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1. 发明专利

JP2009120864A Plating jig 审中-公开
标题翻译：镀锌金
公开(公告)号：JP2009120864A
公开(公告)日：2009-06-04
申请号：JP2007292777
申请日：2007-11-12
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI
IPC分类号： C23C18/31 , H01L21/288
CPC分类号： C23C18/163 , C23C18/02
摘要： PROBLEM TO BE SOLVED: To provide a plating jig capable of performing uniform processing of plating without any irregular plating on each object to be plated when a plurality of objects to be plated are plated at a time.
SOLUTION: The plating jig 2 is rotated about the horizontal axis while being immersed in plating solution. The plating jig includes a plurality of holding bars 21 parallel to the axis of rotation CL and disposed on the circumference around the axis of rotation CL, and a pair of end plates 22 which fix both ends of the plurality of holding bars 21. A plurality of grooves are formed in the holding bars 21 at a regular spacing along the axis of rotation CL.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在待镀覆的多个被电镀物体一次镀覆的同时对每个被电镀物体进行电镀均匀处理而不进行电镀的电镀夹具。解决方案：电镀夹具2在浸入电镀溶液中的同时围绕水平轴旋转。电镀夹具包括多个平行于旋转轴线CL的保持杆21，并且设置在围绕旋转轴线CL的圆周上，以及固定多个保持杆21的两端的一对端板22.多个的槽沿着旋转轴线CL以规则的间隔形成在保持杆21中。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008223138A Plating method and tool for plating 审中-公开
标题翻译：涂层方法和工具
公开(公告)号：JP2008223138A
公开(公告)日：2008-09-25
申请号：JP2008033959
申请日：2008-02-15
申请人： Ryoichi Aogaki , Saitama Prefecture , Yamamoto Mekki Shikenki:Kk , 埼玉県 , 株式会社山本鍍金試験器 , 良一青柿
发明人： MORIMOTO RYOICHI , YAZAWA SADAHARU , AOGAKI RYOICHI , AISAKA TETSUYA , SUGIYAMA ATSUSHI , YAMAMOTO WATARU , AKIYAMA KATSUNORI
IPC分类号： C25D5/00 , C25D7/00 , C25D17/08 , H05K3/00 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a method for plating even a large object, such as a printed circuit board, in the state of applying a magnetic field by using the conventional plating equipment, and to provide a tool for plating adequately used in the method.
SOLUTION: An object to be plated 2 is placed in a magnetic circuit formed by the tool immersed into a plating liquid. For example, a magnetic circuit is formed by a pair of opposing yokes 3 and a magnet 1 connected thereto, and the tool for plating having a gap in which the object to be plated can be arranged is used.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于通过使用传统的电镀设备在施加磁场的状态下对诸如印刷电路板的大型物体进行电镀的方法，并且提供用于充分使用的电镀工具在该方法中。
解决方案：将待镀物体2放置在由浸入电镀液中的工具形成的磁路中。例如，磁路由一对相对的磁轭3和与其连接的磁体1形成，并且使用具有间隙的电镀工具可以配置被镀物体。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2003301299A Cathode cartridge of electroplating tester 有权
标题翻译：电镀测试仪的阴极盒
公开(公告)号：JP2003301299A
公开(公告)日：2003-10-24
申请号：JP2002110402
申请日：2002-04-12
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU
IPC分类号： C25D7/12 , C25D17/06 , C25D17/08 , C25D17/10 , C25D17/12 , C25D21/12
CPC分类号： C25D17/001 , C25D17/06 , C25D17/12
摘要： PROBLEM TO BE SOLVED: To provide a cathode cartridge of an electroplating tester which can screen a cathode part other than the surface of an object to be plated from a plating liquid.
SOLUTION: This cathode cartridge N comprises a cathode conductor 10 for conducting electricity to the surface Wa to be plated of a silicon wafer W which is an object to be plated, a first insulator 20 for covering the front side (the surface Wa to be plated) of the silicon wafer W and for holding the cathode conductor 10, and a second insulator 30 for covering the rear side (the reverse side of the surface Wa to be plated) of the silicon wafer W and for holding the silicon wafer W. The cathode part other than the surface Wa to be treated of the silicon wafer W is screened from the plating liquid by a first O-ring 22 fitted to the first insulator 20 and a second O-ring 32 fitted to the second insulator 30.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种电镀测试器的阴极筒，其可以从电镀液体屏蔽除被镀物体的表面之外的阴极部分。解决方案：该阴极盒N包括阴极导体10，用于将导电电流施加到要被电镀的对象的硅晶片W的待镀表面Wa;第一绝缘体20，用于覆盖前侧（表面Wa 被镀覆在硅晶片W上并用于保持阴极导体10的第二绝缘体30和用于覆盖硅晶片W的后侧（待镀覆表面Wa的背面）并用于保持硅晶片的第二绝缘体30 W.通过安装在第一绝缘体20上的第一O形环22和安装在第二绝缘体30上的第二O形环32，从电镀液体中除去待处理硅晶片W的表面Wa之外的阴极部分版权所有（C）2004，JPO

