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1. 发明专利

JP2008010564A Optical semiconductor device, and its manufacturing method 审中-公开
标题翻译：光学半导体器件及其制造方法
公开(公告)号：JP2008010564A
公开(公告)日：2008-01-17
申请号：JP2006178276
申请日：2006-06-28
申请人： Toshiba Corp , 株式会社東芝
发明人： UKITA YASUNARI , KOBARIGAWA TAKASHI , TATEYAMA KAZUKI , KOMATSU IZURU , OBATA SUSUMU
IPC分类号： H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L24/29 , H01L24/83 , H01L2224/29298 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device reducing a thermal resistance at the place of the connection of a light-emitting element, and improving a reliability on a junction between the light-emitting element and a connection by using conductive paste, when the light-emitting element is connected to the connection through conductive paste.
SOLUTION: The optical semiconductor device has a package 2, the connection 4 fitted in the package 2, the light-emitting element 6 connected to the connection 4, and conductive paste 7 interposed between the connection 4 and the light-emitting element 6. A recess 11 having an area smaller than that of the light-emitting element 6 is formed at a place contained in a face opposed to the light-emitting element 6 in the connection 4.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种降低发光元件连接位置处的热阻的光半导体器件，并且通过使用导电的方式提高发光元件与连接之间的连接处的可靠性当发光元件通过导电膏连接到连接时粘贴。解决方案：光学半导体器件具有封装2，安装在封装2中的连接4，连接到连接4的发光元件6和插入在连接4和发光元件之间的导电膏7 在连接4中与发光元件6相对的面上包含的一个位置处形成面积小于发光元件6的面积的凹部11.（C）2008年， JPO＆INPIT

2. 发明专利

JP2014183213A Semiconductor module and method of manufacturing semiconductor module 审中-公开
标题翻译：半导体模块和制造半导体模块的方法
公开(公告)号：JP2014183213A
公开(公告)日：2014-09-29
申请号：JP2013057017
申请日：2013-03-19
申请人： Toshiba Corp , 株式会社東芝
发明人： UKITA YASUNARI , HARA SATORU , TOGASAKI TAKASHI , TAJIMA NAOYUKI
IPC分类号： H01L25/07 , H01L23/36 , H01L23/48 , H01L25/18
CPC分类号： H01L24/33 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/07802 , H01L2924/15787 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module that allows ensuring excellent heat-radiation performance and to provide a method of manufacturing the same.SOLUTION: A semiconductor module comprises: a semiconductor chip including an emitter electrode and a collector electrode; a metallic emitter plate including an emitter junction surface connected to the emitter electrode and an emitter heat-transfer surface crossing to the emitter junction surface; a metallic collector plate including a collector junction surface connected to the collector electrode and a collector heat-transfer surface crossing to the collector junction surface; an insulating layer bonded to the emitter heat-transfer surface and the collector heat-transfer surface via a connection material; and a mold resin portion sealing the semiconductor chip, emitter plate, the collector plate, and the periphery of the insulating layer with the other surface of the insulating layer being disposed. The area of the emitter heat-transfer surface is smaller than that of the collector heat-transfer surface, and the thickness of the connection material between the insulating layer and the emitter plate is thicker than that of the connection material between the collector plate and the insulating layer.
摘要翻译：要解决的问题：提供一种允许确保优异的散热性能并提供其制造方法的半导体模块。解决方案：半导体模块包括：包括发射极和集电极的半导体芯片; 金属发射极板，包括连接到发射极的发射极结表面和与发射极结表面交叉的发射极传热表面; 金属集电板，其包括与集电极连接的集电极连接面和与集电极连接面交叉的集电体传热面; 通过连接材料与发射体传热面和集电体传热面接合的绝缘层; 以及密封半导体芯片，发射极板，集电板以及绝缘层的外周的绝缘层的另一个表面的模制树脂部分。发射极传热面的面积小于集电体传热面的面积，绝缘层和发射极板之间的连接材料的厚度比集电板和发射极板之间的连接材料厚绝缘层。

