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1. 发明专利

JP2003036786A Assembling method of electron gun for color cathode ray tube, electrode composite body and supporter suitable for assembly, and electrode supporting structure provided by the assembly 审中-公开
标题翻译：用于彩色阴极射线管的电子枪组装方法，适用于组装的电极复合体和支撑体以及大会提供的电极支撑结构
公开(公告)号：JP2003036786A
公开(公告)日：2003-02-07
申请号：JP2001223958
申请日：2001-07-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRAISHI TETSUYA , NAKADA SHUHEI , HINOMOTO NOBUHIDE , KONDO RIICHI , NAGASE AKIHIRO , SHIRASE TAKASHI
IPC分类号： H01J9/18 , H01J29/04 , H01J29/48
摘要： PROBLEM TO BE SOLVED: To provide a method for assembling an electron gun for a color cathode ray tube, for fabrication at high precision and yield.
SOLUTION: The electron gun comprises three cathodes for RGB, three first electrodes 1 for RGB which is, electrically independent, provided nearer to a screen than to the cathode, a second electrode 2 provided further near the screen than the first electrode is. At assembling, the first electrode 1 is fixed to a cathode support part 5 before bead. The support part 5 comprises a cathode welding part 10, a first electrode welding part 11, and an insulator 6 to which the cathode welding part and the first electrode welding part are fixed. By welding the first electrode 1 to the first electrode welding part 11 of the support part 5, the first electrode 1 is made integral with the support part 5, and then electrodes are aligned. After that, the first electrode 1 is fixed to a bead glass through the support part 5.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种组装用于彩色阴极射线管的电子枪的方法，以高精度和高产量制造。解决方案：电子枪包括三个用于RGB的阴极，三个用于RGB的第一电极1，电气独立地设置得比阴极靠近屏幕;第二电极2设置在比第一电极更靠近屏幕的位置。在组装时，第一电极1在珠之前固定到阴极支撑部分5。支撑部分5包括阴极焊接部分10，第一电极焊接部分11和固定有阴极焊接部分和第一电极焊接部分的绝缘体6。通过将第一电极1焊接到支撑部5的第一电极焊接部11，将第一电极1与支撑部5一体化，然后电极对准。之后，第一电极1通过支撑部5固定在珠玻璃上。

