专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2018037634A 抵抗素子及び抵抗素子アセンブリ审中-公开
公开(公告)号：JP2018037634A
公开(公告)日：2018-03-08
申请号：JP2017058432
申请日：2017-03-24
申请人：サムソンエレクトロ−メカニックスカンパニーリミテッド.
发明人：パク、クァンヒョン , キム、ハエイン
IPC分类号： H01C7/00 , H01C7/12
CPC分类号： H01C1/06 , H01C1/012 , H01C1/14 , H01C1/148 , H01C7/003 , H01C17/006 , H05K1/0259 , H05K2201/10022
摘要：【課題】本発明は、抵抗素子及び抵抗素子アセンブリに関する。【解決手段】本発明の一実施形態による抵抗素子は、互いに対向する第1面及び第2面を有するベース基材と、上記ベース基材の第1面に配置された抵抗層と、上記ベース基材の両端部にそれぞれ配置され、上記抵抗層の両側にそれぞれ電気的に連結された第1端子及び第2端子と、上記ベース基材の第2面において上記第1端子と上記第2端子との間に配置され、上記第1端子及び上記第2端子から離隔した第3端子と、上記第1端子と上記第3端子とを電気的に連結し、上記第2端子と上記第3端子とを電気的に連結するESD防止部材と、を含む。【選択図】図3

3. 发明专利

JP2006086274A Stacked varistor, mounting structure thereof, and varistor module 审中-公开
标题翻译：堆叠变量，其安装结构和变量模块
公开(公告)号：JP2006086274A
公开(公告)日：2006-03-30
申请号：JP2004268322
申请日：2004-09-15
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： KAZAMA SATOSHI
IPC分类号： H01C7/10
CPC分类号： H01C7/18 , H01C1/01 , H01C1/06
摘要： PROBLEM TO BE SOLVED: To provide a stacked varistor excellent in heat dissipation capability by proving at least one heat dissipation conductor conducting to at least one of a first conductor layer and a second conductor layer.
SOLUTION: A heat dissipation conductor 17 is provided on the upper surface 11b of a rectangular parallelepiped stacked chip 11, where a plurality of first conductor layers 13 and a plurality of second conductor layers 14 are alternately formed via varistor layers 12 so as to oppose to each other in a lateral direction. The heat dissipation conductor 17 is connected to the upper edge of each second conductor layer 14 so that, if heat from a heating device such as an IC disposed nearby is transmitted to each first conductor layer 13 and each second conductor layer 14 through a first electrode 15 and a second electrode 16, and if heat is generated when a current flows through the varistor layer 12, these heats are transmitted directly and highly efficiently to the heat dissipation conductor 17 from each second conductor layer 14 and is effectively discharged from the heat dissipation conductor 17 to the outside.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过证明至少一个传导到第一导体层和第二导体层中的至少一个的散热导体来提供散热能力优异的堆叠压敏电阻。解决方案：散热导体17设置在长方体堆叠芯片11的上表面11b上，多个第一导体层13和多个第二导体层14经由变阻器层12交替地形成，以便在横向相互对抗。散热导体17连接到每个第二导体层14的上边缘，使得如果来自设置在附近的IC等加热装置的热量通过第一电极透过到每个第一导体层13和每个第二导体层14 15和第二电极16，并且当电流流过可变电阻层12时产生热量，这些热量从每个第二导体层14直接且高效地传递到散热导体17，并且被有效地从散热中排出导体17到外面。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP4909077B2 Chip resistor 有权
公开(公告)号：JP4909077B2
公开(公告)日：2012-04-04
申请号：JP2006535835
申请日：2005-09-09
申请人：パナソニック株式会社
发明人：聖治星徳 , 泰治木下 , 俊樹松川 , 直樹渋谷
IPC分类号： H01C7/00 , H01C1/14
CPC分类号： H01C1/142 , H01C1/06 , H01C7/003 , H01C17/006

5. 发明专利

JP3560518B2 Resistor 有权
公开(公告)号：JP3560518B2
公开(公告)日：2004-09-02
申请号：JP33036999
申请日：1999-10-15
申请人：タクマン電子株式会社
发明人：泰光織井
IPC分类号： H01C7/00 , H01C1/06
CPC分类号： H01C1/06

