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1. 发明专利

JPH0964021A PLASMA PROCESSING METHOD 失效
公开(公告)号：JPH0964021A
公开(公告)日：1997-03-07
申请号：JP23774795
申请日：1995-08-22
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： NONAKA TATSU , KOBAYASHI YOSHIYUKI
IPC分类号： C23C14/34 , C23C16/50 , C23F4/00 , H01L21/302 , H01L21/3065 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a plasma processing method which cause no phenomenon such as rocking and jumping when a workpiece whose process is completed is separated from an electrostatic chuck. SOLUTION: Relating to a method wherein a wafer W is held on an electrostatic chuck 11 in a process chamber 2, and the inside of process chamber 23 is made in a specified degree of vacuum, and plasma is generated in the process chamber 2 for performing specified plasma processing on the workpiece W on the electrostatic chuck 11, after the plasma processing is performed, gas is introduced into the process chamber 2 for making the pressure in the process chamber 2 in degree of vacuum 0.5-3Torr, and under the condition, the water W is separated from the electrostatic chuck 11. Just before the wafer W is separated from the electrostatic chuck 11, residual electric charges mutually cause discharge for destaticization between an insulator surface of the electrostatic chuck 11 and hte rear face of the wafer W, so that the wafer W is smoothly separated from the electrostatic chuck 11.

2. 发明专利

JPH0936188A PROBE CARD DEVICE FOR PROBE DEVICE 失效
公开(公告)号：JPH0936188A
公开(公告)日：1997-02-07
申请号：JP17854395
申请日：1995-07-14
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： HAGIWARA JUNICHI
IPC分类号： G01R31/26 , G01R1/06 , G01R1/073 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a probe card device which is capable of surely bringing all contacts into contact with electrode pads and uniformly applying a pressure to all contact points even when the contacts are brought into contact with the electrode pad of a test work of wide surface. SOLUTION: A probe card device 30 which is used for a probe device which brings bump electrodes 37 into contact with the electrode pads 12a of a semiconductor wafer 12 to check the wafer 12 for electrical properties is equipped with a probe card 32, a support block 31 which supports the probe card 32, and a press mechanism which presses the probe card 32 toward a wafer 12. The press mechanism is equipped with a pressing member 39 composed of blocks 39a and a support member which supports the blocks 39a, wherein the blocks 39a are set separately movable and made to press the wafer 12 conforming to its surface profile.

3. 发明专利

JPH0927458A VACUUM PROCESSING EQUIPMENT 失效
公开(公告)号：JPH0927458A
公开(公告)日：1997-01-28
申请号：JP19612295
申请日：1995-07-07
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： HAYASHI KAZUICHI , IWATA TERUO
IPC分类号： H01L21/302 , F04B37/06 , F04C29/00 , F04D19/04 , F04D29/58 , H01L21/205 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To prevent the adhesion of reaction products in a vacuum pump containing a rotor for use in vacuum processing for semiconductor wafers. SOLUTION: An exhaust pipe 31, a drag pump 4, an exhaust pipe 32, a trap 71 and a dry pump 72 are connected to a processing chamber 2. Tape heaters 66 are wound around the circumference of the exhaust pipes 31, 32. The drag pump 4 is provided with a resistance heating element on the inside surface of a rectifying plate opposed to the side of a rotor and a resistance heating element on the top of a mesh plate opposed to the top of the rotor. During processing, the inside surfaces of the exhaust pipes 31, 32 and the outside surface of the rotor are heated by means of the tape heaters 66 and the resistance heating elements, and their temperature is thereby increased to a value higher than the deposition temperature of reaction products. As a result, the reaction products are passed in the form of gas through the exhaust pipes 31, 32 and the drag pump 4, and captured and collected in the trap 71.

