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1. 发明专利

JP2005045151A Image pickup device, manufacturing method thereof, and manufacturing apparatus thereof 审中-公开
标题翻译：图像拾取装置及其制造方法及其制造装置
公开(公告)号：JP2005045151A
公开(公告)日：2005-02-17
申请号：JP2003279730
申请日：2003-07-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRASE TAKASHI , OKAMURA MASAMITSU , HAMAGUCHI TSUNEO , SAKAMOTO HIROO
IPC分类号： H01L27/14 , H04N5/225 , H04N5/335
摘要： PROBLEM TO BE SOLVED: To provide an image pickup device or the manufacturing method thereof wherein its image pickup element is curved uniformly and sufficiently.
SOLUTION: In the image pickup device, an image pickup element 4 is so curved as to fasten it to a concave curved portion 2 provided in a supporting member 1. The radius of curvature of the concave curved portion 2 or the image pickup element 4 is set to the scope of 15-30 mm, and the thickness of the image pickup element 4 is set to the scope of 0.01-0.1 mm. The manufacturing method of the image pickup device comprises a process for providing a bonding agent 3 on the concave curved portion 2 of the supporting member 1, a process for providing the image pickup element 4 on the bonding agent 3, a process for so providing an extensible sheet 5 on the concave curved portion 2 as to cover the image pickup element 4 with the sheet 5, and a process for so pressing the image pickup element 4 against the concave curved portion 2 by a high-pressure air via the extensible sheet 5 as to harden the bonding agent 3.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种图像拾取装置或其制造方法，其中其图像拾取元件被均匀且充分地弯曲。解决方案：在图像拾取装置中，图像拾取元件4被弯曲以将其紧固到设置在支撑构件1中的凹形弯曲部分2。凹形弯曲部分2或图像拾取器的曲率半径元件4设定为15-30mm的范围，并且图像拾取元件4的厚度被设定为0.01-0.1mm的范围。图像拾取装置的制造方法包括在支撑构件1的凹曲面部分2上提供粘合剂3的方法，用于在接合剂3上提供图像拾取元件4的处理，可弯曲部分2上的可延展片5用片材5覆盖图像拾取元件4，以及通过可伸展片材5通过高压空气将图像拾取元件4压靠在凹形弯曲部分2上的过程以加固粘结剂3.版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2003066110A Apparatus and method for testing high frequency module 审中-公开
标题翻译：用于测试高频模块的装置和方法
公开(公告)号：JP2003066110A
公开(公告)日：2003-03-05
申请号：JP2001259645
申请日：2001-08-29
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKAMURA SATOSHI , HASEGAWA KAZUYOSHI , YAMAUCHI YASUHIRO , TOKASHIKI NAOTAKA , OKAMURA MASAMITSU
IPC分类号： G01R1/06 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for testing a high frequency module for a stable inspection even if the height of the high frequency module varies.
SOLUTION: The testing apparatus that brings a high frequency probe into contact with the surface of the high frequency module for testing comprises a test stage having the high frequency module where a shield pin and a signal pin are fixed, a base section for placing the high frequency module, and a contact section connected to the shield potential, and a means for adjusting the distance from the upper surface of the base section to the upper surface of the contact section corresponding to the thickness of the high frequency module.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：即使高频模块的高度变化，提供用于测试高频模块以进行稳定检查的装置和方法。解决方案：将高频探头与高频模块表面接触以进行测试的测试装置包括具有固定屏蔽引脚和信号引脚的高频模块的测试平台，用于放置高频模块的基座部分频率模块和连接到屏蔽电位的接触部分，以及用于根据高频模块的厚度调整从基部的上表面到接触部分的上表面的距离的装置。

3. 发明专利

JP2008304761A Optical fiber coupler 有权
标题翻译：光纤耦合器
公开(公告)号：JP2008304761A
公开(公告)日：2008-12-18
申请号：JP2007152671
申请日：2007-06-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KITAGAKI SHUNICHI , FUKUDA KEIICHI , NAKAMURA SATOSHI , OKAMURA MASAMITSU , SASAKURA HISAYASU
IPC分类号： G02B6/287 , G02B6/28
