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1. 发明专利

JP2009194381A Production process of printed wiring board 审中-公开
标题翻译：印刷电路板的生产工艺
公开(公告)号：JP2009194381A
公开(公告)日：2009-08-27
申请号：JP2009021489
申请日：2009-02-02
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , YOSHIKAWA KAZUHIRO , FUJII NAOAKI , YAMASHITA TAKASHIGE
IPC分类号： H05K1/18 , H05K1/02 , H05K3/46
CPC分类号： H05K1/185 , H01L24/19 , H01L24/82 , H01L2223/54426 , H01L2224/04105 , H01L2224/32225 , H01L2224/82039 , H01L2224/82047 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0231 , H05K1/188 , H05K3/382 , H05K3/427 , H05K3/4602 , H05K2201/0187 , H05K2201/0209 , H05K2201/0355 , H05K2201/09509 , H05K2201/09536 , H05K2201/09781 , H05K2201/09918 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a production process of a printed wiring board which incorporates an electronic component and enhances connection reliability. SOLUTION: An IC chip 30 is mounted with reference to a positioning mark 26 formed on a single-sided copper clad laminate 20, a through-hole 36 is bored to reach the terminals 30A and 30B of the IC chip 30, and the through-hole 36 is filled with metals 38 and 40, thus providing a via hole 42 for connecting the terminals of a chip capacitor 30. Since a position gap does not arise between the terminal 30A, 30B of the chip capacitor 30 and the via hole 42, connection reliability of the via hole 42 for connecting the terminals of the chip capacitor can be enhanced. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种结合电子部件的印刷电路板的制造工艺，提高连接可靠性。解决方案：参考形成在单面覆铜层压板20上的定位标记26安装IC芯片30，通孔36被钻孔以到达IC芯片30的端子30A和30B，并且通孔36填充有金属38和40，从而提供用于连接片状电容器30的端子的通孔42.由于在片状电容器30的端子30A，30B和通孔之间没有出现位置间隙可以提高用于连接片式电容器的端子的通孔42的连接可靠性。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2005284159A Optical fiber array 审中-公开
标题翻译：光纤阵列
公开(公告)号：JP2005284159A
公开(公告)日：2005-10-13
申请号：JP2004100874
申请日：2004-03-30
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , FUJII NAOAKI
IPC分类号： G02B6/24
摘要： PROBLEM TO BE SOLVED: To provide an optical fiber array with which excellent transmission characteristics are maintained.
SOLUTION: The optical fiber array 10 is provided with a substrate 30 on which storage grooves 34 which stores an optical fiber 24 are formed, a cover plate 12 which covers the optical fiber 24 stored in the storage grooves 34 and an adhesive layer which joins the substrate 30 on which the optical fiber 24 is stored in the storage grooves 34 and the cover plate 12. When length from a rear end part 12a of the cover plate 12 to a pulling part 23a of an optical fiber ribbon 20 is considered as X and length of the cover plate 12 is considered as Y, Y≤3X and within a range of X≤5Y. A bending angle θ formed by a line which connects from a center of the optical fiber 24 at the pulling part 23a to a center of the optical fiber 24 at the rear end part 12a of the cover plate 12 and a center axis of the optical fiber 24 stored in the storage grooves 34 is considered as 6° or less. In the optical fiber array 10 constituted as such, stress to the cover plate 12 and the adhesive layer 16 applied by the optical fiber 24 is reduced.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供保持优良传输特性的光纤阵列。解决方案：光纤阵列10设置有基板30，其上形成有存储光纤24的存储槽34，覆盖存储在存储槽34中的光纤24的盖板12和粘合层其将光纤24存储在其中的基板30接合在存储槽34和盖板12中。当考虑从盖板12的后端部分12a到光纤带20的拉动部分23a的长度因为X和盖板12的长度被认为是Y，Y≤3X并且在X≤5Y的范围内。由在拉动部23a处的光纤24的中心与盖板12的后端部12a的光纤24的中心连接的线形成的弯曲角度θ和光纤的中心轴 24被存储在存储槽34中被认为是6°或更小。在这样构成的光纤阵列10中，减小了通过光纤24施加的对盖板12和粘合剂层16的应力。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2005284158A Optical fiber array 审中-公开
标题翻译：光纤阵列
公开(公告)号：JP2005284158A