4. 发明专利

JP2015038232A めっき装置及びこれを用いたセンサ装置有权
标题翻译：使用它的镀层装置和传感器装置
公开(公告)号：JP2015038232A
公开(公告)日：2015-02-26
申请号：JP2013169504
申请日：2013-08-19
申请人：株式会社山本鍍金試験器 , Yamamoto Mekki Shikenki:Kk , 学校法人早稲田大学 , Waseda Univ
发明人： YAMAMOTO WATARU , KOIWA KIMIKO , HONMA NORIYUKI , YANAGISAWA MASAHIRO , SAITO MIKIKO , YAMAMOTO TOMOYUKI
IPC分类号： C25D17/08 , C23C18/31 , C25D21/12
CPC分类号： C23C18/1619 , C23C18/163 , C23C18/1683 , C25D17/001 , C25D17/002 , C25D17/004 , C25D17/008 , C25D17/06 , C25D17/10 , C25D17/12 , C25D21/12
摘要：【課題】従来よりも簡素で小型化が容易なめっき装置を提供する。【解決手段】めっき装置1は、被めっき物Wを保持する保持部材2と、被めっき物Wを囲う環状の第1シール部材3を介して保持部材2に積層され、被めっき物Wを露出させるとともにめっき液を貯留する貫通部45を有するスペーサ4と、貫通部45を囲う環状の第2シール部材5を介してスペーサ4に積層され、貫通部45から露出する被めっき物Wに対向して配置される陽極層62を有する陽極部材6と、を備える。【選択図】図2
摘要翻译：要解决的问题：提供比常规电镀装置简单的电镀装置，并且容易小型化。电镀装置1包括：用于保持被镀物体W的保持构件2; 间隔件4，其通过围绕待镀物体W的环状的第一密封构件3层叠在保持构件2上，并具有用于使待镀物体W露出并保存电镀液的穿透部45; 以及阳极部件6，其通过围绕穿透部分45的环形第二密封部件5层压在间隔件4上，并且具有设置成面向待穿过物体W的阳极层62，阳极层62将从穿透部分45暴露出来。