摘要： PROBLEM TO BE SOLVED: To provide an optical fiber coupler in which the reliability as an optical fiber coupler is preserved against the variation in environmental temperature. SOLUTION: The optical coupler is provided with a fiber fixing member 2 which is fixed on both ends of a protection tube 1 of the optical fiber coupler and has a stretched part 21 which stretches in the protection tube toward the central part of the protection tube. The fiber fixing member 2 is made of a material having a larger linear thermal expansion coefficient than that of the protection tube 1. A seal material 3 is applied to the fiber fixing member 2 at a position close to the end part 4b of a base member 4 to which an optical fiber 7 is fixed. The seal material 3 holds the optical fiber stretching from the base member 4 to the outside of the protection tube and seals the protection tube to keep air tight. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种光纤耦合器，其中作为光纤耦合器的可靠性被保留以抵抗环境温度的变化。解决方案：光耦合器设置有固定在光纤耦合器的保护管1的两端的光纤固定部件2，并且具有拉伸部分21，该拉伸部分21在保护管中向中心部分延伸保护管。纤维固定部件2由比保护管1的线性热膨胀系数大的材料制成。密封材料3在靠近基部件的端部4b的位置处施加到纤维固定部件2上 4，固定有光纤7。密封材料3将从基体部件4延伸到保护管外侧的光纤保持密封，保持气密性。版权所有（C）2009，JPO＆INPIT

4. 发明专利

JP2008205259A Optical module 审中-公开
标题翻译：光学模块
公开(公告)号：JP2008205259A
公开(公告)日：2008-09-04
申请号：JP2007040587
申请日：2007-02-21
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： FUKUDA KEIICHI , KITAGAKI SHUNICHI , NAKAMURA SATOSHI , OKAMURA MASAMITSU , SASAKURA HISAYASU , KATAYAMA MASATOSHI , YAMANAKA SHIGEO , YANO NORIYUKI , YAMASHITA JUNICHIRO , NANBARA SEIJI , HASEGAWA KAZUYOSHI , TAKAGI SHINICHI
IPC分类号： H01S5/022 , G02B6/42 , H01L31/02 , H01S5/06
摘要： PROBLEM TO BE SOLVED: To provide an optical module which achieves a longer service lifetime by protecting an optical element while appropriating humidity in an open package that is not hermetically sealed.
SOLUTION: The optical module is provided with the optical element and a heat-generating body that heats the optical element. The optical element is heated by allowing the heat-generating body to generate heat in a period in which the optical element is not energized. The optical module may be further provided with a first switch part for turning OFF/ON the energization to the heat-generating body with a phase reverse to a phase of the ON/OFF of the energization to the optical element. Another optical module is provided with an optical element and a heat-generating body that heats the optical element. In another optical module, a calorific value of the total sum of a calorific value due to the optical element itself and a calorific value of the heat-generating body is set to exceed a prescribed value with the energization to the optical element in a period in which the optical element is energized.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过保护光学元件同时在未密封的开放式封装中适应湿气来实现更长使用寿命的光学模块。解决方案：光学模块设置有光学元件和加热光学元件的发热体。通过允许发热体在光学元件不通电的时段内产生热量来加热光学元件。光模块还可以设置有第一开关部件，用于以与向光学元件通电的ON / OFF的相位相反的相位关闭/接通对发热体的通电。另一个光学模块设置有光学元件和加热光学元件的发热体。在另一个光学模块中，由于光学元件本身的发热量和发热体的发热量的总和的热值被设定为超过规定值，在光学元件的通电期间光学元件被激励。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2004351480A Method and apparatus for brazing 审中-公开
标题翻译：方法和装置装置
公开(公告)号：JP2004351480A
公开(公告)日：2004-12-16
申请号：JP2003153054
申请日：2003-05-29
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HIRAOKA KOJI , TAKAO HARUO , IDETA GORO , OKAMURA MASAMITSU , SHIRASE TAKASHI
IPC分类号： B23K3/00 , B23K1/008 , B23K3/06 , B23K31/02 , B23K101/40 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a brazing method which improves productivity and reduces the cost of a brazing apparatus.
