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1. 发明专利

JP2009194381A Production process of printed wiring board 审中-公开
标题翻译：印刷电路板的生产工艺
公开(公告)号：JP2009194381A
公开(公告)日：2009-08-27
申请号：JP2009021489
申请日：2009-02-02
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , YOSHIKAWA KAZUHIRO , FUJII NAOAKI , YAMASHITA TAKASHIGE
IPC分类号： H05K1/18 , H05K1/02 , H05K3/46
CPC分类号： H05K1/185 , H01L24/19 , H01L24/82 , H01L2223/54426 , H01L2224/04105 , H01L2224/32225 , H01L2224/82039 , H01L2224/82047 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0231 , H05K1/188 , H05K3/382 , H05K3/427 , H05K3/4602 , H05K2201/0187 , H05K2201/0209 , H05K2201/0355 , H05K2201/09509 , H05K2201/09536 , H05K2201/09781 , H05K2201/09918 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a production process of a printed wiring board which incorporates an electronic component and enhances connection reliability. SOLUTION: An IC chip 30 is mounted with reference to a positioning mark 26 formed on a single-sided copper clad laminate 20, a through-hole 36 is bored to reach the terminals 30A and 30B of the IC chip 30, and the through-hole 36 is filled with metals 38 and 40, thus providing a via hole 42 for connecting the terminals of a chip capacitor 30. Since a position gap does not arise between the terminal 30A, 30B of the chip capacitor 30 and the via hole 42, connection reliability of the via hole 42 for connecting the terminals of the chip capacitor can be enhanced. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种结合电子部件的印刷电路板的制造工艺，提高连接可靠性。解决方案：参考形成在单面覆铜层压板20上的定位标记26安装IC芯片30，通孔36被钻孔以到达IC芯片30的端子30A和30B，并且通孔36填充有金属38和40，从而提供用于连接片状电容器30的端子的通孔42.由于在片状电容器30的端子30A，30B和通孔之间没有出现位置间隙可以提高用于连接片式电容器的端子的通孔42的连接可靠性。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2009194382A Production process of printed wiring board 审中-公开
公开(公告)号：JP2009194382A
公开(公告)日：2009-08-27
申请号：JP2009021490
申请日：2009-02-02
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , YOSHIKAWA KAZUHIRO , FUJII NAOAKI , YAMASHITA TAKASHIGE
IPC分类号： H05K3/46 , H05K3/00 , H05K3/42
CPC分类号： H05K1/185 , H01L24/19 , H01L24/82 , H01L2223/54426 , H01L2224/04105 , H01L2224/32225 , H01L2224/82039 , H01L2224/82047 , H01L2224/83132 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/036 , H05K1/188 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K3/4611 , H05K2201/0352 , H05K2201/09509 , H05K2201/09536 , H05K2201/0969 , H05K2201/09918 , H05K2201/10636 , Y02P70/611 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a production process of a printed wiring board which incorporates an electronic component and enhances connection reliability. SOLUTION: An IC chip 30 is mounted with reference to a positioning mark 26 formed on a single-sided copper clad laminate 20, a through-hole 36 is bored to reach the terminals 30A and 30B of the IC chip 30, and the through-hole 36 is filled with metals 38 and 40, thus providing a via hole 42 for connecting the terminals of a chip capacitor 30. Since a position gap does not arise between the terminal 30A, 30B of the chip capacitor 30 and the via hole 42, connection reliability of the via hole 42 for connecting the terminals of the chip capacitor can be enhanced. COPYRIGHT: (C)2009,JPO&INPIT

