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1. 发明专利

JP2008223138A Plating method and tool for plating 审中-公开
标题翻译：涂层方法和工具
公开(公告)号：JP2008223138A
公开(公告)日：2008-09-25
申请号：JP2008033959
申请日：2008-02-15
申请人： Ryoichi Aogaki , Saitama Prefecture , Yamamoto Mekki Shikenki:Kk , 埼玉県 , 株式会社山本鍍金試験器 , 良一青柿
发明人： MORIMOTO RYOICHI , YAZAWA SADAHARU , AOGAKI RYOICHI , AISAKA TETSUYA , SUGIYAMA ATSUSHI , YAMAMOTO WATARU , AKIYAMA KATSUNORI
IPC分类号： C25D5/00 , C25D7/00 , C25D17/08 , H05K3/00 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a method for plating even a large object, such as a printed circuit board, in the state of applying a magnetic field by using the conventional plating equipment, and to provide a tool for plating adequately used in the method.
SOLUTION: An object to be plated 2 is placed in a magnetic circuit formed by the tool immersed into a plating liquid. For example, a magnetic circuit is formed by a pair of opposing yokes 3 and a magnet 1 connected thereto, and the tool for plating having a gap in which the object to be plated can be arranged is used.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于通过使用传统的电镀设备在施加磁场的状态下对诸如印刷电路板的大型物体进行电镀的方法，并且提供用于充分使用的电镀工具在该方法中。
解决方案：将待镀物体2放置在由浸入电镀液中的工具形成的磁路中。例如，磁路由一对相对的磁轭3和与其连接的磁体1形成，并且使用具有间隙的电镀工具可以配置被镀物体。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008156677A Plating tool and plating apparatus 审中-公开
标题翻译：工具和电镀设备
公开(公告)号：JP2008156677A
公开(公告)日：2008-07-10
申请号：JP2006344306
申请日：2006-12-21
申请人： Ryoichi Aogaki , Saitama Prefecture , Yamamoto Mekki Shikenki:Kk , 埼玉県 , 株式会社山本鍍金試験器 , 良一青柿
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , MORIMOTO RYOICHI , YAZAWA SADAJI , AOGAKI RYOICHI , AISAKA TETSUYA , SUGIYAMA ATSUSHI
IPC分类号： C25D17/06 , C25D5/00 , C25D7/00 , C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a plating tool which prevents the contact of a plating solution with a magnet and allows the magnet to be arranged in the vicinity of a material to be plated. SOLUTION: The plating tool 2A is provided with a first insulating plate 10 having an opening part 10G, a second insulating plate 20 for holding the material P to be plated between the first insulating plate 10 so that the material P faces the outside from the opening part 10G, an inside seal 30 positioned in the periphery of the opening part 10G and mounted to be interposed between the first insulating plate 10 and the second insulating plate 20, an outside seal 40 positioned outside of the material P and mounted to be interposed between the first insulating plate 10 and the second insulating plate 20, a conductive body 50 electrically connected to the material P in a space sealed by the inside seal 30 and the outside seal 40 and a magnetic field forming body 60 arranged in the space sealed by the inside seal 30 and the outside seal 40 and having a N-pole and a S-pole which are opposed to each other across the material P. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电镀工具，其防止电镀溶液与磁体接触并允许磁体布置在待镀材料附近。电镀工具2A设置有具有开口部分10G的第一绝缘板10，用于将待镀材料P保持在第一绝缘板10之间以使材料P面向外部的第二绝缘板20 从开口部10G开始，位于开口部10G周围的内部密封件30，安装在第一绝缘板10和第二绝缘板20之间，位于材料P外侧的外部密封件40，插入在第一绝缘板10和第二绝缘板20之间，导电体50在由内密封件30和外部密封件40密封的空间中电连接到材料P，以及设置在该空间中的磁场形成体60 由内侧密封件30和外部密封件40密封，并且具有在材料P上彼此相对的N极和S极。（C）2008，JPO＆INPIT

