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1. 发明专利

JP2014160751A Printed-wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2014160751A
公开(公告)日：2014-09-04
申请号：JP2013030842
申请日：2013-02-20
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , MORITA HARUHIKO
IPC分类号： H05K1/14 , H05K1/16 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board including an inductor having high inductance.SOLUTION: A first inductor component 110 is formed on a first printed wiring board 101, and a second inductor component 310 is formed on a mother board. A printed wiring board is formed by the first and second printed wiring boards, and the first and second inductor components are connected with each other.
摘要翻译：要解决的问题：提供一种包括具有高电感的电感器的印刷线路板。解决方案：第一电感器部件110形成在第一印刷线路板101上，第二电感器部件310形成在母板上。印刷电路板由第一和第二印刷电路板形成，第一和第二电感元件彼此连接。

2. 发明专利

JP2014154813A Printed wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2014154813A
公开(公告)日：2014-08-25
申请号：JP2013025486
申请日：2013-02-13
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MORITA HARUHIKO , MANO YASUHIKO , YOSHIKAWA KAZUHIRO
IPC分类号： H05K3/46 , H05K1/16
CPC分类号： H01F17/0013 , H01F2017/0066
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having a high inductance value.SOLUTION: Coil layers 58BL, 58DL are formed on a build-up layer of a printed wiring board 10 and an inductor component is incorporated into a core substrate of the printed wiring board.
摘要翻译：要解决的问题：提供具有高电感值的印刷线路板。解决方案：线圈层58BL，58DL形成在印刷线路板10的积层上，并且电感器部件被并入到印刷线路板。

3. 发明专利

JP2014165362A Printed-wiring board 审中-公开
标题翻译：印刷线路板
公开(公告)号：JP2014165362A
公开(公告)日：2014-09-08
申请号：JP2013035689
申请日：2013-02-26
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , MORITA HARUHIKO
IPC分类号： H05K3/46 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which can supply stable electric power to IC chips.SOLUTION: A printed wiring board is formed by a first printed wiring board having a first electric circuit and a second printed wiring board having a second electric circuit. A solenoid coil is formed by the first and second electric circuits.
摘要翻译：要解决的问题：提供一种能够向IC芯片提供稳定电力的印刷线路板。解决方案：印刷电路板由具有第一电路的第一印刷线路板和具有第二电路的第二印刷线路板形成电路。螺线管线圈由第一和第二电路形成。

4. 发明专利

JP2014007339A Inductor component, method of manufacturing the same, and printed wiring board 审中-公开
标题翻译：电感元件及其制造方法和印刷电路板
公开(公告)号：JP2014007339A
公开(公告)日：2014-01-16
申请号：JP2012143230
申请日：2012-06-26
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , MORITA HARUHIKO
IPC分类号： H01F17/04 , H01F17/00 , H01F41/04
CPC分类号： H01F27/2804 , H01F27/24 , H01F41/041 , H01F2027/2809 , Y10T29/4902
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which can obtain a desired inductance amount with a thin inductor component.SOLUTION: In resin insulation layers 150A, 150C, 150E which are sandwiched by an inductor pattern, a penetration hole 170 is formed concentrically with the inductor pattern, and a cylindrical first magnetic body layer 172 is filled in the penetration hole. A second magnetic body layer 174 is covered on an inductor pattern 158G on the resin insulation layer 150E. Permeability is increased by arranging the cylindrical first magnetic body layer 172 to the center part of the inductor pattern and providing the second magnetic body layer 174 to the outside of the inductor pattern 158G. Thereby, a desired inductance amount can be obtained with a thin inductor component having a small number of layers.
摘要翻译：要解决的问题：提供一种能够用薄的电感器部件获得所需电感量的印刷线路板。解决方案：在由电感器图案夹着的树脂绝缘层150A，150C，150E中，同心地形成穿透孔170 具有电感图案，并且圆柱形的第一磁性体层172填充在穿透孔中。第二磁性体层174覆盖在树脂绝缘层150E上的电感器图案158G上。通过将圆柱形第一磁性体层172布置到电感器图案的中心部分并将第二磁性体层174提供给电感器图案158G的外部来增加渗透性。由此，可以通过具有少量层的薄电感器部件来获得期望的电感量。

5. 发明专利

JP2009194382A Production process of printed wiring board 审中-公开
公开(公告)号：JP2009194382A
公开(公告)日：2009-08-27
申请号：JP2009021490
申请日：2009-02-02
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , YOSHIKAWA KAZUHIRO , FUJII NAOAKI , YAMASHITA TAKASHIGE
IPC分类号： H05K3/46 , H05K3/00 , H05K3/42
CPC分类号： H05K1/185 , H01L24/19 , H01L24/82 , H01L2223/54426 , H01L2224/04105 , H01L2224/32225 , H01L2224/82039 , H01L2224/82047 , H01L2224/83132 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/036 , H05K1/188 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K3/4611 , H05K2201/0352 , H05K2201/09509 , H05K2201/09536 , H05K2201/0969 , H05K2201/09918 , H05K2201/10636 , Y02P70/611 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a production process of a printed wiring board which incorporates an electronic component and enhances connection reliability. SOLUTION: An IC chip 30 is mounted with reference to a positioning mark 26 formed on a single-sided copper clad laminate 20, a through-hole 36 is bored to reach the terminals 30A and 30B of the IC chip 30, and the through-hole 36 is filled with metals 38 and 40, thus providing a via hole 42 for connecting the terminals of a chip capacitor 30. Since a position gap does not arise between the terminal 30A, 30B of the chip capacitor 30 and the via hole 42, connection reliability of the via hole 42 for connecting the terminals of the chip capacitor can be enhanced. COPYRIGHT: (C)2009,JPO&INPIT