SOLUTION: The brazing method comprises: a spherical brazing material forming process to form a molten brazing material into a spherical shape and then harden the material, in a first oxygen concentration atmosphere where oxidation is suppressed by making the brazing material into the spherical shape; and a brazing process to sandwich the spherical brazing material between an object 2 to be joined and an object 3 to be joined with, to re-melt the spherical brazing material in a second oxygen concentration the most suitable for brazing material joining and lower than the first one, and to braze the object to be joined and the object to be joined with, using the molten brazing material.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种提高生产率并降低钎焊装置的成本的钎焊方法。解决方案：钎焊方法包括：将第一氧浓度气氛中的熔融钎焊材料形成为球形，然后硬化所述材料的球形钎焊材料形成工艺，其中通过将所述钎焊材料制成球形来抑制氧化形状; 以及将待接合物体2与待接合物体3夹持球形钎焊材料的钎焊工艺，以最适合钎焊材料接合的第二氧浓度再熔融球状钎料，并且低于第一个，并且使用熔融钎焊材料钎焊待接合的物体和要接合的物体。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2008256885A Optical fiber coupler 有权
标题翻译：光纤耦合器
公开(公告)号：JP2008256885A
公开(公告)日：2008-10-23
申请号：JP2007098098
申请日：2007-04-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KITAGAKI SHUNICHI , FUKUDA KEIICHI , NAKAMURA SATOSHI , OKAMURA MASAMITSU , SASAKURA HISAYASU
IPC分类号： G02B6/287
摘要： PROBLEM TO BE SOLVED: To provide an optical fiber coupler capable of maintaining reliability as the optical fiber coupler as against a change in an environmental temperature. SOLUTION: In the optical fiber coupler 101 housing a base material 120 fixed with a melt stretching part 111 of the optical fiber 110 into a protective tube 130 and sealing both ends of the protective tube by sealing materials 130, both ends of the protective tube are provided with buffer mechanisms 131. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够保持作为光纤耦合器的可靠性的光纤耦合器，以防止环境温度的变化。解决方案：在光纤耦合器101中，将固定有光纤110的熔融拉伸部分111的基底材料120保持在保护管130中，并通过密封材料130密封保护管的两端，保护管设有缓冲机构131.版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008181958A Semiconductor light-emitting element 有权
标题翻译：半导体发光元件
公开(公告)号：JP2008181958A
公开(公告)日：2008-08-07
申请号：JP2007012717
申请日：2007-01-23
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KITAGAKI SHUNICHI , FUKUDA KEIICHI , NAKAMURA SATOSHI , OKAMURA MASAMITSU , HIRAMATSU KENJI , KATAYAMA MASATOSHI , YAMANAKA SHIGEO , YANO NORIYUKI , YAMASHITA JUNICHIRO , NANBARA SEIJI , HASEGAWA KAZUYOSHI , TAKAGI SHINICHI , ISHIMURA EITARO
IPC分类号： H01L33/38
摘要： PROBLEM TO BE SOLVED: To obtain a semiconductor light-emitting element in which a light-emitting end surface is not deteriorated even in a high humidity environment and long term reliability can be ensured. SOLUTION: The semiconductor light-emitting element is provided with a substrate, a first electrode provided on the lower surface of the substrate, a semiconductor layer laminated on the substrate and having a side surface forming a light-emitting end surface, a second electrode provided on the center of the uppermost surface of the semiconductor layer, and a third electrode provided on one part of the uppermost surface of the semiconductor layer and having a potential value between the potential of the second electrode and the potential of first electrode or same as the potential of the first electrode. Thus, a semiconductor light-emitting element in which the light-emitting end surface is not deteriorated even if it is operated in high humidity environment and long term reliability can be ensured can be obtained. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题为了获得即使在高湿度环境下发光端面也不劣化的半导体发光元件，能够确保长期的可靠性。解决方案：半导体发光元件设置有基板，设置在基板的下表面上的第一电极，层叠在基板上并具有形成发光端面的侧面的半导体层，设置在半导体层的最上表面的中心的第二电极和设置在半导体层的最上表面的一部分上并具有第二电极的电位和第一电极的电位之间的电位的第三电极，与第一电极的电位相同。因此，可以获得即使在高湿度环境下运行发光端面也不会劣化的长期可靠性的半导体发光元件。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2005252305A Semiconductor device for electric power 审中-公开
标题翻译：电力半导体器件
公开(公告)号：JP2005252305A
公开(公告)日：2005-09-15
申请号：JP2005142408
申请日：2005-05-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： DAITOKU OSAMU , OGA TAKUYA , OKAMURA MASAMITSU , KASHIBA YOSHIHIRO , SONODA ISAO , AKAGI IPPEI , OKUDA TATSUYA
IPC分类号： H01L25/07 , H01L25/18 , H02M1/00