3. 发明专利

JP2009120864A Plating jig 审中-公开
标题翻译：镀锌金
公开(公告)号：JP2009120864A
公开(公告)日：2009-06-04
申请号：JP2007292777
申请日：2007-11-12
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI
IPC分类号： C23C18/31 , H01L21/288
CPC分类号： C23C18/163 , C23C18/02
摘要： PROBLEM TO BE SOLVED: To provide a plating jig capable of performing uniform processing of plating without any irregular plating on each object to be plated when a plurality of objects to be plated are plated at a time.
SOLUTION: The plating jig 2 is rotated about the horizontal axis while being immersed in plating solution. The plating jig includes a plurality of holding bars 21 parallel to the axis of rotation CL and disposed on the circumference around the axis of rotation CL, and a pair of end plates 22 which fix both ends of the plurality of holding bars 21. A plurality of grooves are formed in the holding bars 21 at a regular spacing along the axis of rotation CL.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在待镀覆的多个被电镀物体一次镀覆的同时对每个被电镀物体进行电镀均匀处理而不进行电镀的电镀夹具。解决方案：电镀夹具2在浸入电镀溶液中的同时围绕水平轴旋转。电镀夹具包括多个平行于旋转轴线CL的保持杆21，并且设置在围绕旋转轴线CL的圆周上，以及固定多个保持杆21的两端的一对端板22.多个的槽沿着旋转轴线CL以规则的间隔形成在保持杆21中。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2006233296A Fixture for electroplating 审中-公开
标题翻译：电镀设备
公开(公告)号：JP2006233296A
公开(公告)日：2006-09-07
申请号：JP2005051215
申请日：2005-02-25
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , HARADA FUMIO
IPC分类号： C25D17/06 , C25D17/08
CPC分类号： C25D17/001 , C25D17/06 , H05K2203/1147
摘要： PROBLEM TO BE SOLVED: To provide a fixture for electroplating with which, in the object to be plated, plating of parts other than a face to be plated can be securely prevented, and whose performance, reliability or the like can be improved.
SOLUTION: The air in a space part S surrounded by first and second insulation plates 10, 20, an inside seal 40, and an outside seal 50 is sucked by a pump P through an air suction passage 60. In this way, the space part S is held to a negative pressure state, the whole of the inside seal 40 is made to abut against a wafer W with uniform pressing force (facial pressure), and further, the whole of the outside seal 50 is made to abut against the second insulator 20 with uniform pressing force (plane pressure).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于电镀的固定装置，在待镀物体中，可以可靠地防止除了被镀面以外的部分的电镀，并且可以改善其性能，可靠性等。解决方案：由第一和第二绝缘板10,20包围的空间部分S中的空气，内密封件40和外部密封件50通过空气吸入通道60被泵P吸入。这样，空间部分S被保持在负压状态，整个内部密封件40以均匀的压力（面部压力）抵靠晶片W，此外，使整个外部密封件50抵靠以均匀的压力（平面压力）抵靠第二绝缘体20。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2013185241A Plating apparatus and method for producing plated object 有权
标题翻译：制造设备的制造装置和方法
公开(公告)号：JP2013185241A
公开(公告)日：2013-09-19
申请号：JP2012053761
申请日：2012-03-09
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器 , Fujimi Inc , 株式会社フジミインコーポレーテッド
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , KOIWA HITOKO , ITO JUN
IPC分类号： C25D15/02
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus and a method for producing a plated object, wherein an amount of a granular material adhered is suitably ensured, also variation in distribution of the granular material adhered to an object to be plated becomes small, and further the amount of the granular material adhered to the object to be plated is easily controlled.SOLUTION: A production apparatus 100 of a wire saw 1 allows abrasive grains 4 to adhere to the outer peripheral surface of the wire 2 by performing electroplating. The production apparatus 100 includes an interior plating bath 32 containing a plating liquid 32b and a precipitation layer 32c obtained when the abrasive grains 4 precipitate in the plating liquid 32b. While the wire 2 is penetrated into the precipitation layer 32c from the bottom 32a or a side part 32f of the interior plating bath 32, the abrasive grains 4 adhere to the wire 2 in a part X which intersects with the surface 32c1 of the precipitation layer 32c by moving the wire 2 in the direction intersecting with the surface 32c1 of the precipitation layer 32c.
摘要翻译：要解决的问题：为了提供电镀装置和电镀对象的制造方法，其中适当地确保了附着的颗粒材料的量，附着在被镀物体上的颗粒状物质的分布变小，另外，容易控制附着于被镀物体的粒状材料的量。线锯1的制造装置100通过进行电镀使磨粒4附着在线2的外周面上。制造装置100具有包含电镀液32b的内部镀浴32和当磨粒4在电镀液32b中析出时得到的沉淀层32c。当线材2从内部镀浴32的底部32a或侧面部分32f穿入沉淀层32c时，磨料颗粒4在与沉淀层的表面32c1相交的部分X中粘附到线材2上 32c，通过在与沉淀层32c的表面32c1相交的方向上移动线材2。

