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    • 4. 发明专利
    • PLASMA CVD DEVICE
    • JPH08209349A
    • 1996-08-13
    • JP4133795
    • 1995-02-06
    • KOKUSAI ELECTRIC CO LTD
    • ADAKA SABUROOKAYAMA TOMOHIKO
    • C23C16/44C23C16/50H01L21/205
    • PURPOSE: To improve the working rate of a plasma CVD device by eliminating the need for the replacement and cleaning of a reacting gas shower plate constituting a part of an upper electrode in the plasma CVD device. CONSTITUTION: This plasma CVD device has vertically opposed electrodes 3 and 4, a reacting gas is supplied, a high-frequency power is impressed on the electrodes to produce plasma, and a thin film is formed on a substrate 13 to be treated. The upper electrode is hollowed, is provided with a shower plate 15 on the lower face of the upper electrode, the shower plate is a porous metallic plate, and the reacting gas introduced into the hollow part 8 of the upper electrode is supplied through the shower plate. The reacting gas is uniformly supplied on the entire surface of the shower plate from the micropore of the porous metallic plate, the gas is never stagnated on the lower face of the upper electrode, homogeneous plasma produced, and further, a film is not deposited on the upper electrode due to self-purification effect of the reacting gas flow. Consequently, homogenous plasma is produced, and a homogeneous thin film is formed on the substrate.
    • 8. 发明专利
    • OPTICAL INTEGRATED ELEMENT AND MANUFACTURE OF THE SAME
    • JPS61248489A
    • 1986-11-05
    • JP8855385
    • 1985-04-26
    • HITACHI LTD
    • ADAKA SABURO
    • H01L27/095H01L27/14H01L27/15H01L29/80H01S5/00H01S5/026
    • PURPOSE:To reduce a parasitic capacity and a dark current and realize a high- speed operation of an optical integrated element by a method wherein a step produced between a semiconductor laser and a photodiode and a field effect transistor is filled with SiO2. CONSTITUTION:A groove with a reverse trapezoid cross-section is formed in a semi-insulating GaAs substrate 1. An N type layer is deposited over the whole surface by liquid phase deposition and the N layer 3 is removed by etching except the part on the bottom surface in the groove. Then an I-type GaAs layer, an I-type GaAlAs window layer and an I-type GaAs cap layer are deposited by liquid phase deposition over the whole surface and etched. After SOG is applied by spin coating, a step in the semi-insulating GaAs substrate is filled by baking. Then, after the implantation of an N type layer d14 and the implantation of an N-type layer 13 are carried out by utilizing a resist 16 as a mask, positive side diffusion of a photodiode is carried out. Further, a source electrode 10, a drain electrode 11 and a negative side electrode 12 of the photodiode are deposited by a vacuum evaporation and a positive side electrode 18 and a gate electrode 9 are formed.