4. 发明专利

JPH0927398A PLASMA TREATMENT DEVICE 失效
公开(公告)号：JPH0927398A
公开(公告)日：1997-01-28
申请号：JP19698595
申请日：1995-07-10
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： KOBAYASHI KENJI
IPC分类号： H05H1/46 , C23F4/00 , H01L21/302 , H01L21/3065
摘要： PROBLEM TO BE SOLVED: To improve the evenness of temperature of an upper electrode in a plasma treatment device. SOLUTION: An annular shim 43 having a high heat transfer coefficient is interposed between the upper surface of an upper electrode 41 and the lower surface of a cooling plate 32 arranged on the upper part of the upper electrode 41 to cool the upper electrode 41, and the position of this shim 43 is set between the peripheral part and center part of the upper electrode 41. Even when the upper electrode 41 is heated by a plasma, it is regularly cooled by the shim 43 without the center part being deflected down, and the in-plane temperature difference in the upper electrode 41 is consequently minimized.

5. 发明专利

JPH08264601A PROBE DEVICE AND METHOD FOR REPLACING PROBE CARD 失效
公开(公告)号：JPH08264601A
公开(公告)日：1996-10-11
申请号：JP8747695
申请日：1995-03-20
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： UCHIDA MINORU
IPC分类号： G01R31/26 , G01R1/073 , H01L21/66
摘要： PURPOSE: To safely replace a probe card by reducing in size a probe device in order to inspect the semiconductor chip of a semiconductor wafer by the card. CONSTITUTION: The conveying means of a probe card is so composed as to receive and deliver the card from and to an insert ring 21 provided in a housing 2 to and from a tray 3, to horizontally rotate the tray 3 around a rotary shaft after the tray 3 is moved down and to deliver it out of the housing 2. The tray 3 is once stopped and a buzzer is rung before at least one of the tray 3 and a probe card 4 is delivered out, and the tray 3 is then delivered under the condition that the operator makes its confirmation thereafter.

6. 发明专利

JPH08213438A INSPECTING METHOD AND INSPECTING APPARATUS 失效
公开(公告)号：JPH08213438A
公开(公告)日：1996-08-20
申请号：JP4123795
申请日：1995-02-06
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： HAGIWARA JUNICHI
IPC分类号： G01R31/26 , H01L21/66
摘要： PURPOSE: To delete variations in a temperature each object to be inspected and enhance measurement precision and improve reliability in detection results by a method wherein a voltage value of a specific electric circuit is detected to compute a temperature of the object to be inspected and a temperature of the object to be inspected is temperature-controlled to be a set temperature to detect an electric characteristic. CONSTITUTION: An object 10 to be inspected having a specific electric circuit 34 is heated or cooled to detect a voltage value of the specific electric circuit 34, and as compared with the detected voltage value and the previously stored set value, a temperature of the object 10 to be inspected is computed. A temperature of the object 10 to be inspected is temperature-controlled to be a set temperature to detect an electric characteristic of the object 10 to be inspected. For example, a device 10 comprising a specific circuit 34 containing a diode is placed in a thermostat 37, and a voltage value when a specific current flows in the specific circuit 34 of the device 10 is detected to compute a temperature of the device 10. The thermostat 37 is heated by a heater 35 and a temperature of the device 10 is controlled to be a specific temperature to detect an electric characteristic.

7. 发明专利

JPH08172034A VACUUM PROCESS DEVICE 失效
公开(公告)号：JPH08172034A
公开(公告)日：1996-07-02
申请号：JP32622193
申请日：1993-11-30
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： ISHII TOMOYUKI , KOMIYAMA TADASHI , TAKAZOE KATSUHIKO
IPC分类号： C23F4/00 , H01L21/02 , H01L21/302 , H01L21/3065 , H01L21/677 , H01L21/68
摘要： PURPOSE: To provide a vacuum process device wherein a free degree in layout of a vacuum process chamber and container placing chamber is improved and maintenance efficiency of the device is improved. CONSTITUTION: A transportation chamber 2 of air-tight structure with depressurized atmosphere, preliminary vacuum chambers 3a and 3b connected, in air-tight manner, to the transportation chamber 2 through a transportation outlet/inlet, multiple vacuum process chambers 4A-4C connected, in air-tight manner, to the transportation chamber 2 through the transportation outlet/inlet, and a transportation means 5 which, provided in the transportation chamber 2 and provided with at least three transportation arms independently rotated in the horizontal direction, transports a to-be-processed body W between the preliminary vacuum chambers 3A and 3B and vacuum process chamber 4A-4C are provided. The vacuum process device is arranged in a clean roam, and a control board, etc., which controls the vacuum process device, provided on the body surface side where the vacuum device is arranged and clean level is highest, are provided.