6. 发明专利

JP2009287093A Cathode cartridge for electroplating 有权
标题翻译：电镀用阴极盒
公开(公告)号：JP2009287093A
公开(公告)日：2009-12-10
申请号：JP2008141847
申请日：2008-05-30
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , HARADA FUMIO
IPC分类号： C25D17/08 , C25D7/12 , C25D17/10 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide a cathode cartridge for electroplating, which does not damage a silicon wafer even if electrical insulators exert a large sandwiching force on the silicon wafer.
SOLUTION: The cathode cartridge 1 for electroplating, which is used for sandwiching the silicon wafer W between a pair of the electrical insulators 2 and 3 and immersing the workpiece into a plating solution to form a plated film on a part exposed from an opening 4 of the electrical insulators on the silicon wafer W, is configured by forming a ring-shaped recess 5 on a mating face of the electrical insulator 3 so as to surround the opening 4 of the electrical insulator, accommodating and arranging a ring member 6 in the recess 5 in a state of making a sealing member 7 closely adjacent to the inner and outer circumferences of the ring member 6, and implanting a plurality of pin members 10 on the ring member 6 at an equal space in a circumferential direction. The pin member 10 includes: a housing which is inserted into bores 34 and 35 of the ring member 6; the body of the pin which is stored in the housing so as to be freely movable therein and projects its tip from the housing; and a spring which has been stored in the housing and energizes the body of the pin.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：即使电绝缘体在硅晶片上施加大的夹持力，也可以提供不会损坏硅晶片的电镀阴极筒。解决方案：用于电镀的阴极筒1，其用于将硅晶片W夹在一对电绝缘体2和3之间，并将工件浸入电镀溶液中，以在暴露于通过在电绝缘体3的配合面上形成环状的凹部5，以包围电绝缘体的开口部4，容纳并配置环状部件6，形成硅晶片W上的电绝缘体的开口部4 在形成密封构件7的状态下的凹部5处于与环构件6的内周和外周紧密相邻的状态，并且在周向上以相等的空间将多个销构件10植入环构件6。销构件10包括：插入环构件6的孔34和35中的壳体; 所述销的主体被存储在所述壳体中以便在其中自由移动并将其尖端从所述壳体突出; 以及已经存储在壳体中并且激励销的主体的弹簧。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2006299367A Electroplating tester 审中-公开
标题翻译：电镀测试仪
公开(公告)号：JP2006299367A
公开(公告)日：2006-11-02
申请号：JP2005125538
申请日：2005-04-22
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , KATSUMOTO TOKIKO
IPC分类号： C25D21/12 , C25D17/08 , C25D17/10 , C25D17/12
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001
摘要： PROBLEM TO BE SOLVED: To form a plating film on the whole surface of the face to be plated in such a manner that its film thickness is made uniform, to improve the quality of the plating film, and further to attain the miniaturization and simplification of the device.
SOLUTION: At the inside of a water tank 10, a cathode 30 and an anode 20 are arranged parallelly and horizontally in such a manner that the cathode 30 comes to the lower side and the anode 20 comes to the upper side. Further, a side plate 10B of the water tank 10 is provided with an opening 17 for inserting the anode 20 and the cathode 30 into the water tank 10, and further provided with a closing plate 40 for closing the opening 17. Also, the side plates 10b, and 10C of the water tank are provided with groove parts 18A, 18B for holding the anode 20 to a horizontal state. Further, the cathode 30 is fitted in a cantilevering support state to the closing plate 40.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了使其膜厚均匀的方式在被镀面的整个表面上形成镀膜，以提高镀膜的质量，并且进一步实现小型化并简化设备。解决方案：在水箱10的内部，阴极30和阳极20以使得阴极30进入下侧并且阳极20到达上侧的方式平行和水平地布置。此外，水箱10的侧板10B设置有用于将阳极20和阴极30插入水箱10中的开口17，并且还设置有用于封闭开口17的封闭板40.另外，侧水箱的板10b和10C设置有用于将阳极20保持在水平状态的槽部18A，18B。此外，阴极30以悬臂支撑状态装配到封闭板40上。（C）2007，JPO＆INPIT