5. 发明专利

JP2007291446A Barrel plating apparatus 审中-公开
标题翻译： BARREL电镀设备
公开(公告)号：JP2007291446A
公开(公告)日：2007-11-08
申请号：JP2006120392
申请日：2006-04-25
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , KATSUMOTO TOKIKO , HOSHINO YOSHIAKI
IPC分类号： C25D17/20
CPC分类号： C25D17/20
摘要： PROBLEM TO BE SOLVED: To provide a barrel plating apparatus capable of preventing the occurrence of the burning of a plated film formed on the surface of a material to be plated by preventing the occurrence of a gap between the material-to-be-plated housed in a drum and a rod-like conductive member which causes the formation of a high current density part. SOLUTION: The barrel plating apparatus is provided with the cylindrical drum 2 dipped in a plating solution in a horizontal state and housing the material to be plated, a supporting member 6 for supporting the drum 2 rotatable, a driving mechanism 5 for rotatively driving the drum 2 and a center bar 3 arranged coaxially with the drum 2 and connected to an axial rod 26B integrally rotating with the drum 2. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种滚镀装置，其能够防止在被镀材料的表面上形成的镀膜的燃烧的发生，从而防止在要被镀的材料之间产生间隙电镀容纳在鼓中和导致形成高电流密度部分的棒状导电构件。解决方案：滚镀装置设置有以水平状态浸在电镀液中的圆筒形滚筒2，并容纳待镀材料，用于支撑滚筒2可旋转的支撑部件6，用于旋转的驱动机构5 驱动滚筒2和与滚筒2同轴设置并连接到与滚筒2一体旋转的轴向杆26B的中心杆3.版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006233296A Fixture for electroplating 审中-公开
标题翻译：电镀设备
公开(公告)号：JP2006233296A
公开(公告)日：2006-09-07
申请号：JP2005051215
申请日：2005-02-25
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , HARADA FUMIO
IPC分类号： C25D17/06 , C25D17/08
CPC分类号： C25D17/001 , C25D17/06 , H05K2203/1147
摘要： PROBLEM TO BE SOLVED: To provide a fixture for electroplating with which, in the object to be plated, plating of parts other than a face to be plated can be securely prevented, and whose performance, reliability or the like can be improved.
SOLUTION: The air in a space part S surrounded by first and second insulation plates 10, 20, an inside seal 40, and an outside seal 50 is sucked by a pump P through an air suction passage 60. In this way, the space part S is held to a negative pressure state, the whole of the inside seal 40 is made to abut against a wafer W with uniform pressing force (facial pressure), and further, the whole of the outside seal 50 is made to abut against the second insulator 20 with uniform pressing force (plane pressure).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于电镀的固定装置，在待镀物体中，可以可靠地防止除了被镀面以外的部分的电镀，并且可以改善其性能，可靠性等。解决方案：由第一和第二绝缘板10,20包围的空间部分S中的空气，内密封件40和外部密封件50通过空气吸入通道60被泵P吸入。这样，空间部分S被保持在负压状态，整个内部密封件40以均匀的压力（面部压力）抵靠晶片W，此外，使整个外部密封件50抵靠以均匀的压力（平面压力）抵靠第二绝缘体20。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005008927A Barrel, barrel plating device, and liquid exhaust tool 有权
标题翻译： BARREL，BARREL镀膜装置和液体排气工具
公开(公告)号：JP2005008927A
公开(公告)日：2005-01-13
申请号：JP2003172982
申请日：2003-06-18
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU
IPC分类号： C25D17/20 , C25D17/16 , C25D17/24
CPC分类号： C25D17/16 , C25D17/24
摘要： PROBLEM TO BE SOLVED: To provide a barrel in which the size of a port through which a plating liquid goes in and out can be reduced to a micron order.
SOLUTION: The barrel 10 is obtained by sintering and molding a thermoplastic raw material. Since the barrel 10 composed in this way is the one obtained by subjecting the thermoplastic raw material to sintering and molding, the size of a port through which a plating liquid L goes in and out can be reduced to a micron order. Thus, even in the case the object T to be plated is a very small one of a micron order, the object T to be plated does not escape from the port through which the plating liquid goes in and out in the barrel 10 to the outside of the barrel 10.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种桶，其中电镀液进出的端口的尺寸可以减小到微米级。解决方案：通过烧结和模制热塑性原料获得筒体10。由于以这种方式构成的筒体10是通过对热塑性原料进行烧结和模塑而获得的桶10，所以可以将电镀液L进出口的尺寸减小至微米级。因此，即使在要镀覆的对象T为非常小的微米级的情况下，被镀物体T也不会从电镀液在管10内进出的口从外部逸出（C）2005，JPO＆NCIPI

8. 发明专利

JP2013119648A Tool for holding workpiece 有权
标题翻译：工具工具
公开(公告)号：JP2013119648A
公开(公告)日：2013-06-17
申请号：JP2011268007
申请日：2011-12-07
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU
IPC分类号： C25D17/08 , F16J15/10
摘要： PROBLEM TO BE SOLVED: To provide a tool for holding a workpiece which improves contactability of an electrode member to a workpiece while improving sealability of a sealing member.SOLUTION: The tool 100 for holding a workpiece includes: a body member 10 including an opening 12a; a lid member 20 which sandwiches a semiconductor wafer W with the body member 10; an electrode member 40 which conducts electricity to the semiconductor wafer W; and an inner sealing member 30 which is provided on the peripheral border of the opening 12a and seals between the body member 10 and the semiconductor wafer W. The inner sealing member 30 includes: a base portion 31 which is provided between the body member 10 and the electrode member 40 and is in contact with the electrode member 40; and a sealing portion 32 which is formed protruding from the inner peripheral border 31b of the base portion 31 to the semiconductor wafer W side and presses against the semiconductor wafer W. The tip of the sealing portion 32 is flush with the electrode member 40 or is positioned closer to the semiconductor wafer W side than the electrode member 40 in a non-pressing state, and the electrode member 40 is in contact with the semiconductor wafer W in a pressing state of the sealing portion 32.
摘要翻译：要解决的问题：提供一种用于保持工件的工具，其提高电极部件与工件的接触性，同时提高密封部件的密封性。解决方案：用于保持工件的工具100包括：主体构件10，其包括开口12a; 将半导体晶片W与本体构件10夹持的盖构件20; 对半导体晶片W进行电力的电极部件40; 以及内部密封构件30，其设置在开口12a的周边边界上并且密封在本体构件10和半导体晶片W之间。内部密封构件30包括：基部31，其设置在主体构件10和电极部件40与电极部件40接触; 以及密封部32，其从基部31的内周边缘31b突出到半导体晶片W侧，并且压靠半导体晶片W.密封部32的前端与电极部件40齐平，或者是在非压制状态下比电极构件40更靠近半导体晶片W侧，并且电极构件40在密封部32的按压状态下与半导体晶片W接触。版权所有（C））2013，JPO＆INPIT