6. 发明专利

JP2004071658A Electronic equipment equipped with chip component and its manufacturing method 有权
公开(公告)号：JP2004071658A
公开(公告)日：2004-03-04
申请号：JP2002225416
申请日：2002-08-01
申请人： Nec Corp , 日本電気株式会社
发明人： KIKUCHI HIDEO , SASAKI JUNICHI
IPC分类号： H05K9/00 , H01C1/06 , H01G2/22 , H01G4/228 , H01L21/60 , H01L23/00 , H01L23/485 , H01L23/552 , H01S5/022 , H05K1/02 , H05K1/18
CPC分类号： H01L24/81 , H01C1/06 , H01G2/22 , H01G4/228 , H01L23/552 , H01L24/10 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/14051 , H01L2224/16 , H01L2224/16235 , H01L2224/1703 , H01L2224/17515 , H01L2224/2929 , H01L2224/293 , H01L2224/73153 , H01L2224/73253 , H01L2224/81201 , H01L2224/8121 , H01L2224/81815 , H01L2224/83851 , H01L2224/92225 , H01L2924/0001 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/15192 , H01L2924/15787 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K1/181 , H05K2201/10371 , H05K2201/10734 , H01L2224/81801 , H01L2224/29075 , H01L2924/00 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To sufficiently obtain a shielding effect and cooling effect simultaneously in the shielding structure of a chip component. SOLUTION: The electronic equipment equipped with the chip component is formed of a shield conductor 3, a ceiling plate 4 having left-and-right and fore-and-rear sizes which perfectly covers the chip component 1, and side plates 5 integrated with the ceiling plate 4 and formed so as to be at a position lower than the ceiling plate 4 while being arranged at both sides of left-and-right direction of the chip component 1. Further, openings 8 for opening both sides of fore-and-rear direction of the chip component 1 are formed at both side ends in the fore-and-rear direction of the shield conductor 3, while the side plates 5 for the shield conductor 3 are electrically connected to the ground conductor pattern 11 of a mounting substrate 10 through a plurality of shielding bumps 17 along the fore-and-rear direction of the same. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2009295813A Chip-like electric component and method of manufacturing the same 有权
标题翻译：芯片式电气元件及其制造方法
公开(公告)号：JP2009295813A
公开(公告)日：2009-12-17
申请号：JP2008148287
申请日：2008-06-05
申请人： Hokuriku Electric Ind Co Ltd , 北陸電気工業株式会社
发明人： TAKEUCHI KATSUMI , NOMURA YUTAKA , KUROKAWA HIROYUKI
IPC分类号： H01C7/00 , H01C1/012
CPC分类号： H01C7/003 , H01C1/06 , H01C17/006 , H01C17/06506 , Y10T29/49155
摘要： PROBLEM TO BE SOLVED: To provide a chip-like electric component such as a chip resistor, which is easy to manufacture and has an insulating substrate prevented from being cracked and broken without increasing the price. SOLUTION: A pair of surface electrodes 21 and 23 is formed so as to have the thickness increased from a resistance layer 13 toward a pair of end parts of an insulating substrate 29 located in a direction in which the pair of surface electrodes 21 and 23 are arranged. A plating reservoir S is formed between the surface electrodes 21 and 23 and an insulating protective layer 15. When one or more plated layers 33 are formed, a plating metal is stored in the plating reservoir, and a level difference formed between a soldered electrode part and a protective layer by the plated layers 33 can be reduced to a certain degree. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供易于制造的片状电阻器等片状电气元件，并且防止了绝缘基板在不增加价格的情况下破裂和断裂。解决方案：一对表面电极21和23被形成为具有从电阻层13向位于一对表面电极21的方向上的绝缘基板29的一对端部增加的厚度和23。在表面电极21和23之间形成有电镀槽S和绝缘保护层15.当形成一个或多个镀层33时，电镀金属储存在电镀槽中，并且在焊接电极部分并且通过镀层33的保护层可以降低到一定程度。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JPWO2006085492A1 静電気保護機能付きチップ部品审中-公开
公开(公告)号：JPWO2006085492A1
公开(公告)日：2008-06-26
申请号：JP2007502588
申请日：2006-02-03
申请人：松下電器産業株式会社
发明人：徳永　英晃 , 英晃徳永 , 井上　竜也 , 竜也井上
IPC分类号： H01C13/02 , H01C7/00 , H01C7/10 , H01C7/12 , H01G4/40
CPC分类号： H01C7/003 , H01C1/06
摘要：基板と、前記基板上に形成された回路素子と、前記基板上に前記回路素子と並列に形成された静電気保護素子と、前記基板の両端部に形成され、前記回路素子と前記保護素子とを外部の回路に接続するための一対の外部電極とを備える静電気保護機能付きチップ部品である。