公开(公告)日：2005-10-13
申请号：JP2004100873
申请日：2004-03-30
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , FUJII NAOAKI
IPC分类号： G02B6/40
摘要： PROBLEM TO BE SOLVED: To reduce the warping of a substrate of optical fiber array and to maintain excellent transmission characteristics.
SOLUTION: The optical fiber array 10 is provided with the substrate 30 on which the storage grooves 34 for storing an optical fiber 24 are formed, a cover plate 12 which covers the optical fiber 24 stored in the storage grooves 34 and an adhesive layer 16 which joins the substrate 30 on which the optical fiber 24 in the storage grooves 34 and the cover plate 12. When depth of the storage grooves 34 is considered as L1 and length from the bottom part of the storage devices 34 to the bottom part of the substrate 30 is considered as L2, 3≤L2/L1≤15 is satisfied. The substrate 30 is formed with width of 5mm or more. The storage grooves 34 are formed within a range of 50% or more of the substrate 30 and 17 or more storage device 34 are formed on the substrate 30. In addition, ratio L1/R between the depth L1 and the storage grooves 34 and radius R of the optical fiber 24 is within a range of 0.8 to 1.6 and L2 is within a range of 300 to 150μm. In this optical fiber array 10, the warping of the substrate 30 is reduced.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了减少光纤阵列的基板的翘曲并保持优异的传输特性。解决方案：光纤阵列10设置有基板30，其上形成有用于存储光纤24的存储槽34，覆盖存储在存储槽34中的光纤24的盖板12和粘合剂其与存储槽34中的光纤24和盖板12连接的基板30.当存储槽34的深度被认为是L1并且从存储装置34的底部到底部的长度将基板30视为L2，满足3≤L2/L1≤15。基板30形成为5mm以上的宽度。存储槽34形成在基板30的50％以上的范围内，并且在基板30上形成有17个以上的存储装置34.此外，深度L1和存储槽34之间的比率L1 / R和半径光纤24的R在0.8〜1.6的范围内，L2在300〜150μm的范围内。在该光纤阵列10中，基板30的翘曲变小。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2013214577A Wiring board and manufacturing method of the same 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2013214577A
公开(公告)日：2013-10-17
申请号：JP2012083287
申请日：2012-03-30
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： FUJII NAOAKI
IPC分类号： H05K3/46 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To inhibit projection of a reinforcement fiber from an insulation layer including the reinforcement fiber.SOLUTION: A wiring board manufacturing method comprises: preparing a core substrate 20 having a first surface F1 and a second surface opposite to the first surface F1; preparing a multilayered structure layer 13a composed of a first insulation layer 11 which at least includes a reinforcement fiber and a second insulation layer 12 which is formed in an upper layer than the first insulation layer 11 and includes a second resin having a glass-transition temperature higher than that of a first resin which composes the first insulation layer 11; forming a first conductor pattern on the first surface F1 of the core substrate 20; and laminating the multilayered structure layer 13a on the first surface F1 of the core substrate 20 so as to cause a first insulation layer 11 to be formed on the first surface F1 of the core substrate 20 and on the first conductor pattern. A heating temperature at the time of laminating the multilayered structure layer 13a on the core substrate 20 is lower than the glass-transition temperature of the second resin and higher than the glass-transition temperature of the first resin.
摘要翻译：要解决的问题：抑制加强纤维从包括增强纤维的绝缘层的突出。解决方案：一种布线板的制造方法，包括：制备具有第一表面F1和与第一表面F1相对的第二表面的芯基板20 ; 制备由至少包括增强纤维的第一绝缘层11和形成在第一绝缘层11的上层中的第二绝缘层12构成的多层结构层13a，并且包括具有玻璃化转变温度高于构成第一绝缘层11的第一树脂; 在芯基板20的第一表面F1上形成第一导体图案; 并且在芯基板20的第一表面F1上层叠多层结构层13a，以在芯基板20的第一表面F1上和第一导体图案上形成第一绝缘层11。在芯基板20上层叠多层结构层13a时的加热温度低于第二树脂的玻璃化转变温度，高于第一树脂的玻璃化转变温度。