9. 发明专利

JP2008156677A Plating tool and plating apparatus 审中-公开
标题翻译：工具和电镀设备
公开(公告)号：JP2008156677A
公开(公告)日：2008-07-10
申请号：JP2006344306
申请日：2006-12-21
申请人： Ryoichi Aogaki , Saitama Prefecture , Yamamoto Mekki Shikenki:Kk , 埼玉県 , 株式会社山本鍍金試験器 , 良一青柿
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , MORIMOTO RYOICHI , YAZAWA SADAJI , AOGAKI RYOICHI , AISAKA TETSUYA , SUGIYAMA ATSUSHI
IPC分类号： C25D17/06 , C25D5/00 , C25D7/00 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a plating tool which prevents the contact of a plating solution with a magnet and allows the magnet to be arranged in the vicinity of a material to be plated. SOLUTION: The plating tool 2A is provided with a first insulating plate 10 having an opening part 10G, a second insulating plate 20 for holding the material P to be plated between the first insulating plate 10 so that the material P faces the outside from the opening part 10G, an inside seal 30 positioned in the periphery of the opening part 10G and mounted to be interposed between the first insulating plate 10 and the second insulating plate 20, an outside seal 40 positioned outside of the material P and mounted to be interposed between the first insulating plate 10 and the second insulating plate 20, a conductive body 50 electrically connected to the material P in a space sealed by the inside seal 30 and the outside seal 40 and a magnetic field forming body 60 arranged in the space sealed by the inside seal 30 and the outside seal 40 and having a N-pole and a S-pole which are opposed to each other across the material P. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电镀工具，其防止电镀溶液与磁体接触并允许磁体布置在待镀材料附近。电镀工具2A设置有具有开口部分10G的第一绝缘板10，用于将待镀材料P保持在第一绝缘板10之间以使材料P面向外部的第二绝缘板20 从开口部10G开始，位于开口部10G周围的内部密封件30，安装在第一绝缘板10和第二绝缘板20之间，位于材料P外侧的外部密封件40，插入在第一绝缘板10和第二绝缘板20之间，导电体50在由内密封件30和外部密封件40密封的空间中电连接到材料P，以及设置在该空间中的磁场形成体60 由内侧密封件30和外部密封件40密封，并且具有在材料P上彼此相对的N极和S极。（C）2008，JPO＆INPIT

10. 发明专利

JP2006052471A Electroplating tester 有权
标题翻译：电镀测试仪
公开(公告)号：JP2006052471A
公开(公告)日：2006-02-23
申请号：JP2005256847
申请日：2005-09-05
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU
IPC分类号： C25D21/10 , C25D7/12 , C25D17/08 , C25D17/10 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an electroplating tester which can form a uniform plating film.
SOLUTION: This electroplating tester 1 is equipped with a plating liquid tank 11 into which a plating liquid is poured, an anode 8 placed inside the plating liquid tank 11, a cathode 1 which serves as a plating target and is placed parallel to the anode 8 in the plating liquid tank 11, and a direct current power supply which applies voltage to the anode 8 and the cathode 1. The electroplating tester 1 has a plating liquid outlet 13 formed on the bottom of the plating liquid tank 11, plating liquid squirt holes which are formed on the bottom of the plating liquid tank 11 to stir the vicinity of the surface of the plating target, and a plating liquid circulation pump connected in a manner such that the plating liquid is taken in from the outlet 13 and squirted from the squirt holes.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可形成均匀镀膜的电镀试验机。该电镀试验机1配备有电镀液槽11，电镀液被注入其中，放置在电镀液槽11内的阳极8，作为电镀靶的阴极1平行放置电镀液槽11中的阳极8和向阳极8和阴极1施加电压的直流电源。电镀试验机1具有形成在电镀液槽11的底部的电镀液出口13，电镀液形成在电镀液槽11的底部上以搅拌电镀对象表面附近的液体喷孔;以及电镀液循环泵，其以从出口13吸入电镀液体的方式连接，从喷孔喷出来。版权所有（C）2006，JPO＆NCIPI

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