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1. 发明专利

JP2014138021A Alignment device and alignment method using the same 有权
标题翻译：对准装置和使用其的对准方法
公开(公告)号：JP2014138021A
公开(公告)日：2014-07-28
申请号：JP2013004546
申请日：2013-01-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YOKOYAMA AKIRA , YAMAMOTO SHUHEI , NAKAMURA SATOSHI , IKEDA KAZUTAKA
IPC分类号： H01S5/022 , G02B6/32
摘要： PROBLEM TO BE SOLVED: To provide an alignment device which can highly accurately align a cylindrical lens, a micro lens array arrayed one-dimensionally or the like with respect to a light source part emitting laser beam, and to provide an alignment method using the alignment device.SOLUTION: An alignment device 100 aligns a collimate element 11 for collimating laser beam from a light source part 10 emitting laser beam from a plurality of light-emitting points arrayed one-dimensionally, with respect to the light source part 10. The alignment device 100 includes: a screen 20 to which the laser beam emitted from the collimate element is projected; an imaging device 21 which captures a plurality of images of the projected laser beam; a control part 22 which generates a control signal for alignment by analyzing the shapes of the plurality of captured images; and a movable part 13 which adjusts a relative position and a relative angle between the light source part and the collimate element in accordance with the control signal. The alignment method includes a process for rotating the collimate element in a plane along an emission end surface of the light source part so as to separate the images which are projected to the screen and overlapped with each other.
摘要翻译：要解决的问题：提供一种可以高精度对准柱面透镜的对准装置，相对于发射激光束的光源部分一维等排列的微透镜阵列，并提供使用该对准的对准方法装置。解决方案：对准装置100对齐准直元件11，用于对来自相对于光源部分10一维排列的多个发光点发射激光束的光源部分10的激光束进行准直。对准装置100包括：投影从准直元件发射的激光束的屏幕20; 捕获投影激光束的多个图像的成像装置21; 控制部22，其通过分析多个拍摄图像的形状来生成用于对准的控制信号; 以及可动部13，其根据控制信号调整光源部和准直元件之间的相对位置和相对角度。对准方法包括用于沿着光源部的发射端面在平面内旋转准直元件以分离投射到屏幕并彼此重叠的图像的处理。

