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1. 发明专利

JP2017186605A レーザーエッチング用銅ペースト組成物审中-公开
公开(公告)号：JP2017186605A
公开(公告)日：2017-10-12
申请号：JP2016075842
申请日：2016-04-05
申请人：日油株式会社
发明人：青島拓矢 , 高橋直志 , 園田賢作 , 澤田公平
IPC分类号： H01B1/22 , H01B1/00 , B22F1/00 , B22F1/02 , C09D17/00 , C09C1/00 , C23C30/00 , C23F4/04 , C23C26/00
摘要：【課題】塗付加熱(焼成)加工によって導電性が高い銅硬化膜が得られ、かつ、該銅硬化膜のレーザーエッチング加工時にも優れた耐酸化性を発揮して高い導電性を有する微細な銅配線を形成し得る、レーザーエッチング用銅ペースト組成物を提供する。【解決手段】式(1)のアミン化合物の第1被覆層と、該第1被覆層上に、前記アミン化合物と化学結合によって結合している脂肪族モノカルボン酸の第2被覆層とを有する表面被覆銅粒子(A)、バインダー(B)、酸化防止剤(C)、および溶剤(D)を含む銅ペースト組成物であり、(A)用の表面被覆前の原料銅粒子は、その平均粒子径D50が0.5〜2μm、および前記原料銅粒子中の粒子径3μm以上の粒子の含有量が5質量%以下である、レーザーエッチング用銅ペースト組成物とする。【化1】 [式(1)中、mは0〜3の整数、nは0〜2の整数であり、n=0のとき、mは0〜3のいずれか、n=1またはn=2のとき、mは1〜3のいずれかである。] 【選択図】なし

3. 发明专利

JP3387532B2 Trimming method and apparatus of the pressure switch 失效
公开(公告)号：JP3387532B2
公开(公告)日：2003-03-17
申请号：JP29018692
申请日：1992-10-28
申请人：セイコーインスツルメンツ株式会社
发明人：宜史吉田
IPC分类号： B23K26/00 , B23K26/12 , C23F4/04 , H01H35/34
摘要： PURPOSE:To provide the trimming method for a pressure switch with a good yield, which eliminates the need for making pressure measurement after trimming and eliminates a possibility of the trouble by excessive etching and the device therefor. CONSTITUTION:The diaphragm part 11 of the pressure switch 5 fixed in a pressure chamber 8 to which the prescribed pressure corresponding to a detecting pressure is impressed is irradiated through a transmission window 4 with the excimer laser which is outputted from a laser beam oscillation section 1 and is converted to a prescribed spot diameter by a lens 2. The pressure switch 5 turns on when the diaphragm part 11 is etched down to the thickness corresponding to the detecting pressure of the pressure switch 5 by the laser beam with which this part is irradiated. The detection signal is then inputted from a probe pressed to a pad part 12 to a control unit 10, by which the oscillation of the laser beam is stopped.

4. 发明专利

JP2002161382A PROCESSING METHOD AND PROCESSING EQUIPMENT 失效
公开(公告)号：JP2002161382A
公开(公告)日：2002-06-04
申请号：JP2000241110
申请日：2000-08-09
申请人： SEIKO EPSON CORP
发明人： UMETSU KAZUNARI , AMAKO ATSUSHI , YOSHIMURA KAZUTO
IPC分类号： C23F4/04 , C23F1/08
摘要： PROBLEM TO BE SOLVED: To provide a processing method and processing equipment, which enable a minute through-hole with a high aspect ratio to be formed on a substrate. SOLUTION: This processing method comprises forming a primary through- hole 20 in a metal substrate 10, making an etchant flow from one open side to the other open side of the primary through-hole 20, then flow from the other open side to the one open side, to etch the hole isotropically. Thereby a through- hole with the high aspect ratio can be formed.

5. 发明专利

JP2002129348A METHOD FOR FORMING ELECTRODE PATTERN BY ELECTROLESS PLATING AND METHOD FOR MANUFACTURING INK-JET HEAD 失效
公开(公告)号：JP2002129348A
公开(公告)日：2002-05-09
申请号：JP2000319129
申请日：2000-10-19
申请人： KONISHIROKU PHOTO IND
发明人： OKUNO TETSUO , AKANABE YUICHI , KIKUKAWA SHOZO
IPC分类号： B41J2/16 , C23C18/31 , C23F4/04
摘要： PROBLEM TO BE SOLVED: To provide a method for forming an electrode pattern by electroless plating, which prevents absence of plating and forms an electrode pattern of complicated configuration or a spatial electrode pattern with a three dimensional wiring, without being influenced by a range of a laser power and without giving a deleterious effect on a substrate, and to provide a method for manufacturing an ink-jet head. SOLUTION: This method for forming an electrode pattern comprises; arranging ink channels 11 of several rows in parallel on a piezoelectric substrate 1, forming a thin plated film layer 32 by electroless plating in a wider range than that of the predetermined electrode pattern 32a on the surface of the substrate 1; removing the thin plated film layer 32 by irradiating a laser beam 30 to the thin plated film layer 32 in a range other than the above predetermined electrode pattern 32a; furthermore, electroless plating the surface of the piezoelectric substrate 1 so as to make the thickness as a predetermined value; and forming the electrode pattern 32a by precipitating a metal on the thin plated layer 32 on which the above laser has not been irradiated.