3. 发明专利

JP2013153004A Television receiver and electronic apparatus 审中-公开
标题翻译：电视接收机和电子设备
公开(公告)号：JP2013153004A
公开(公告)日：2013-08-08
申请号：JP2012012057
申请日：2012-01-24
申请人： Toshiba Corp , 株式会社東芝
发明人： UKITA YASUNARI
IPC分类号： H01L33/62 , H04N5/64
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus enabling downsizing.SOLUTION: According to one embodiment, an electronic apparatus includes: a housing; a circuit board housed in the housing and having a pad; and a light emitting component. The light emitting component includes: a first surface facing the circuit board; a second surface positioned at the opposite side of the first surface; a third surface lying astride the first surface and the second surface; and an electrode having a first portion, on which a light emitting part is placed, and a second portion exposed on the first surface and electrically connected with the pad; and a light transmissive sealing part covering the light emitting part and including a portion which is exposed on the third surface and covers the second portion of the electrode from the exterior side.
摘要翻译：要解决的问题：提供一种能够实现小型化的电子设备。解决方案：根据一个实施例，一种电子设备包括：壳体; 容纳在壳体中并具有垫的电路板; 和发光元件。发光部件包括：面对电路板的第一表面; 位于所述第一表面的相对侧的第二表面; 跨越所述第一表面和所述第二表面的第三表面; 以及电极，其具有放置发光部的第一部分和暴露在所述第一表面上并与所述焊盘电连接的第二部分; 以及透光性密封部，其覆盖所述发光部，并且包括暴露在所述第三表面上并从外侧覆盖所述电极的所述第二部分的部分。

4. 发明专利

JP2006073550A Bonding member and its manufacturing method 审中-公开
标题翻译：结合会员及其制造方法
公开(公告)号：JP2006073550A
公开(公告)日：2006-03-16
申请号：JP2004251270
申请日：2004-08-31
申请人： Toshiba Corp , 株式会社東芝
发明人： KIKUCHI TAKUO , OYA HIROSHI , TATEYAMA KAZUKI , MIYAGI TAKESHI , UKITA YASUNARI
IPC分类号： H01L21/52 , B32B15/01
CPC分类号： H01L24/27 , H01L24/29 , H01L24/73 , H01L24/83 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/83101 , H01L2224/83192 , H01L2224/92247 , H01L2924/01029 , H01L2924/14 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a connection material for satisfying requirements of high temperature conductivity, high adhesiveness and an environment harmony type in the connection material for electric and thermal connection.
SOLUTION: In the connection material, metal particulate which has a surface coated with an organic protection film and whose particle diameter is 1 to 100nm is bonded onto at least one surface of metal foil. In a composite sheet material, a metal material is evaporated by using an evaporation device and it is cooled in organic protection film material steam. Thus, the metal particulate where the organic protection film is formed on the surface is formed, and it is bonded to the surface of metal foil so as to form the material, or dispersion solution containing metal particulate on which the organic protection film is formed in the surface is applied on the surface of metal foil and it is dried so as to obtain the material. The material is suitable as a die mounting material of the semiconductor apparatus.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供用于满足用于电连接和热连接的连接材料中的高温导电性，高粘合性和环境和谐型要求的连接材料。解决方案：在连接材料中，具有涂覆有机保护膜并且其粒径为1至100nm的表面的金属颗粒结合到金属箔的至少一个表面上。在复合片材中，通过使用蒸发装置蒸发金属材料，并在有机保护膜材料蒸汽中冷却。因此，形成表面上形成有机保护膜的金属颗粒，并且其结合到金属箔的表面以形成材料，或者在其上形成有机保护膜的含有金属颗粒的分散溶液将表面施加在金属箔的表面上并干燥以得到材料。该材料适合作为半导体装置的管芯安装材料。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005056932A Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：JP2005056932A