8. 发明专利

JP2005221269A Electrode cartridge and plating internal stress measuring system 有权
标题翻译：电极盒和镀层内应力测量系统
公开(公告)号：JP2005221269A
公开(公告)日：2005-08-18
申请号：JP2004027300
申请日：2004-02-03
申请人： Yamamoto Mekki Shikenki:Kk , 株式会社山本鍍金試験器
发明人： YAMAMOTO WATARU , AKIYAMA KATSUNORI , HARADA FUMIO , TSURU YUTAKA
IPC分类号： G01L1/00 , C25D21/12 , G01L1/22
CPC分类号： C25D21/12
摘要： PROBLEM TO BE SOLVED: To provide an electrode cartridge and a plating internal stress measuring system capable of accurately and easily measuring internal stresses of plated films through the use of a strain gauge.
SOLUTION: The electrode cartridge 10 is constituted of: a negative plate supporting part 11 for supporting a negative plate C in a plating solution to which the strain gauge is mounted at the back surface of a part CP to be plated; a positive plate supporting part 12 for supporting a positive plate A in the plating solution opposed to the negative plate C at a prescribed interval from the negative plate C; a shielding plate 13 arranged between the negative plate C and the positive plate A; and a positive plate surrounding part 14 for surrounding the periphery and lower end of the positive plate A in the plating solution. In the shielding plate 13, a through hole 13a of a prescribed shape is formed at a location oppose to the part to be plated of the negative plate. An opening part 14a of a prescribed shape is formed at a location opposed to the part to be plated of the negative plate in the positive plate surrounding part 14.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够通过使用应变仪来精确且容易地测量电镀膜的内应力的电极盒和电镀内应力测量系统。电极盒10由负极板支撑部11构成，负极板支撑部11用于将电镀液中的负极板C支撑在应变计安装在被镀部分CP的背面的电镀液中; 用于从负极板C以规定的间隔将正极板A支撑在与负极板C相对的镀液中的正极板支撑部分12; 布置在负极板C和正极板A之间的屏蔽板13; 以及围绕部分14的正极板，用于围绕电镀液中的正极板A的周边和下端。在屏蔽板13中，在与负极板的被镀部分相对的位置处形成规定形状的通孔13a。规定形状的开口部分14a形成在与围绕部分14的正极板中的负极板的被镀部分相对的位置。（C）2005年，JPO＆NCIPI

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