2. 发明专利

JP2005045151A Image pickup device, manufacturing method thereof, and manufacturing apparatus thereof 审中-公开
标题翻译：图像拾取装置及其制造方法及其制造装置
公开(公告)号：JP2005045151A
公开(公告)日：2005-02-17
申请号：JP2003279730
申请日：2003-07-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRASE TAKASHI , OKAMURA MASAMITSU , HAMAGUCHI TSUNEO , SAKAMOTO HIROO
IPC分类号： H01L27/14 , H04N5/225 , H04N5/335
摘要： PROBLEM TO BE SOLVED: To provide an image pickup device or the manufacturing method thereof wherein its image pickup element is curved uniformly and sufficiently.
SOLUTION: In the image pickup device, an image pickup element 4 is so curved as to fasten it to a concave curved portion 2 provided in a supporting member 1. The radius of curvature of the concave curved portion 2 or the image pickup element 4 is set to the scope of 15-30 mm, and the thickness of the image pickup element 4 is set to the scope of 0.01-0.1 mm. The manufacturing method of the image pickup device comprises a process for providing a bonding agent 3 on the concave curved portion 2 of the supporting member 1, a process for providing the image pickup element 4 on the bonding agent 3, a process for so providing an extensible sheet 5 on the concave curved portion 2 as to cover the image pickup element 4 with the sheet 5, and a process for so pressing the image pickup element 4 against the concave curved portion 2 by a high-pressure air via the extensible sheet 5 as to harden the bonding agent 3.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种图像拾取装置或其制造方法，其中其图像拾取元件被均匀且充分地弯曲。解决方案：在图像拾取装置中，图像拾取元件4被弯曲以将其紧固到设置在支撑构件1中的凹形弯曲部分2。凹形弯曲部分2或图像拾取器的曲率半径元件4设定为15-30mm的范围，并且图像拾取元件4的厚度被设定为0.01-0.1mm的范围。图像拾取装置的制造方法包括在支撑构件1的凹曲面部分2上提供粘合剂3的方法，用于在接合剂3上提供图像拾取元件4的处理，可弯曲部分2上的可延展片5用片材5覆盖图像拾取元件4，以及通过可伸展片材5通过高压空气将图像拾取元件4压靠在凹形弯曲部分2上的过程以加固粘结剂3.版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004096797A Imaging device 有权
公开(公告)号：JP2004096797A
公开(公告)日：2004-03-25
申请号：JP2003423973
申请日：2003-12-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MIYAKE HIROYUKI , KOMORI NORIYUKI , SHIRASE TAKASHI , HIROE RIYUUJIROU
IPC分类号： H04N5/225 , H04N5/335
摘要： PROBLEM TO BE SOLVED: To position an imaging lens to an image pickup element fixed on a film substrate easily.
SOLUTION: The imaging device contains the film substrate having a through hole, the image pickup element being fixed on the film substrate and having an imaging area exposed to the through hole, an imaging lens which forms an image on the imaging area through the through hole, a leg section forming a lens barrel supporting the imaging lens and an opening into which the film substrate is inserted, a supporting member consisting of a supporting section formed solidly with the leg section and the lens barrel, and a fixing means to fix the film substrate on the supporting member at the opening. A convexity section is provided on the supporting member, and a hole section is provided on the corresponding position to the convexity section on the film substrate to place the convexity section into the hole section.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2011210884A Quality control method of solder junction and quality control device 有权
标题翻译：焊接和质量控制装置质量控制方法
公开(公告)号：JP2011210884A
公开(公告)日：2011-10-20
申请号：JP2010076100
申请日：2010-03-29
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TSURUTA AKIZO , SHIRASE TAKASHI , SUGIURA SEI , IWATA MASAKI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To obtain the quality control method of a solder junction which can a perform non-destructive and highly accurate quality inspection on real time without additional inspections.SOLUTION: The quality control method of a junction formed by supplying (S0) solder and local thermal energy on a resin substrate includes a process (S1) to measure the time variation of temperature of the junction during junctioning, a process (S2) to find a plurality of feature quantities from measured data, a process (S3) to find a single numerical value index from the plurality of feature quantities, and a process (S4) to determine whether the junction is suitable (S5) or not suitable (S6) comparing the numerical value index and a predetermined threshold value (S4). The plurality of feature quantities includes a time tin which the temperature of the junction is a predetermined temperature Tor more to satisfy a condition (the glass transition temperature of the substrate-50°C)≤T≤(the glass transition temperature of the substrate+250°C) and a time tin which the temperature of the junction reaches a predetermined temperature Tto satisfy a condition (the glass transition temperature of the substrate-50°C)≤T≤(the glass transition temperature of the substrate+250°C) from the start time of heating by the thermal energy.
摘要翻译：要解决的问题：获得可以实时进行无损和高精度质量检测的焊点的质量控制方法，无需附加检查。解决方案：通过供应（S0）焊料形成的结的质量控制方法并且树脂基板上的局部热能包括测量结合期间结点的温度时间变化的处理（S1），从测量数据找到多个特征量的处理（S2），找到的处理（S3）来自多个特征量的单个数值索引，以及用于确定结合是否适合（S5）或不适合（S6）比较数值指数和预定阈值的处理（S4）（S4）。多个特征量包括：为了满足条件（基板的玻璃化转变温度-50℃）≤T≤（基板的玻璃化转变温度+ 250℃）和结温达到规定温度Tto的时间锡满足条件（基板的玻璃化转变温度-50℃）≤T≤（基板的玻璃化转变温度+ 250℃））从加热的开始时间通过热能。