8. 发明专利

JPH08162509A PROBE DEVICE AND PROBING METHOD 失效
公开(公告)号：JPH08162509A
公开(公告)日：1996-06-21
申请号：JP32994894
申请日：1994-12-05
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： FUJIWARA HITOSHI
IPC分类号： G01B11/00 , G01B11/26 , G01R1/073 , G01R31/26 , H01L21/66 , H01L21/68
摘要： PURPOSE: To enable highly-accurate measurement without causing contact trouble even if the probe face inclines by finding the quantity of slippage of the position of an electrode after paralleling the face of a board face with the probe face, and shifting the stage by the quantity of slippage so as to position them. CONSTITUTION: The first image pickup means 18 seeks the inclination of the probe face 19 made of the tips of plural probes 4, and the second image pickup means 22 seeks the inclination of the board face, and the board face is set in parallel with the probe face 19, and the probe face 19 is brought into contact with the probe face 19 so as to inspect the electric property of the board 1. In such a probe device, an adjusting means, which sets the board face to the probe face 19, is provided. Furthermore, the second image pickup means 22 picks up the image of the electrode position of the board 1 and picks up the images of the electrode before paralleling the board face and the image of the electrode position after paralleling so as to find the quantity of slippage, and further this is provided with a positioning means which shifts the stage 15 by the quantity of slippage so as to align them.

9. 发明专利

JPH08162292A PLASMA TREATMENT APPARATUS AND CONTROL METHOD THEREOF 失效
公开(公告)号：JPH08162292A
公开(公告)日：1996-06-21
申请号：JP33023994
申请日：1994-12-05
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： TSUCHIYA HIROSHI , FUKAZAWA YOSHIO , MOCHIZUKI SHUJI
IPC分类号： H05H1/46 , C23F4/00 , H01L21/302 , H01L21/3065
摘要： PURPOSE: To provide a plasma treatment apparatus which can keep sufficient selection ratio and etching ratio even in low pressure atmosphere. CONSTITUTION: A plasma etching treatment apparatus 1 is provided with a lower part electrode 4 on which an object for treatment and which is installed in a treatment chamber 2 and an upper part electrode 21 set at a position on the opposite to the lower part electrode 4 and the respective electrodes are so composed as to apply high frequency electric power to the respective electrodes while the phase and the ratio of the electric power being controlled independently for respective electrodes. Based on the demanded etching rate and/or selection ratio, the phase difference and the ratio of the electric power to be applied between both electrodes are controlled, so that preferable selection ratio and etching ratio can be obtained even in as low pressure atmosphere as 100mTorr or lower.

10. 发明专利

JPH08139142A PROBE UNIT 失效
公开(公告)号：JPH08139142A
公开(公告)日：1996-05-31
申请号：JP30026094
申请日：1994-11-09
申请人： TOKYO ELECTRON LTD , TEL YAMANISHI KK
发明人： SANO KUNIO
IPC分类号： G01R1/073 , G01R1/067 , H01L21/66
摘要： PURPOSE: To obtain a probe unit in which characteristic test can be carried out accurately by surrounding each signal POGO pin with ground POGO pins such that the impedance is substantially equalized. CONSTITUTION: A POGO pin ring 36 having a plurality of signal POGO pins 14A and a plurality of ground POGO pins 14B is provided in order to connect a test head and a probe card electrically and an object W to be inspected is shifted in X, Y, Z directions to be touched with the probe needle of the probe card for the purpose of electric test. In such probe unit, each signal POGO pin is surrounded by groung POGO pins. Since the impedance is substantially equalized for each signal POGO pin, characteristic test can be carried out accurately.

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