9. 发明专利

JP2006196902A Ptc current limiter 审中-公开
标题翻译： PTC CURRENT LIMITER
公开(公告)号：JP2006196902A
公开(公告)日：2006-07-27
申请号：JP2006004682
申请日：2006-01-12
申请人： Ls Cable Ltd , Ls Industrial Systems Co Ltd , エルエスインダストリアルシステムカンパニーリミテッドLS Industrial Systems Co., Ltd. , エルエスケーブルリミテッドLS Cable Ltd.
发明人： KANG JONG-SUNG , KIM JU-DAM , LEE BANG-WOOK , LEE YOUNG-JUN , CHOE WON-JOON , HAN JUN-KOO
IPC分类号： H01C7/02
CPC分类号： H01C1/06 , H01C1/1406 , H01C7/027
摘要： PROBLEM TO BE SOLVED: To provide a PTC current limiter that can be used not only in a low-voltage system but also in a high-voltage one by effectively suppressing arc generated when limiting overcurrent and a short circuit current for preventing the flashover between electrodes.
SOLUTION: The PTC current limiter for limiting current by using PTC characteristics comprises a PTC element having the PTC characteristics; a pair of electrode sections arranged on both surfaces while the electrode sections sandwich the PTC element and oppose each other; and a mold section made of an insulator provided at the periphery while the PTC element and at least one portion of the electrode section are enclosed. In this case, the mold section is made of the insulator of an elastic material, and one insulator selected from a group comprising vacuum, gas, and oil.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种PTC限流器，其不仅可以在低压系统中使用，而且还可以用于高压系统中，通过有效地抑制在限制过电流和短路电流时产生的电弧，以防止电极之间闪络。解决方案：通过使用PTC特性限制电流的PTC限流器包括具有PTC特性的PTC元件; 一对电极部分布置在两个表面上，同时电极部分夹持PTC元件并彼此相对; 以及在PTC元件和电极部分的至少一部分被封闭的同时在外围设置的绝缘体制成的模具部分。在这种情况下，模具部分由弹性材料的绝缘体制成，并且一个绝缘体选自包括真空，气体和油的组。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2017500739A 電子デバイスおよびその使用有权
标题翻译：电子设备及其使用
公开(公告)号：JP2017500739A
公开(公告)日：2017-01-05
申请号：JP2016534924
申请日：2014-11-25
申请人：エプコスアクチエンゲゼルシャフトEpcos Ag , エプコスアクチエンゲゼルシャフトEpcos Ag
发明人：オリバーデルノフゼク， , オリバーデルノフゼク， , トーマスファイヒティンガー， , トーマスファイヒティンガー，
IPC分类号： H01L23/02
CPC分类号： H05K9/0081 , H01C1/06 , H01C7/02 , H01C7/04 , H01C7/10 , H01C7/18 , H01G2/22 , H01G4/224 , H01G4/30 , H01L23/552 , H01L25/167 , H01L33/60 , H01L41/0533 , H01L2224/0401 , H01L2224/16225 , H01L2924/10252 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/15311 , H01L2924/15313
摘要：本発明は、反射構造体(2)が設けられている機能体(1)を有する電子デバイス(100)を提供し、この反射構造体(2)は、この電子デバイス(100)に当たる外部からの放射線を前記機能体(1)から離れるように反射するように配設および形成されており、この電子デバイス(100)は、放射線不活性であることを特徴とする。【選択図】図1B
摘要翻译：本发明是反射结构（2）提供具有提供了一个功能部件（1），反射结构的电子装置（100），（2），从外部命中到所述电子设备（100）辐射功能单元（1）被布置和形成，从而反映从电子设备（100）远离，其特征在于它是一个无线电活性。点域1B

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式