2. 发明专利

JP2010087139A Hermetic terminal 审中-公开
标题翻译： HERMETIC TERMINAL
公开(公告)号：JP2010087139A
公开(公告)日：2010-04-15
申请号：JP2008253193
申请日：2008-09-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NANBA TOMOYO , NAKAMURA SATOSHI , YOSHIHARA TORU
IPC分类号： H01L23/06 , H01L23/02 , H01R9/16
CPC分类号： H01R13/521 , H01R13/03 , H01R13/405
摘要： PROBLEM TO BE SOLVED: To solve the problem, wherein an optical semiconductor element requiring operation stability is often packaged hermetically to suppress deterioration of characteristics such as output signal variation caused by the external environment, or the like, and to provide an airtight terminal capable of keeping airtightness, even when a large current flows, which is difficult in a conventional hermetic sealed packaging.
SOLUTION: An airtight terminal has a package base, a glass material provided inside the package base, and a lead pin provided to penetrate through the glass material and is made of a copper-tungsten-based alloy.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题为了解决这样的问题，其中需要操作稳定性的光学半导体元件通常被密封地封装，以抑制诸如由外部环境引起的输出信号变化等的特性的劣化，并提供气密甚至在大电流流过时也能够保持气密，这在传统的气密密封包装中是困难的。解决方案：气密端子具有封装基座，设置在封装基座内部的玻璃材料和设置成穿过玻璃材料并由铜 - 钨基合金制成的引脚。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2004284480A System and method for train detection and communication 有权
公开(公告)号：JP2004284480A
公开(公告)日：2004-10-14
申请号：JP2003078505
申请日：2003-03-20
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： INOMATA KENJI , OCHIAI OSAMU , NAKAMURA SATOSHI
IPC分类号： B61L1/18 , B61L3/08 , B61L23/16 , H04B1/707 , H04B1/7075 , H04J13/16
摘要： PROBLEM TO BE SOLVED: To enhance transmission efficiency and communication quality in a train detection and communication system. SOLUTION: A signal transmitter 1 divides the transmission data by an S/P converter 102 into code words of a predetermined bit length, and converts each code word into a first fixed-length diffusive code by a code converter 103. A code generator 105 circulates a second diffusive code of the code length longer than the first code length synchronously with the first diffusive code, and these signals are combined in a combiner 107 with the predetermined differential power by a level regulator 106, and the generated transmission signal is fed to a rail Ra. A train detector 2 detects the second diffusive code from the reception signal, extracts the first diffusive code based on the synchronous timing, and converts the extracted first diffusive code to the transmission data. COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004125604A Intruder and obstacle detection device 有权
标题翻译：入侵者和障碍物检测装置
公开(公告)号：JP2004125604A
公开(公告)日：2004-04-22
申请号：JP2002289975
申请日：2002-10-02
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKAMURA SATOSHI
IPC分类号： B61L23/00 , G01S13/06
摘要： PROBLEM TO BE SOLVED: To specify the position of an intruder or an obstacle on a plane bounded by leakage cables by specifying not only the distance in the laying direction of the leakage cables but also the distance in the perpendicular direction to the leakage cables, by utilizing a delay time of radio propagation on a route blocked by the intruder or the obstacle bounded by the pair of leakage cables.
SOLUTION: The distance of the intruder or the obstacle in the perpendicular direction from the leakage cables is specified by utilizing the difference of a delay time measured in each frequency with background information wherein the radiation angle of a radio wave emitted from the leakage cable is changed by a frequency change. Otherwise, the distance of the intruder or the obstacle in the perpendicular direction from the leakage cables is specified by utilizing the difference of the delay time by replacing the leakage cables on the transmission side and on the reception side. Not only the distance to the intruder or the obstacle in the laying direction of the leakage cables but also the distance in the perpendicular direction are specified, to thereby enable to specify the planar position bounded by the leakage cables.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过指定泄漏电缆的铺设方向上的距离，以及垂直方向与泄漏电缆的距离来指定入侵者或障碍物在由漏电线限定的平面上的位置电缆通过利用由入侵者阻挡的路线上的无线电传播的延迟时间或由一对泄漏电缆限定的障碍物。
解决方案：通过利用每个频率测量的延迟时间的差异与背景信息来规定入侵者或障碍物在垂直方向上距泄漏电缆的距离，其中从泄漏发射的无线电波的辐射角电缆由频率变化而改变。否则，通过更换发射侧和接收侧的泄漏电缆，通过利用延迟时间的差异来规定入侵者或障碍物在与漏电缆垂直的方向上的距离。规定了泄漏电缆的铺设方向上的入侵者或障碍物的距离以及垂直方向上的距离，从而能够指定由泄漏电缆限定的平面位置。版权所有（C）2004，JPO

5. 发明专利

JP2003066110A Apparatus and method for testing high frequency module 审中-公开
标题翻译：用于测试高频模块的装置和方法
公开(公告)号：JP2003066110A
公开(公告)日：2003-03-05
申请号：JP2001259645
申请日：2001-08-29
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NAKAMURA SATOSHI , HASEGAWA KAZUYOSHI , YAMAUCHI YASUHIRO , TOKASHIKI NAOTAKA , OKAMURA MASAMITSU
IPC分类号： G01R1/06 , G01R31/28
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for testing a high frequency module for a stable inspection even if the height of the high frequency module varies.
SOLUTION: The testing apparatus that brings a high frequency probe into contact with the surface of the high frequency module for testing comprises a test stage having the high frequency module where a shield pin and a signal pin are fixed, a base section for placing the high frequency module, and a contact section connected to the shield potential, and a means for adjusting the distance from the upper surface of the base section to the upper surface of the contact section corresponding to the thickness of the high frequency module.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：即使高频模块的高度变化，提供用于测试高频模块以进行稳定检查的装置和方法。解决方案：将高频探头与高频模块表面接触以进行测试的测试装置包括具有固定屏蔽引脚和信号引脚的高频模块的测试平台，用于放置高频模块的基座部分频率模块和连接到屏蔽电位的接触部分，以及用于根据高频模块的厚度调整从基部的上表面到接触部分的上表面的距离的装置。

