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    • 2. 发明专利
    • PLASMA CVD APPARATUS
    • JPH02214113A
    • 1990-08-27
    • JP3551889
    • 1989-02-15
    • TOKYO ELECTRON LTDTEL SAGAMI LTD
    • SHIRATANI ISAOHAMADA YUUKI
    • C23C16/50H01L21/205H01L21/31
    • PURPOSE:To obtain a formed film of a uniform film thickness without causing defective electrical connection by a method wherein a fork, a quartz boat and a connection part are coupled by means of a conical shape. CONSTITUTION:An electrode sheet 10 which has been formed inside a quartz boat 20 is supported by a fork 30 as a support body of the quartz boat 20 inside a reaction tube 8 which is provided with a reactant-gas inflow port 6 and an evacuation port 7. The tip of a connector part 21 of the quartz boat 20 is formed to be a conical protrusion 15; the other end is fit into a spring 16 so as to be freely slid; when the protrusion 15 is pressurized upward, a load is exerted downward. On the other hand, a connection part 31 of the fork 30 is provided with a conical subsidence 17 in a shape which collides with and stops the protrusion 15 at the tip of the connector part 21 of the quartz boat. Thereby, it is possible to eliminate a nonuniformity of a film thickness of a formed thin film arising from defective contact of the contact part of the fork 30 with the quartz boat 20 due to deformation of the fork 30, and a thin film of a uniform thickness can be formed.
    • 6. 发明专利
    • Film forming apparatus, method of forming film, and storage medium
    • 电影成型装置,成膜方法和储存介质
    • JP2008243837A
    • 2008-10-09
    • JP2007077607
    • 2007-03-23
    • Tokyo Electron Ltd東京エレクトロン株式会社
    • TOJO YUKIOSHIRATANI ISAOKUROKAWA MASATAKE
    • H01L21/31C23C16/44
    • PROBLEM TO BE SOLVED: To control excessive etching process within a reactor during dry cleaning while controlling the accumulated film thickness in the down-stream side of a processing region for the purpose of forming a film within the reactor of a double structure including a vertical internal pipe and an external pipe.
      SOLUTION: Gas for controlling film formation is supplied to control film formation onto the external surface of an internal pipe and the internal surface of an external pipe from a gas supplying pipe having an open gas supplying port in the down-stream side of a processing region of a substrate surrounded by the internal pipe. Amount of gas supply of the gas supplying pipe is set so that a time difference (t2-t1) in the cleaning after film formation through gas supply for controlling film formation becomes equal to a half or less of the time difference (t2-t1) in the cleaning after film formation without gas supply for controlling film formation, when the time required for cleaning of thin film adhered to the internal surface of the internal pipe in the processing region is defined as t1; and the time required for cleaning of thin film adhered to the external surface of the internal pipe and the internal surface of the external pipe is defined as t2.
      COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:为了在干燥清洁期间控制反应器内的过度蚀刻工艺,同时控制加工区域的下游侧的累积膜厚度,以便在反应器内形成双重结构的膜,包括 垂直内管和外管。

      解决方案:提供用于控制成膜的气体,以控制在内管的外表面和外管的内表面上的成膜,该外管从具有开口气体供应口的供气管在下游侧 由内管包围的基板的处理区域。 气体供给管的气体供给量被设定为使得通过用于控制成膜的气体供给形成成膜后的清洗中的时间差(t2-t1)等于时间差的一半以下(t2-t1) 在没有气体供给用于控制成膜的成膜后的清洗中,当在处理区域内附着在内管内表面上的薄膜的清洗所需的时间定义为t1时; 并且清洁附着在内管的外表面和外管的内表面上的薄膜所需的时间被定义为t2。 版权所有(C)2009,JPO&INPIT

    • 7. 发明专利
    • PLASMA TREATMENT APPARATUS
    • JPH0226018A
    • 1990-01-29
    • JP17625988
    • 1988-07-15
    • TOKYO ELECTRON LTD
    • NISHIMURA TOSHIHARUSHIRATANI ISAO
    • H01L21/302H01L21/205H01L21/3065H01L21/31
    • PURPOSE:To improve the reliability of electrical contacts by a method wherein contacts for electrical connection between electrode plates and an electrode rod are maintained not only along the thickness direction of the hole parts of the electrode plates but also between the electrode rod and the side walls of the electrode pates. CONSTITUTION:Contacts which facilitate electrical connection between an electrode rod 10 and electrode plates 4a and 4b are provided not only along the thickness direction of the hole parts of the electrode plates 4a and 4b but also between the electrode rod 10 and the side walls of the electrode plates 4a and 4b. That is, conducting members are formed on the inner surfaces of separators 14 into which the electrode rod 10 is inserted to connect the conducting members of the separators 14 to the electrode rod 10 along the required length and, further, conducting members are also provided at the end surfaces of the separators 14 to be brought into contact with the electrode plates 4a and 4b at both the ends of the separators 14 and electrical connection to the electrode plates 4a and 4b is maintained in a region corresponding to the sectional area of the separator 14. Thus, a, conducting path of the electrode 10conducting member-electrode plate can be formed. With this constitution, contact defects can be avoided and the reliability of the contacts can be improved.
    • 10. 发明专利
    • TREATMENT DEVICE
    • JPH02174222A
    • 1990-07-05
    • JP32960488
    • 1988-12-27
    • TOKYO ELECTRON LTD
    • JINNAI SHINPEIHAYASHI YOSHINOBUUSHIKAWA HARUNORISHIRATANI ISAO
    • H01L21/205H01L21/31
    • PURPOSE:To prevent a treated gas in a reaction tube from flowing into an outside environment atmosphere and perform safety treatment operations by mounting handling parts in an airtight container even though they are exposed to the outside of a reaction furnace located on a support. CONSTITUTION:Handling parts 7 are mounted by exposing them to the outside of a reaction tube 2. The handling parts 7 which are exposed to the outside are surrounded so as to be kept airtight through bellows 20 which are superior in corrosion resistance and thermal resistance, a cylindrical airtight cup 21 having a base, and an O-ring 22. Even though slits 10 develop at a sheath tube 9 of a support 1, an extreme end part 8a of the handling parts 7 is isolated from an outside environment atmosphere in a state in which the end part 8a is kept airtight by the airtight cup 21. As a result, such a configuration prevents a treated gas 11 from flowing into the side of the outside environment atmosphere from gaps between the sheath tube 9 and support bar 8. Then, even though the support 1 breaks down, the treatment of a wafer 14 is performed without discharging the treated gas 11 from damaged parts to the outside. When a prescribed time of treatment elapses, this device automatically stops treatment operation. Then unloading is performed and a boat 15 is taken out at a prescribed position.