公开(公告)日：2005-03-03
申请号：JP2003206365
申请日：2003-08-06
申请人： Toshiba Corp , 株式会社東芝
发明人： UKITA YASUNARI , SEGAWA MASAO , TATEYAMA KAZUKI
IPC分类号： H01L21/52
CPC分类号： H01L24/83 , H01L24/29 , H01L24/73 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83208 , H01L2224/8384 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： PROBLEM TO BE SOLVED: To provide a bonding method which does not use lead without deteriorating productivity.
SOLUTION: Content of resin component of die mount paste 2 is 1wt%, and stress relaxation property is low. After passing through process of heating curing, cracks 6 occur in a die mount paste curing object. Regardless of existence of cracks 6 to the die mount paste 2, a second curing process is performed wherein heat is applied while pressure is applied to the die mount paste 2 subjected to temporary curing in last process. For example, a lead frame is heated at about 220°C with a heating heater 8, and a semiconductor element 3 is pressurized for 5 minutes by 20MPa on the lead frame 1 side with a tool 7 heated at about 220°C.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供不劣化生产率的不使用铅的接合方法。解决方案：模具安装膏2的树脂成分含量为1重量％，应力松弛性低。在通过加热固化的过程之后，在模具安装膏固化物中发生裂纹6。不管存在于模具安装膏2上的裂缝6，进行第二固化工序，其中在对最终工艺中进行临时固化的模具安装膏2施加压力的同时施加热量。例如，用加热加热器8将引线框架加热到大约220℃，半导体元件3在加热到约220℃的工具7上在引线框架1侧用20MPa加压5分钟。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004096029A Manufacturing method of power semiconductor device 有权
公开(公告)号：JP2004096029A
公开(公告)日：2004-03-25
申请号：JP2002258490
申请日：2002-09-04
申请人： Toshiba Corp , 株式会社東芝
发明人： UKITA YASUNARI , TATEYAMA KAZUKI , WATANABE NAOTAKE , MORI IKUO
IPC分类号： H01L21/52 , H01L23/48
CPC分类号： H01L24/32 , H01L24/83 , H01L2224/26175 , H01L2224/27013 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2924/01322 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a power semiconductor device highly reliable in operation by using low melting point Pb-free solder.
SOLUTION: Prescribed positions of a power semiconductor device element 3 connected to a lead frame 1 and the Pb free solder 2 are sealed with a sealing material 4, 4a and 4b, and wire bonding and packaging are carried out.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2015018833A 半導体モジュール审中-公开
标题翻译：半导体模块
公开(公告)号：JP2015018833A
公开(公告)日：2015-01-29
申请号：JP2013142939
申请日：2013-07-08
申请人：株式会社東芝 , Toshiba Corp
发明人： TOGASAKI TAKASHI , TAJIMA NAOYUKI , UKITA YASUNARI , NAITO MAYUMI
IPC分类号： H01L23/36 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/48091 , H01L2224/48111 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014
摘要：【課題】高い放熱性能と高い絶縁耐圧を実現する半導体モジュールを提供する。【解決手段】実施形態に係る半導体モジュールは、主面に放熱版を露出させた半導体パッケージと、前記半導体パッケージの主面に接着層を介して配された絶縁版と、前記絶縁版に接着層を介して配された冷却器と、隣接する前記絶縁版を連結する支持体とを備え、前記絶縁板の最大寸法Lと、前記絶縁板の熱膨張係数α1と、前記冷却器の熱膨張係数α2と、前記絶縁板と前記冷却器の間の前記接着層の厚さtとの関係が、(α2−α1)?L/t
摘要翻译：要解决的问题：提供一种实现高放射性能和高介电强度电压的半导体模块。解决方案：根据实施例的半导体模块包括：各自具有在主表面上暴露的散热器的半导体封装; 通过粘合层布置在半导体封装的主表面上的绝缘板; 每个绝缘板上经由粘合层布置的冷却器; 以及各绝缘板的最大尺寸L之间的关系，绝缘板的热膨胀系数α1，冷却器的热膨胀系数α2与粘合剂的厚度t之间的关系的支撑介质，绝缘板和冷却器之间的层满足（α2-α1）×L / t <0.016。