5. 发明专利

JP2010190453A Gas liquid filling device 审中-公开
标题翻译：气体液体填充装置
公开(公告)号：JP2010190453A
公开(公告)日：2010-09-02
申请号：JP2009033346
申请日：2009-02-17
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAGI NAOKI , HIRONAKA SHINGO , IPPOSHI SHIGETOSHI , SHIRASE TAKASHI , MATSUO SHIGERU
IPC分类号： F28D15/02
摘要： PROBLEM TO BE SOLVED: To obtain a gas liquid filling device capable of accurately filling working fluid and non-condensable gas within a heat pipe and having good manufacturing efficiency.
SOLUTION: The gas liquid filling device includes: a working fluid supply part 52; a non-condensable gas supply part 24; a vacuum exhaust part 23; a connecting part 34 having a connecting port 66 for connecting a pipe 19, a connecting port 67 for connecting the working fluid supply part 52, a connecting port 69 for connecting the vacuum exhaust part 23 and a connecting port 68 for connecting the non-condensable gas supply part 24; a sealing processing part 20 for sealing the pipe 19 at a position lower than the connecting port 66; an orifice 36 provided between the connecting port 67 and the working fluid supply part 52; a valve 35 positioned on the lower side of the orifice 36 and opened for a predetermined time corresponding to the aperture of the orifice 36 and working fluid injection amount; a valve 33 provided between the connecting port 69 and the vacuum exhaust part 23; and a valve 25 provided between the non-condensable gas supply part 24 and the connecting port 68.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：获得能够精确地填充热管内的工作流体和不可冷凝气体并具有良好制造效率的气液填充装置。气体充填装置包括：工作流体供给部52; 不可冷凝气体供给部24; 真空排气部23; 具有用于连接管19的连接口66，用于连接工作流体供给部52的连接口67，连接真空排气部23的连接口69和连接不可冷凝物的连接口68的连接部34 气体供给部24; 密封处理部20，用于将管19密封在比连接口66低的位置; 设置在连接口67和工作流体供给部52之间的孔36; 阀35位于孔36的下侧，并且对应于孔36的孔径和工作流体喷射量打开预定时间; 设置在连接口69和真空排气部23之间的阀33; 以及设置在不可冷凝气体供给部24和连接口68之间的阀25.权利要求（C）2010，JPO＆INPIT