6. 发明专利

JP2014013856A Mounting method and mounting apparatus of chip 审中-公开
标题翻译：芯片的安装方法和安装方法
公开(公告)号：JP2014013856A
公开(公告)日：2014-01-23
申请号：JP2012151160
申请日：2012-07-05
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IKEDA KAZUTAKA , NAKAMURA SATOSHI
IPC分类号： H01L21/52 , H01L33/48
摘要： PROBLEM TO BE SOLVED: To equalize thicknesses of an adhesive of each chip and reduce variations in the adhesive thickness between multiple chips in a method for mounting the multiple chips on a long substrate in an aligned manner.SOLUTION: A mounting method for mounting chips on a substrate includes the steps of: (a) placing the substrate on a flat stage; (b) moving the substrate in a direction perpendicular to a surface of the substrate and holding the substrate so that chip mounting positions of the substrate are arranged parallel with a surface of the stage; (c) applying an adhesive to the chip mounting positions; (d) moving the chips in a direction perpendicular to the surface of the stage and placing the chips on the adhesive.
摘要翻译：要解决的问题：为了平衡每个芯片的粘合剂的厚度，并且减少多个芯片之间的粘合剂厚度的变化，以便将多个芯片以对准方式安装在长基板上的方法。解决方案：用于将芯片安装在基板包括以下步骤：（a）将基板放置在平台上; （b）在垂直于基板的表面的方向上移动基板并保持基板，使得基板的芯片安装位置平行于载物台的表面布置; （c）将粘合剂施加到芯片安装位置; （d）将芯片沿垂直于工作台表面的方向移动，并将芯片放置在粘合剂上。

7. 发明专利

JP2013004824A Led lighting device and method for manufacturing led lighting device 审中-公开
标题翻译： LED照明装置及制造LED照明装置的方法
公开(公告)号：JP2013004824A
公开(公告)日：2013-01-07
申请号：JP2011135865
申请日：2011-06-20
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IKEDA KAZUTAKA , NAKAMURA SATOSHI
IPC分类号： H01L33/62 , F21V19/00 , F21V29/00 , F21Y101/02 , H01L33/64
CPC分类号： H01L24/32 , H01L2224/27013 , H01L2224/48091 , H01L2224/73265 , H01L2924/07802 , H01L2924/12041 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an LED lighting device capable of improving heat dissipation from an LED chip.SOLUTION: In an LED lighting device 1, an LED chip 1 is housed in an LED mounting concavity 2a formed on a metal plate 2 and adhesively fixed to the LED mounting concavity 2a via adhesive resin 3, the adhesive resin 3 is filled between a rear surface opposing to a light emitting surface of the LED chip 1 and a bottom part 41 of the LED mounting concavity 2a and also filled so as to fill gaps between chip side faces 52 of the LED chip 1 and bottom side faces 42 of the LED mounting concavity 2a, the chip side faces 52 of the LED chip 1 are thermally connected to the metal plate 2 via the adhesive resin 3 and heat is effectively radiated because a heat radiation area of the LED chip 1 increases.
摘要翻译：要解决的问题：提供能够改善LED芯片散热的LED照明装置。解决方案：在LED照明装置1中，LED芯片1容纳在形成在金属板2上的LED安装凹部2a中，并且通过粘合树脂3粘合地固定到LED安装凹部2a，粘合树脂3被填充在与LED芯片1的发光面相对的后表面与LED安装凹部2a的底部41之间，并填充以填充LED芯片1的芯片侧面52和底部侧面42之间的间隙 LED芯片1的芯片侧面52的LED安装凹部2a经由粘合树脂3与金属板2热连接，由于LED芯片1的散热面积增加，因此有效地散热。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2009018344A Substrate machining method 有权
标题翻译：基板加工方法
公开(公告)号：JP2009018344A
公开(公告)日：2009-01-29
申请号：JP2008100288
申请日：2008-04-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ONO KATSUMI , FUNAOKA KOJI , NAKAMURA SATOSHI
IPC分类号： B23K26/38 , B23K26/00 , B23K26/06 , B23K26/40 , B28D5/02 , C03B33/09
CPC分类号： B23K26/0057 , B23K26/0006 , B23K26/0738 , B23K2203/52 , B23K2203/56
摘要： PROBLEM TO BE SOLVED: To provide a substrate machining method capable of forming cracks at high accuracy while preventing the generation of foreign matter. SOLUTION: The substrate machining method is used for forming cracks on a substrate by irradiating the substrate comprising brittle material transparent to machining light with the machining light. A convergence location 9 of the machining light 7 is set in the vicinity of the surface of the substrate 1, i.e. in the area inner than the surface 10 of the substrate 1 and closer to the surface side than the thickness center of the substrate 1. Further, in the convergence location 9, the machining light 7 sets the magnification of a converging optical system so as to have the linear convergence distribution 11 having the long axis roughly parallel to the surface 10 of the substrate 1. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够在防止异物产生的同时高精度地形成裂纹的基板加工方法。解决方案：使用基板加工方法，通过用加工光照射包含对加工光透明的脆性材料的基板，在基板上形成裂纹。加工用光7的会聚位置9被设定在基板1的表面附近，即位于比基板1的表面10更靠近基板1的厚度中心的表面侧的区域内。此外，在会聚位置9中，加工用光7设定会聚光学系统的放大率，使得具有与基板1的表面10大致平行的长轴的线性会聚分布11.权利要求（ C）2009年，JPO＆INPIT