6. 发明专利

JP2014175406A Inductor part, manufacturing method of inductor part, and printed wiring board 审中-公开
标题翻译：电感器部件，电感器部件的制造方法和印刷电路板
公开(公告)号：JP2014175406A
公开(公告)日：2014-09-22
申请号：JP2013045545
申请日：2013-03-07
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , YANO TOSHIMASA , KARIYA TAKASHI
IPC分类号： H01F17/00 , H01F17/04 , H01F41/04
摘要： PROBLEM TO BE SOLVED: To provide an inductor part having good inductance property (Q value).SOLUTION: An inductor part comprises inductor patterns 158A, 158C, 158E, and 158G; magnetic material layers 174A, 174C, and 174E provided between the inductor patterns 158A, 158C, 158E, and 158G; and a dielectric film 175G through which each magnetic material layer is formed on the corresponding inductor pattern. The inductor patterns are spaced apart from the magnetic material layers by 0.5-10 μm. In inverse proportion to the square of the distance, the strength of an electromagnetic field weakens and accordingly, eddy currents arising on surfaces of the inductor patterns become smaller. Therefore, Q value of the inductor part is never deteriorated.
摘要翻译：要解决的问题：提供具有良好的电感特性（Q值）的电感部分。解决方案：电感器部分包括电感图案158A，158C，158E和158G; 设置在电感器图案158A，158C，158E和158G之间的磁性材料层174A，174C和174E; 以及在对应的电感图案上形成有各磁性体层的电介质膜175G。电感图案与磁性材料层隔开0.5-10μm。与距离的平方成反比，电磁场的强度减弱，因此在电感图案的表面上产生的涡流变小。因此，电感器部分的Q值不会变差。

7. 发明专利

JP2014041977A Electronic component and manufacturing method of the same 审中-公开
标题翻译：电子元件及其制造方法
公开(公告)号：JP2014041977A
公开(公告)日：2014-03-06
申请号：JP2012184504
申请日：2012-08-23
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： YOSHIKAWA KAZUHIRO
IPC分类号： H05K3/46 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide an electronic component capable of inhibiting disconnection of a conductor pattern at an outer peripheral part of a semiconductor element, and to provide a manufacturing method of the electronic component.SOLUTION: An electronic component 100 includes: multiple interlayer resin insulation layers 50; a wiring board 20 which has conductor patterns 58 formed on the interlayer resin insulation layers 50 and includes a first surface F and a second surface S at the opposite side of the first surface F; first bumps 76 for mounting semiconductor elements which are respectively formed on the conductive patterns of a first surface side outermost layer of the interlayer resin insulation layers 50; second bumps 77 for external substrate connection which are formed on the conductor patterns on a second surface side outermost layer of the interlayer resin insulation layers 50; and semiconductor elements 90A, 90B mounted on the wiring board through the first bumps. The semiconductor elements and a peripheral part of the wiring board are coated by a metal layer 97.
摘要翻译：要解决的问题：提供能够抑制半导体元件的外周部分处的导体图案断开的电子部件，并提供电子部件的制造方法。电子部件100包括：多层间树脂绝缘层50; 布线板20具有形成在层间树脂绝缘层50上的导体图案58，并且包括第一表面F和位于第一表面F的相对侧的第二表面S; 用于安装分别形成在层间树脂绝缘层50的第一表面最外层的导电图案上的半导体元件的第一凸块76; 形成在层间树脂绝缘层50的第二表面侧最外层的导体图案上的外部基板连接用的第二凸块77; 以及通过第一凸块安装在布线板上的半导体元件90A，90B。半导体元件和布线板的外围部分被金属层97涂覆。