6. 发明专利

JP2010109247A Electronic apparatus 有权
标题翻译：电子设备
公开(公告)号：JP2010109247A
公开(公告)日：2010-05-13
申请号：JP2008281349
申请日：2008-10-31
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TAKAMUNE KOICHI , OMURA YOICHI , SUGIURA SEI , SHIRASE TAKASHI
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus large in a heat-transfer area between a heat generation component and a metal housing (radiator), capable of reducing contact thermal resistance by increasing pressing force between the heat generation component and the housing in response to temperature rise in the metal housing by heat generation, and excelling in space efficiency in the apparatus. SOLUTION: This electronic apparatus includes: the metal housing 11 having a first wall part 11a, a second wall part 11b facing the first wall part 11a, and sidewall parts 11c, 11d connecting both edges of the first and second wall parts 11a, 11b to each other; the heat generation component 13 mounted on one surface of a rigid substrate 12, and having an upper surface abutting on the first wall part 11a, or facing the first wall part through a minute space; and a spacer 14 which is formed of a material having a coefficient of thermal expansion larger than those of the sidewall parts 11c, 11d of the metal housing 11, and of which the one side supports the rigid substrate 12 and the other side is supported by the second wall part 11b. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种大的发热部件和金属壳体（散热器）之间的传热区域的电子设备，能够通过增加发热部件和发热部件之间的压力来降低接触热阻响应于通过发热而在金属壳体中的温度上升，并且在设备中具有优异的空间效率。该电子设备包括：具有第一壁部分11a，面对第一壁部分11a的第二壁部分11b和连接第一和第二壁部分11a的两个边缘的侧壁部分11c，11d的金属壳体11 ，11b彼此; 安装在刚性基板12的一个表面上的发热部件13，并且具有抵靠第一壁部11a的上表面，或者通过微小的间隔面对第一壁部; 以及间隔件14，其由具有比金属壳体11的侧壁部11c，11d的热膨胀系数大的热膨胀系数的材料形成，并且其一侧支撑刚性基板12，另一侧支撑在另一侧第二壁部11b。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2007229895A Press-in device, and press-in method of the device 审中-公开
标题翻译：压入装置和装置的压入方法
公开(公告)号：JP2007229895A
公开(公告)日：2007-09-13
申请号：JP2006057217
申请日：2006-03-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRASE TAKASHI , KANEZUKA NORIHIKO , HASE HIROAKI
IPC分类号： B23P19/02
摘要： PROBLEM TO BE SOLVED: To provide a press-in device capable of precisely pressing in a press-in member to be predetermined press-in length.
SOLUTION: The press-in device pushing and pressing a press-in member 1 in a press-in hole 20 of a pressed-in member 2 to be the predetermined length, comprises a measuring means measuring the press-in member 1 or the length in a press-in direction of the press-in member 1 and the pressed-in member 2; an actuator 5 pressing the press-in member 1 into the press-in hole 20; a stopper 4 arranged so as to be inserted from a lower end side in the press-in direction of the press-in hole 20; an insertion amount adjusting means 3 adjusting the insertion length to the press-in hole 20 of the stopper 4; and a controlling means 7 controlling the insertion amount adjusting means 3 by calculating the insertion length to the press-in hole 20 of the pressed-in member 2 of the stopper 4 from the length measured by the measuring means and the predetermined press-in length, and controlling pressing of the actuator 5 according to the length of the press-in member 1 and the insertion length measured by the measuring means.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够精确地按压在压入部件中的预定压入长度的压入装置。解决方案：压入装置将按压构件2的压入孔20中的压入构件1推压并按压到预定长度，包括测量装置，其测量压入构件1 或压入构件1和压入构件2的按压方向的长度; 致动器5将压入构件1压入压入孔20中; 止动件4，其从压入孔20的压入方向的下端侧插入; 插入量调节装置3，调节与止动器4的压入孔20的插入长度; 以及控制装置7，通过从由测量装置测量的长度和预定的压入长度计算到止动件4的压入构件2的压入孔20的插入长度来控制插入量调节装置3 并且根据压入构件1的长度和由测量装置测量的插入长度来控制致动器5的按压。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2014047000A Component supplying apparatus and method 有权
标题翻译：组件供应装置和方法
公开(公告)号：JP2014047000A
公开(公告)日：2014-03-17
申请号：JP2012188864
申请日：2012-08-29
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OE SHINICHI , SHIRASE TAKASHI , NISHIHARA JUNJI , NOGUCHI YUKIO
IPC分类号： B65G47/14 , B65G47/30 , H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a component supplying apparatus and method that allow components to be extracted in a stable attitude without causing component jam.SOLUTION: A component supplying apparatus 100 carries out component supply by applying vibration to a conveyance passage 12 to convey components 1, and aligning the components on a guide 20 from the conveyance passage. In the component supplying apparatus 100, the rearmost component out of the components aligned on the guide is gripped and extracted by a component extracting robot 50, or a component in the front out of the components aligned on the guide is extracted by being moved by the robot onto a stopper positioned at a guide outlet.
摘要翻译：要解决的问题：提供一种部件供应装置和方法，其允许以稳定的姿态抽出部件，而不会引起部件堵塞。解决方案：部件供给装置100通过对输送通道12施加振动来输送部件供给，以输送部件并且将引导件20上的部件与输送通道对准。在部件供给装置100中，由引导部件对准的部件中的最后部件被部件提取机械手50夹持并提取，或者通过被引导部件50移动而将引导件对准的部件中的前方部件提取出来机器人位于定位在引导出口处的止动器上。