8. 发明专利

JP2012216642A Electronic apparatus and substrate assembly 审中-公开
标题翻译：电子设备和基板组件
公开(公告)号：JP2012216642A
公开(公告)日：2012-11-08
申请号：JP2011080236
申请日：2011-03-31
申请人： Toshiba Corp , 株式会社東芝
发明人： UKITA YASUNARI , ISHIZAKI SEIWA , WATANABE HISANORI , KAWADA TOMONORI , KANO TERUSHIGE
IPC分类号： H01L23/36
CPC分类号： H05K1/0206 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H05K1/113 , H05K2201/094 , H05K2201/10969 , H05K2203/043 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus and a substrate assembly which efficiently radiate heat from components and enable the components to be joined on a substrate in better condition.SOLUTION: An electronic apparatus includes: a housing; a substrate provided in the housing and including multiple first pads exposed on its surface and multiple second pads, each of which has a substantially rectangular shape and has a penetration hole part 26 inside the rectangular shape; a component which has multiple first electrodes exposed on a substrate facing surface facing a surface of the substrate and joined to the first pads through bonds 30a and 30b and a second electrode exposed on the substrate facing surface and joined to the second pads through the bonds.
摘要翻译：要解决的问题：提供一种电子设备和基板组件，其有效地从部件辐射热量，并使组件能够更好地接合在基板上。电子设备包括：壳体; 设置在所述壳体中并且包括在其表面上暴露的多个第一焊盘的基板和多个第二焊盘，每个第二焊盘具有大致矩形形状并且在矩形形状内具有穿透孔部分26; 具有多个第一电极的部件，所述部件具有多个第一电极，所述多个第一电极在面对所述衬底的面向衬底的表面上暴露并且通过接合件30a和30b与所述第一焊盘接合，以及暴露在所述衬底相对表面上并通过所述接合连接到所述第二焊盘版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2009032740A Semiconductor device and method of manufacturing the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2009032740A
公开(公告)日：2009-02-12
申请号：JP2007192444
申请日：2007-07-24
申请人： Toshiba Corp , 株式会社東芝
发明人： UKITA YASUNARI , OBATA SUSUMU , KOMATSU IZURU
IPC分类号： H01L25/00 , H01L21/60
CPC分类号： H01L2224/48227 , H01L2224/48465 , H01L2224/92247 , H01L2924/01067 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having improved connection reliability of electronic components in a package having loaded the electronic components, and to provide a method of manufacturing the same device.
SOLUTION: The semiconductor device includes a substrate 1 where a recess 11 is provided on the one main surface, an electronic component 2 arranged within the recess 11 to have a surface electrode 31, substrate electrodes 21a, 21b formed at the external circumferential part of the recess 11 and on a side wall of the recess 11, a conductive paste 3a for electrically connecting the surface electrode 31 of the electronic component 2 and the substrate electrodes 21a, 21b, and a sealing resin 6 for sealing the electronic component 2 and substrate electrodes 21a, 21b formed on the main surface of the substrate 1 and the conductive paste 3a.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有改进的电子部件在具有加载电子部件的封装中的连接可靠性的半导体器件，并且提供制造相同器件的方法。解决方案：半导体器件包括在一个主表面上设置有凹部11的基板1，配置在凹部11内的电子部件2，具有表面电极31，形成在外周的基板电极21a，21b 凹部11的一部分和凹部11的侧壁，用于将电子部件2的表面电极31与基板电极21a，21b电连接的导电浆料3a和密封电子部件2的密封树脂6 以及形成在基板1的主表面上的基板电极21a，21b和导电浆料3a。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2006083377A Electrically conductive adhesive and method for producing article utilizing the electrically conductive adhesive 有权
标题翻译：电导电粘合剂及使用电导电胶粘剂生产物品的方法
公开(公告)号：JP2006083377A
公开(公告)日：2006-03-30
申请号：JP2005237302
申请日：2005-08-18
申请人： Harima Chem Inc , Toshiba Corp , ハリマ化成株式会社 , 株式会社東芝
发明人： OSAKO TAKEHISA , SHIOI NAOTO , ITO DAISUKE , GOTO HIDEYUKI , MATSUBA YORISHIGE , TATEYAMA KAZUKI , UKITA YASUNARI , SEGAWA MASAO , KIKUCHI TAKUO
IPC分类号： C09J201/00 , C09C1/62 , C09C3/08 , C09J5/00 , C09J9/02 , C09J11/00 , C09J163/00 , H01B1/00 , H01B1/22 , H01L21/52
CPC分类号： H01L24/73 , H01L2224/29 , H01L2224/2919 , H01L2224/29298 , H01L2224/32245 , H01L2224/45 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/8384 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01029 , H01L2924/0103 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0665 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/00012 , H01L2924/20752
摘要： PROBLEM TO BE SOLVED: To provide an electrically conductive adhesive capable of solvent dilution for giving good coating workability, capable of preventing a gas from forming, when a binder resin is heated and cured after mounting of parts, and capable of forming an electrically conductive joint excellent in both of thermal conductivity and electrical conductivity. SOLUTION: This electrically conductive adhesive contains an electrically conductive medium, a thermosetting resin as a binder resin component, and a solvent for adjusting a liquid viscosity as essential components, wherein 100 pts.wt. of a silver powder having an average particle diameter of a micrometer size is, for example, used as a main component, together with 1-10 pts.wt. of silver fine particles having an average particle diameter of a nanometer size, in the electrically conductive medium, and further 5-15 pts.wt. of the thermosetting resin and 10 pts.wt. or less of the solvent are together used in the adhesive. The adhesive having a mixing ratio of the components thus selected avoids formation of gas components, when the thermosetting resin is heated/cured, and therefore prevents formation of voids, and further realizes preparation of the electrically conductive joint excellent in the thermal conductivity and the electrical conductivity at the same time. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够进行溶剂稀释以提供良好的涂布可加工性的导电粘合剂，能够防止气体形成，当粘合剂树脂在部件安装之后被加热和固化，并且能够形成导电接头在导热性和导电性方面均优异。解决方案：该导电粘合剂包含导电介质，作为粘合剂树脂组分的热固性树脂和用于调节作为必需组分的液体粘度的溶剂，其中100重量份平均粒径为微米尺寸的银粉末，例如以1-10重量份为主成分。的导电介质中平均粒径为纳米尺寸的银微粒，再加入5-15重量份的热固性树脂和10重量份或更少的溶剂一起用于粘合剂中。具有这样选择的组分的混合比例的粘合剂避免形成气体组分，当热固性树脂被加热/固化时，因此防止形成空隙，并且进一步实现导热性和导电性优异的导电接头的制备电导率同时。版权所有（C）2006，JPO＆NCIPI

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