3. 发明专利

JP2011114039A Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2011114039A
公开(公告)日：2011-06-09
申请号：JP2009266869
申请日：2009-11-24
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TSUKADA KIYOTAKA , MURAKI TETSUYA , YAMASHITA TAKASHIGE , TOMITA YOSHITOMO
IPC分类号： H01L23/12 , H01L21/3205 , H01L23/52
CPC分类号： H01L23/49827 , H01L21/486 , H01L24/01 , H01L2224/32225 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/351 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having a large allowable current, and also to provide a method for manufacturing the semiconductor device. SOLUTION: The semiconductor device 101 is equipped with: a support plate 30, a semiconductor element 10 (IGBT chip), and conductor posts 40 each made of a columnar conductor and having a first end portion on one end and a second end portion 42a on the other end. On the support plate 30, a plurality of holes 30b are formed, and conductors 33 are formed on the wall surfaces of the holes 30b respectively. The second end portion 42a of each of the conductor posts 40 is connected to electrodes 12-14 of the semiconductor element 10 via the conductive materials 72a-72c. The side surfaces of the conductor post 40 are fixed to the wall surfaces (conductors 33) of the holes 30b deformed by a pressure of the conductor post 40 on a side closer to a first end portion than the second end portion 42a. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供具有大的容许电流的半导体器件，并且还提供一种用于制造半导体器件的方法。解决方案：半导体器件101配备有：支撑板30，半导体元件10（IGBT芯片）和导体柱40，每个导体柱由柱状导体制成，并且在一端具有第一端部，第二端另一端的部分42a。在支撑板30上形成有多个孔30b，并且分别在孔30b的壁表面上形成导体33。每个导体柱40的第二端部42a经由导电材料72a-72c连接到半导体元件10的电极12-14。导体柱40的侧表面固定在孔30b的壁表面（导体33）上，该壁表面（导体33）在靠近比第二端部42a的第一端部更靠近导体柱40的压力下变形。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011114040A Semiconductor device and method for manufacturing the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2011114040A
公开(公告)日：2011-06-09
申请号：JP2009266872
申请日：2009-11-24
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TSUKADA KIYOTAKA , MURAKI TETSUYA , YAMASHITA TAKASHIGE , TOMITA YOSHITOMO
IPC分类号： H01L21/60 , H01L23/48
CPC分类号： H01L23/49827 , H01L21/4853 , H01L23/36 , H01L23/492 , H01L23/49811 , H01L23/49844 , H01L23/49866 , H01L24/01 , H01L2224/32225 , H01L2224/45124 , H01L2924/00014 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/351 , H01L2924/00 , H01L2224/48
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability for a long-term heat cycle even if a difference in thermal expansion ratio between a support plate and a heat dissipation plate is large and deformation or warpage easily occurs at end portions, and also to provide a method for manufacturing the semiconductor device. SOLUTION: The semiconductor device 101 is equipped with: a support plate 30, a semiconductor element 10 (IGBT chip), and conductor posts 40 each made of a columnar conductor and having a first end portion on one end and a second end portion 42a on the other end. The second end portion 42a of a conductor post 40 is connected to the semiconductor element 10. The conductor posts 40 are connected to the support plate 30 on a side closer to the first end portion than the second end portion 42a. The heat transfer rate of the conductor post 40 is ≥200 W/m K and the Vickers hardness of the conductor post 40 is ≤70. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：即使支撑板和散热板之间的热膨胀比的差异大，在长期热循环中也具有高可靠性的半导体器件，并且在结束时容易发生变形或翘曲部分，并且还提供用于制造半导体器件的方法。解决方案：半导体器件101配备有：支撑板30，半导体元件10（IGBT芯片）和导体柱40，每个导体柱由柱状导体制成，并且在一端具有第一端部，第二端另一端的部分42a。导体柱40的第二端部42a连接到半导体元件10.导体柱40在比第二端部42a更靠近第一端部的一侧连接到支撑板30。导体柱40的传热率≥200W/ m K，导体柱40的维氏硬度≤70。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2009188401A Printed circuit board with built-in capacitor 审中-公开
标题翻译：具有内置电容器的印刷电路板
公开(公告)号：JP2009188401A
公开(公告)日：2009-08-20
申请号：JP2009015019
申请日：2009-01-27
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： MANO YASUHIKO , YAMASHITA TAKASHIGE , TSUCHIYA YOSHITAKE , KARIYA TAKASHI
IPC分类号： H05K3/46 , H01G4/38 , H05K1/16
CPC分类号： H05K1/162 , H05K3/0044 , H05K3/4644 , H05K3/4652 , H05K2201/0209 , H05K2201/09509 , H05K2201/09763 , H05K2201/09845 , H05K2203/025 , H05K2203/1476
摘要： PROBLEM TO BE SOLVED: To provide a novel printed circuit board with built-in capacitor capable of solving several problems about the conventional printed circuit boards with built-in capacitor. SOLUTION: In the printed circuit board with built-in capacitor, the capacitor has a dielectric, one electrode with a relatively smaller area in comparison with that of the dielectric, and another electrode with the relatively larger area in comparison with that of the dielectric. COPYRIGHT: (C)2009,JPO&INPIT

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