CPC分类号： H01L2224/34 , H01L2224/45124 , H01L2224/48137 , H01L2224/48139 , H01L2224/49111 , H01L2224/49113 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2224/37099 , H01L2224/37599 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device for electric power using a bonding wire which can obtain required and sufficient electrical performance, and also can be manufactured easily irrespective of the number of parallel semiconductor devices. SOLUTION: The semiconductor device for electric power comprises a first insulating substrate 23 in which a plurality of first semiconductor devices, bonding wires, and electrode patterns 21a, 20a and 22a of a source, a drain and a gate where electric connections of the respective first semiconducor elements are formed by soldering are formed, and a second insulating substrate 23 in which a plurality of second semiconductor devices, bonding wires, and electrode patterns 21b, 20b and 22b of the source, the drain and the gate where eledctric connection of the respective second semiconductor elements are formed by solderijng are formed. Each gate electrode pattern of on the first and second insulating substrate puts together gate wirings of the respective semiconductor devices into one. Electrode patterns of the source and the gate on the first insulating substrate and electrode patterns of the source and the gate on the second insulating substrate are arranged in substantially parallel and at a short distance, respectively. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种使用能够获得所需和足够的电气性能的接合线的电力的半导体器件，并且也可以容易地制造而不考虑并行半导体器件的数量。解决方案：用于电力的半导体器件包括：第一绝缘基板23，其中多个第一半导体器件，接合线以及源极，漏极和栅极的电极图案21a，20a和22a，其中电连接通过焊接形成各自的第一半导体元件;以及第二绝缘基板23，其中多个第二半导体器件，接合线以及源极，漏极和栅极的电极图案21b，20b和22b，其中串联连接通过焊料形成各自的第二半导体元件。第一绝缘基板和第二绝缘基板上的每个栅极电极图案将各个半导体器件的栅极布线组合成一个。第一绝缘基板上的源极和栅极的电极图案以及源极和第二绝缘基板上的栅极的电极图案分别基本上平行且短距离地布置。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2004095628A Member pasting apparatus and method therefor 有权
公开(公告)号：JP2004095628A
公开(公告)日：2004-03-25
申请号：JP2002251224
申请日：2002-08-29
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HIRAOKA KOJI , KANEZUKA NORIHIKO , OKAMURA MASAMITSU , SATO HIROYOSHI , OKUBO MITSURU
IPC分类号： H01L31/042
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a member pasting apparatus and a method therefor which can prevent the occurrence of abrasion waste, cracks, or the like of members, can make a slip between the members as small as possible, and can prevent other problems when pasting the members to each other. SOLUTION: The member pasting apparatus 1 comprises a chucking table 4 with a chucking surface 3 for chucking a solar battery cell 2; a glass chucking table 7 with a glass chucking surface 6 for chucking a cover glass 5; a positioning mechanism 8 for positioning the solar battery cell 2 and the cover glass 5 by pinching of a presser pin 23 and a reference pin 24; a movement mechanism 9 which reverses the glass chucking table 7 to locate the cover glass 5 opposite to the solar battery cell 2 and lay the cover glass 5 on top of the solar battery cell 2; and a control unit 10 for controlling the movements of the cell chucking table 4, the glass chucking table 7, the positioning mechanism 8, and the movement mechanism 9. The solar battery cell 2 and the cove glass 5 are positioned after being chucked. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2004022960A Semiconductor device for power 有权
公开(公告)号：JP2004022960A
公开(公告)日：2004-01-22
申请号：JP2002178464
申请日：2002-06-19
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： DAITOKU OSAMU , OGA TAKUYA , OKAMURA MASAMITSU , KASHIBA YOSHIHIRO , SONODA ISAO , AKAGI IPPEI , OKUDA TATSUYA
IPC分类号： H01L25/07 , H01L23/48 , H01L25/18
CPC分类号： H01L2224/36 , H01L2224/40 , H01L2224/40137 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2224/48227 , H01L2224/48472 , H01L2224/49111 , H01L2224/49175 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/37099 , H01L2224/37599
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device for power which eliminates a fault caused by a bonding wire and in which the number of parts is small and of which manufacture is simple. SOLUTION: In the semiconductor device for power having a paired arm structure consisting of an anode side circuit and a cathode side circuit, a first metal block 1a is connected to the rear surfaces of a plurality of first semiconductor elements, a second metal block 1b is connected to the rear surfaces of a plurality of second semiconductor elements, the front surfaces of the first and the second semiconductor elements are connected to first and second metal blocks via lead frame 13, the first and second semiconductor elements, the first and the second metal blocks and the lead frame are integrally covered with a housing, and the first and the second metal blocks constitute a part of a main electrode in which main current flows, and main electrode and the control electrode formed of the lead frame in the housing are disposed on substantially flat surface except the connecting part to the first, second semiconductor elements and the first and second metal blocks. COPYRIGHT: (C)2004,JPO

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