6. 发明专利

JP3224443B2 失效
公开(公告)号：JP3224443B2
公开(公告)日：2001-10-29
申请号：JP2006393
申请日：1993-02-08
IPC分类号： C23C14/34 , C23C16/50 , C23C16/505 , C23F4/00 , C23F4/04 , H01L21/205 , H01L21/302 , H01L21/3065

7. 发明专利

JPH10309516A METHOD FOR REMOVING COATING BY LASER AND LASER PROCESSOR 失效
公开(公告)号：JPH10309516A
公开(公告)日：1998-11-24
申请号：JP12123697
申请日：1997-05-12
申请人： SUMITOMO HEAVY INDUSTRIES
发明人： TSUNEMI AKIRA
IPC分类号： G21F9/28 , B05D3/12 , B23K26/352 , C23F4/04 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To make it possible to remove coating films without using chemicals by having stages for irradiating the surface of a work with a laser beam, removing at least the upper layer parts of the coating films by abrasion and observing the colors of the parts irradiated with the laser of the surface. SOLUTION: The height of a condenser lens 23 is adjusted from the surface of the work 1 by a condenser lens supporting mechanism 24 to change the area of the irradiation region, by which the energy density is adjusted. The irradiation position of the laser beam 63 is swept in an X-axis direction by a height control mechanism 24 and is shifted in a Y-axis direction by a deflector 21. The position is again swept in the X-axis direction by a deflector 22. Such sweeping is repeated to remove the coating films of the certain region by the abrasion. The position of a laser irradiation head 10 is moved by driving a manipulator arm, by which the coating films over the wide region of the surface are removed. Since the surface color is observed by a color deciding device 46, whether the coating films are completely removed or not is decided.

8. 发明专利

JPH09162607A ELECTRODE TRIMMING METHOD 失效
公开(公告)号：JPH09162607A
公开(公告)日：1997-06-20
申请号：JP31416795
申请日：1995-12-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YONEDA TAKEHIKO , TODAKA HIDEYUKI , IZUMI YASUHIRO
IPC分类号： B23K26/361 , B23K26/351 , C23F4/04 , H01P7/04 , H01P11/00 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To provide an electrode trimming method with high performance and excellent in mass-productivity by preventing deterioration in the high frequency characteristic of components and circuits or the like because of high insulating resistance of an electrode trimming section in the laser trimming method capable of contactless continuous trimming SOLUTION: The trimmed part of a ceramic substrate is trimmed to a given shape by means of a laser beam while jetting a high pressure gas to the trimmed part. Then a surface alterated layer of the trimmed part of the ceramic substrate is removed by chemical etching and heat treatment is applied to the trimmed ceramic substrate in air to oxidize (3) the altered layer of the trimmed part again. An electrode oxidized layer etching (4) is conducted to remove the oxidized layer of an electrode part. Thus, continuous electrode trimming by means of laser is attained and the mass-productivity is improved.

9. 发明专利

JPH07191215A LASER MASK AND ITS PRODUCTION 失效
公开(公告)号：JPH07191215A
公开(公告)日：1995-07-28
申请号：JP34850193
申请日：1993-12-27
申请人： CANON KK
发明人： ISHIKURA ATSUMICHI , OTANI MINORU , SAWAMURA MITSUHARU
IPC分类号： G02B5/00 , B23K26/066 , C23F4/04 , G02B5/28 , G03F1/52 , G03F1/68 , B23K26/06 , G03F1/16
摘要： PURPOSE:To provide a laser mask having highly accurate pattern aperture and high laser yield strength. CONSTITUTION:First alternately multilayered reflection films 2 are formed by alternately laminating lambda/4 films 2a consisting of high-refractive index material and lambda/4 films 2b consisting of a low-refractive index material on the surface of a substrate 1 and a first spacer layer 3a consisting of a lambda/4 film of the low- refractive index material is laminated thereon. A metallic film 4 is formed thereon and is formed with the aperture 4a by etching and thereafter, the second spacer layer 3b is laminated thereon and second alternately multilayered reflection films 5 are formed thereon by alternately laminating the lambda/4 films 5a consisting of the high-refractive index material and the lambda/4 films 5b consisting of the low-refractive index material. The parts superposed on the apertures 4a of the metallic films 4 of the respective alternately multilayered reflection films 2, 5 constitute an interference filter of a Fabry-perat type having high transmittance to light of a prescribed wavelength.

10. 发明专利

JPH0710700A METHOD FOR FORMING THIN FILM AND METHOD FOR FORMING UNEVEN STRUCTURE 失效
公开(公告)号：JPH0710700A
公开(公告)日：1995-01-13
申请号：JP17250593
申请日：1993-06-18
申请人： CANON KK
发明人： ODA HITOSHI , FURUKAWA YUKIO , NAKANISHI KOICHIRO
IPC分类号： C23F4/00 , C23F4/04 , C30B23/08 , C30B25/02 , C30B28/12 , C30B28/14 , C30B33/08 , H01L21/203
摘要： PURPOSE:To provide a method for forming a membrane, capable of forming the high quality membrane prevented from the generation of twin crystal, and a method for forming an uneven structure. CONSTITUTION:When a thin film is allowed to grow on a substrate 101 heated at a proper temperature with a heater 110, electromagnetic waves 105, such as light or microwaves, specific in the vibration direction of their electric field are irradiated on a thin film-growing site. The vibration direction of the electric field of the electromagnetic waves and a specific direction among the bond axes between the film atoms and the substrate atoms are arranged parallel to each other for the dissociation of the bonds between the film atoms and the substrate atoms to prevent the generation of twin crystals. The vibration direction of the electric field of the electromagnetic waves and a specific direction among the bond axes between film atoms are also arranged parallel to each other for the dissociation of the bonds to prevent the generation of the twin crystals.

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