8. 发明专利

JP2009194381A Production process of printed wiring board 审中-公开
标题翻译：印刷电路板的生产工艺
公开(公告)号：JP2009194381A
公开(公告)日：2009-08-27
申请号：JP2009021489
申请日：2009-02-02
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , YOSHIKAWA KAZUHIRO , FUJII NAOAKI , YAMASHITA TAKASHIGE
IPC分类号： H05K1/18 , H05K1/02 , H05K3/46
CPC分类号： H05K1/185 , H01L24/19 , H01L24/82 , H01L2223/54426 , H01L2224/04105 , H01L2224/32225 , H01L2224/82039 , H01L2224/82047 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0231 , H05K1/188 , H05K3/382 , H05K3/427 , H05K3/4602 , H05K2201/0187 , H05K2201/0209 , H05K2201/0355 , H05K2201/09509 , H05K2201/09536 , H05K2201/09781 , H05K2201/09918 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a production process of a printed wiring board which incorporates an electronic component and enhances connection reliability. SOLUTION: An IC chip 30 is mounted with reference to a positioning mark 26 formed on a single-sided copper clad laminate 20, a through-hole 36 is bored to reach the terminals 30A and 30B of the IC chip 30, and the through-hole 36 is filled with metals 38 and 40, thus providing a via hole 42 for connecting the terminals of a chip capacitor 30. Since a position gap does not arise between the terminal 30A, 30B of the chip capacitor 30 and the via hole 42, connection reliability of the via hole 42 for connecting the terminals of the chip capacitor can be enhanced. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种结合电子部件的印刷电路板的制造工艺，提高连接可靠性。解决方案：参考形成在单面覆铜层压板20上的定位标记26安装IC芯片30，通孔36被钻孔以到达IC芯片30的端子30A和30B，并且通孔36填充有金属38和40，从而提供用于连接片状电容器30的端子的通孔42.由于在片状电容器30的端子30A，30B和通孔之间没有出现位置间隙可以提高用于连接片式电容器的端子的通孔42的连接可靠性。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2014032978A Inductor component, manufacturing method of inductor component, and wiring board 审中-公开
标题翻译：电感元件，电感元器件制造方法及接线板
公开(公告)号：JP2014032978A
公开(公告)日：2014-02-20
申请号：JP2012170672
申请日：2012-07-31
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： YOSHIKAWA KAZUHIRO , MANO YASUHIKO
IPC分类号： H01F17/00 , H01F37/00 , H01F41/04 , H05K1/16 , H05K3/46
CPC分类号： H01F5/003 , H01F5/00 , H01F17/0013 , H01F41/32 , H01F2017/0066 , H05K1/165 , H05K1/185 , H05K2201/083 , H05K2201/09672 , Y10T29/4902
摘要： PROBLEM TO BE SOLVED: To secure the connection reliability of a via conductor which connects upper and lower inductor patterns while securing desired electric characteristics in an inductor component.SOLUTION: A magnetic material layer 213a for covering a first portion and a resin layer 214 for covering both the first portion and a second portion of a first inductor pattern 212a are formed on the first inductor pattern 212a. Via conductors 218a, 221a are formed in via holes provided at the resin layer 214. The via conductor 218a is formed on a first output pad 223a, and the via conductor 221a is formed on a first input pad 222a. On the resin layer 214, a second inductor pattern 212b and a lamination pad 220a are formed. The lamination pad 220a is electrically connected with the first input pad 222a by the via conductor 221a.
摘要翻译：要解决的问题：确保连接上，下电感器图形的通孔导体的连接可靠性，同时确保电感器部件中所需的电特性。解决方案：用于覆盖第一部分的磁性材料层213a和用于覆盖的树脂层214 第一电感器图案212a的第一部分和第二部分都形成在第一电感器图案212a上。通孔导体218a，221a形成在设置在树脂层214的通孔中。通孔导体218a形成在第一输出焊盘223a上，通孔导体221a形成在第一输入焊盘222a上。在树脂层214上形成第二电感器图案212b和层压垫220a。叠层垫220a由通孔导体221a与第一输入焊盘222a电连接。

10. 发明专利

JP2014022551A Printed wiring board and manufacturing method for printed wiring board 审中-公开
标题翻译：印刷布线板和印刷线路板的制造方法
公开(公告)号：JP2014022551A
公开(公告)日：2014-02-03
申请号：JP2012159571
申请日：2012-07-18
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YOSHIKAWA KAZUHIRO , KARIYA TAKASHI
IPC分类号： H05K3/46 , H05K1/16
CPC分类号： H05K1/165 , H05K1/0233 , H05K1/186 , H05K3/0032 , H05K3/30 , H05K3/4676 , H05K3/4697 , H05K2201/0209 , Y10T29/4913
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board incorporating an inductor component having a desired inductor value and electrical characteristics.SOLUTION: In an opening 50E formed in a lower build-up layer 50S, an inductor component 110 of lamination structure, laminating a coil layer and a resin insulation layer, is housed. The resin insulation layer is formed of a material different from that of the insulation layer constituting the build-up layer. Since the number of coil layers can be increased by making the resin insulation layer thinner than the insulation layer thereby increasing the number of layers, an inductor component obtaining desired inductance value, Q value can be housed in a printed wiring board.
摘要翻译：要解决的问题：提供一种包含具有期望的电感值和电特性的电感器部件的印刷线路板。解决方案：在形成在下层叠层50S的开口50E中，层叠结构的电感器部件110，线圈层和树脂绝缘层。树脂绝缘层由与构成层的绝缘层不同的材料形成。由于通过使树脂绝缘层比绝缘层薄，从而增加层的数量可以增加线圈层的数量，可以将获得所需电感值Q值的电感器部件容纳在印刷线路板中。

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