9. 发明专利

JP2013096706A Method for bonding by photocurable adhesive and optical rotary encoder using the same 审中-公开
标题翻译：使用光电胶粘剂和光学旋转编码器进行粘合的方法
公开(公告)号：JP2013096706A
公开(公告)日：2013-05-20
申请号：JP2011236579
申请日：2011-10-28
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： FUTAMURA MASANORI , SHIRASE TAKASHI , NOGUCHI TAKUYA , TACHII YOSHINAO
IPC分类号： G01D5/347
摘要： PROBLEM TO BE SOLVED: To provide a method for bonding by a photocurable adhesive, which efficiently makes curing light arrive at the photocurable adhesive and which realises excellent bonding without increasing the curing light output of an irradiation device, in a joined component transmitting light.SOLUTION: In a method for bonding by a photocurable adhesive, which joins two joined components at least one of which is transparent together with the photocurable adhesive, curing light is applied to a surface of the transparent joined component at an incident angle of Brewster's angle θ, and the photocurable adhesive between the joined components is cured so as to bond the joined components together.
摘要翻译：要解决的问题：提供一种通过光固化性粘合剂进行接合的方法，其有效地使固化光到达可光固化粘合剂，并且在增加照射装置的固化光输出的情况下实现优异的粘合，光。解决方案：在通过可光固化粘合剂粘合的方法中，其连接两个连接的部件，其中至少一个与光固化粘合剂一起是透明的，固化光以透明接合部件的表面以入射角布鲁斯特角θ B ，并且连接部件之间的光固化粘合剂固化，以将接合部件粘合在一起。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2012240828A Part supply device and part supply method of the same 有权
标题翻译：部件供应装置及其部件供应方法
公开(公告)号：JP2012240828A
公开(公告)日：2012-12-10
申请号：JP2011115298
申请日：2011-05-24
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRASE TAKASHI , NISHIHARA JUNJI , MIYAKE YASUHIRO , KODERA HIDEKAZU
IPC分类号： B65G47/14
摘要： PROBLEM TO BE SOLVED: To provide a part supply device that can simultaneously supply opposite one set of parts to an assembling process, to the assembling process of a product using the plurality of same parts opposite to each other.SOLUTION: This part supply device includes a bowl vessel 11 for stocking the part 1 of a various state in an attitude, a part aligning means for aligning the parts 1 in a predetermined attitude by determining the obverse-reverse, the front-rear and the right-left of the part 1 by using characteristics of an external shape of the part 1, and an index stage 20 for stocking the aligned parts 1 in pockets 23 radially arranged at an equal interval around a rotary disk 21. The index stage 20 has part ejecting ports 25 of two places in a symmetrical position to the center 27 of the rotary disk 21 in an outer peripheral part of the index stage 20, and has a part supply port 24 of one place in an outer peripheral part, becoming 90 degrees from the center 27 to the respective part ejecting ports 25.
摘要翻译：要解决的问题：提供一种能够同时向组装过程中提供相反的一组部件的零件供应装置，使用使用相互相对的多个相同部件的产品的组装过程。解决方案：该部件供给装置包括用于以姿态存放各种状态的部件1的碗形容器11，用于通过确定正面反转来将部件1以预定姿态对准的部件对准装置，通过使用部件1的外部形状的特征，以及用于将对准部件1放置在围绕旋转盘21等间隔放射状的凹穴23中的对准部分1的折痕台20，从而使部件1的后部和右侧左侧。阶段20在分度台20的外周部分中具有与旋转盘21的中心27对称位置的两个位置的部分排出口25，并且在外周部分具有一个位置的部件供给口24，从中心27到相应的部件排出口25成90度。（C）版权所有（C）2013，JPO＆INPIT

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