9. 发明专利

JP2009010015A Lead pin mounting structure 有权
标题翻译：引脚安装结构
公开(公告)号：JP2009010015A
公开(公告)日：2009-01-15
申请号：JP2007167716
申请日：2007-06-26
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MURAKAMI MASAAKI , NAKAMURA SATOSHI , FUKUDA KEIICHI , NANBA TOMOYO , OE SHINICHI
IPC分类号： H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a lead pin mounting structure which readily enhances the reliability, after mounting, even when the lead pin in which a large current flows is mounted. SOLUTION: When lead pins 3a-3d are mounted on a mounting board 1, on which a heat generating element 23 is mounted, a through-hole 1a is provided in the mounting board, a heat dissipating member 7, connected to the mounting board via a spacer 11, is arranged on the side opposite to the mounting surface on which the heat generating element is mounted of the mounting board; the rise in the temperature of the lead pin is suppressed by diffusing the heat to the periphery, even when a relatively large amount of Joule heat is generated in the lead pin, by connecting one end of each lead pin and allowing the through-hole to penetrate the board and solder 9 which connects the lead pin and the heat dissipating member 7 is prevented from being remelting, caused by the rise in the temperature of the lead pin. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使安装有大电流流过的引脚，也可以获得安装后容易提高可靠性的引脚安装结构。解决方案：当引脚3a-3d安装在安装有发热元件23的安装板1上时，在安装板上设置有通孔1a，散热构件7连接到安装板通过间隔件11布置在与安装板安装有发热元件的安装表面相对的一侧上; 即使当在引脚中产生相对大量的焦耳热时，通过连接每个引脚的一端并允许通孔连接到引线引脚的温度上升，渗透板，防止引线引脚和散热构件7连接的焊料9由于引脚的温度升高而引起再熔化。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2008304761A Optical fiber coupler 有权
标题翻译：光纤耦合器
公开(公告)号：JP2008304761A
公开(公告)日：2008-12-18
申请号：JP2007152671
申请日：2007-06-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KITAGAKI SHUNICHI , FUKUDA KEIICHI , NAKAMURA SATOSHI , OKAMURA MASAMITSU , SASAKURA HISAYASU
IPC分类号： G02B6/287 , G02B6/28
摘要： PROBLEM TO BE SOLVED: To provide an optical fiber coupler in which the reliability as an optical fiber coupler is preserved against the variation in environmental temperature. SOLUTION: The optical coupler is provided with a fiber fixing member 2 which is fixed on both ends of a protection tube 1 of the optical fiber coupler and has a stretched part 21 which stretches in the protection tube toward the central part of the protection tube. The fiber fixing member 2 is made of a material having a larger linear thermal expansion coefficient than that of the protection tube 1. A seal material 3 is applied to the fiber fixing member 2 at a position close to the end part 4b of a base member 4 to which an optical fiber 7 is fixed. The seal material 3 holds the optical fiber stretching from the base member 4 to the outside of the protection tube and seals the protection tube to keep air tight. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种光纤耦合器，其中作为光纤耦合器的可靠性被保留以抵抗环境温度的变化。解决方案：光耦合器设置有固定在光纤耦合器的保护管1的两端的光纤固定部件2，并且具有拉伸部分21，该拉伸部分21在保护管中向中心部分延伸保护管。纤维固定部件2由比保护管1的线性热膨胀系数大的材料制成。密封材料3在靠近基部件的端部4b的位置处施加到纤维固定部件2上 4，固定有光纤7。密封材料3将从基体部件4延伸到保护管外侧的光纤保持密封，保持气密性。版权所有（C）2009，JPO＆INPIT

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