顶起装置进行控制,在三点(311,312,313)处设置用于支撑工作台板20的轴,并且在垂直方向上移动; 工作头与工作台接触; 测量三点的高度用于测量并行度; 并且通过控制部调整工作台板的平行度,从而防止不合格制品的产生。 版权所有(C)2010,JPO&INPIT
    • 9. 发明专利
    • Flip-chip bonder device
    • 液晶贴片设备
    • JP2010010547A
    • 2010-01-14
    • JP2008170185
    • 2008-06-30
    • Alpha- Design Kkアルファーデザイン株式会社
    • KAWASAKI KYO
    • H01L21/60
    • H01L24/75H01L2924/14H01L2924/00
    • PROBLEM TO BE SOLVED: To solve such a problem that there is the cause that the temperature of a 2-field camera is changed, a focus is displaced and a defective is generated because the 2-field camera is used for confirming and adjusting a final place at a time when a semiconductor chip and a circuit board are joined in a heating-pressing manner but the 2-field camera is arranged adjacently to a heating section in a flip-chip bonder device. SOLUTION: The accurate position of the focus can be kept by uniformly cooling the whole 2-field camera and removing the distortion of the whole 2-field camera. Consequently, the generation of the defective can be prevented. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题为了解决存在2场照相机的温度改变的原因的问题,由于2场照相机用于确认和照亮,因此焦点偏移并且产生缺陷, 在半导体芯片和电路板以加热方式接合的状态下调整最终位置,但是在倒装芯片连接装置中,2场照相机与加热部相邻配置。

      解决方案:通过均匀冷却整个2摄像机并消除整个2摄像机的失真,可以保持对焦的准确位置。 因此,可以防止产生缺陷。 版权所有(C)2010,JPO&INPIT

    • 10. 发明专利
    • Stapler
    • JP2009220236A
    • 2009-10-01
    • JP2008068610
    • 2008-03-18
    • Alpha- Design Kkアルファーデザイン株式会社
    • SATO MASATOSHISAKASHITA SHINYA
    • B25C5/02B25C5/11
    • PROBLEM TO BE SOLVED: To solve problems wherein a means for locking a pressure accumulation elastic body is defined as the elasticity of a material, thereby often causing the fatigue fracture, the pressure accumulation elastic body has a cut portion to often cause the fatigue fracture, the pressure accumulation elastic body sometimes slightly moves to obstruct an operation, and an energizing means for lifting the pressure accumulation elastic body may cause fatigue fracture in a tacker type stapler.
      SOLUTION: The pressure accumulation elastic body is molded at a predetermined V-shaped opening to eliminate the cut part and is configured to be lifted by a spring to greatly reduce the fatigue fracture. The pressure accumulation elastic body is locked by a journalled trigger to eliminate the fatigue fracture of an engagement means. The pressure accumulation elastic body and a blade are retained by a hook part to prevent the slight movement of the accumulation elastic body. A hook button facilitates the extraction of a magazine to facilitate the replacement of staples.
      COPYRIGHT: (C)2010,JPO&INPIT