5. 发明专利

JP2005284157A Optical fiber array 审中-公开
标题翻译：光纤阵列
公开(公告)号：JP2005284157A
公开(公告)日：2005-10-13
申请号：JP2004100872
申请日：2004-03-30
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , FUJII NAOAKI
IPC分类号： G02B6/40 , G02B6/24 , G02B6/36
CPC分类号： G02B6/3636 , G02B6/3652 , G02B6/3668 , G02B6/3692 , G02B6/3861 , G02B6/3885
摘要： PROBLEM TO BE SOLVED: To maintain excellent transmission characteristics of an optical fiber array.
SOLUTION: The optical fiber array 10 is provided with a substrate 30 on which storage grooves 34 for storing an optical fiber 24 are formed, a cover plate 12 which covers the optical fiber 24 stored in the storage grooves 34 and an adhesive layer 16 which joins the substrate 30 on which the optical fiber 24 is stored in the storage grooves 34 and the cover plate 12. Adhesive grooves 36 in which the adhesive layer 16 enters from the storage grooves 34 for storing the optical fiber 24 to an end part of the substrate 30 are formed on the substrate 30. The adhesive grooves 36 are formed approximately in the V shape at cross section and formed approximately in parallel with the storage grooves 34. In addition, the adhesive grooves 36 are formed near an outermost storage groove 34a (an adhesive groove 36a) and near an end part of the substrate 30 (adhesive groove 36b) among the storage groove 34. It is desirable to form at least one adhesive groove 36 from the outermost storage groove 34a to the end part of the substrate 30 and a plurality of adhesive grooves are also formed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：保持光纤阵列的良好的传输特性。解决方案：光纤阵列10设置有基板30，在基板30上形成用于存储光纤24的存储槽34，覆盖存储在存储槽34中的光纤24的盖板12和粘合层 16，其连接有光纤24存储在存储槽34和盖板12中的基板30.粘合剂层16从用于将光纤24存储到端部的存储槽34中进入的粘合槽36 基板30形成在基板30上。粘合剂槽36在截面上形成为大致V字状，并且与存储槽34大致平行地形成。此外，粘合剂槽36形成在最外侧的存储槽 34a（粘合槽36a），并且在存储槽34中的基板30（粘合槽36b）的端部附近。期望从最外侧的存储槽34a形成至少一个粘合槽36 到基板30的端部，并且还形成多个粘合槽。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2009194382A Production process of printed wiring board 审中-公开
公开(公告)号：JP2009194382A
公开(公告)日：2009-08-27
申请号：JP2009021490
申请日：2009-02-02
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , YOSHIKAWA KAZUHIRO , FUJII NAOAKI , YAMASHITA TAKASHIGE
IPC分类号： H05K3/46 , H05K3/00 , H05K3/42
CPC分类号： H05K1/185 , H01L24/19 , H01L24/82 , H01L2223/54426 , H01L2224/04105 , H01L2224/32225 , H01L2224/82039 , H01L2224/82047 , H01L2224/83132 , H01L2224/92144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/036 , H05K1/188 , H05K3/426 , H05K3/427 , H05K3/4602 , H05K3/4611 , H05K2201/0352 , H05K2201/09509 , H05K2201/09536 , H05K2201/0969 , H05K2201/09918 , H05K2201/10636 , Y02P70/611 , Y10T29/49117 , Y10T29/4913 , Y10T29/49133 , Y10T29/49146 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a production process of a printed wiring board which incorporates an electronic component and enhances connection reliability. SOLUTION: An IC chip 30 is mounted with reference to a positioning mark 26 formed on a single-sided copper clad laminate 20, a through-hole 36 is bored to reach the terminals 30A and 30B of the IC chip 30, and the through-hole 36 is filled with metals 38 and 40, thus providing a via hole 42 for connecting the terminals of a chip capacitor 30. Since a position gap does not arise between the terminal 30A, 30B of the chip capacitor 30 and the via hole 42, connection reliability of the via hole 42 for connecting the terminals of the chip capacitor can be enhanced. COPYRIGHT: (C)2009,JPO&INPIT

7. 发明专利

JP2005284160A Optical fiber array and its manufacturing method 审中-公开
标题翻译：光纤阵列及其制造方法
公开(公告)号：JP2005284160A
公开(公告)日：2005-10-13
申请号：JP2004100875
申请日：2004-03-30
申请人： Ibiden Co Ltd , イビデン株式会社
发明人： TANAKA HIRONORI , FUJII NAOAKI
IPC分类号： G02B6/24
摘要： PROBLEM TO BE SOLVED: To provide an optical fiber array and its manufacturing method with which arrangement pitch is made even and excellent transmission characteristics are maintained.
SOLUTION: In the optical fiber array 10, a cut part 25 whose binding part 23 is cut so that optical fibers 24 at end parts of mutually adjacent optical fiber ribbons 20 become predetermined arrangement pitch is formed in the optical fiber ribbons 20. The optical fiber ribbons 20 on which the cut parts 25 are formed are mounted adjacent to a mounting part 32 of the substrate 30 so that the cut parts 25 of each other are joined, the optical fibers 24 are approximately straightly drawn from the optical fiber ribbons 20 and stored in the storage grooves 34 with the predetermined arrangement pitch. The cutting part 25 is formed on a biding part 23 of a part mounted on the mounting part 32 by cutting the binding part 23 to a covered part 22 formed on the periphery of the optical fiber 24 at an end part. In addition, the optical fiber ribbons 20 may be mounted at one stage and may be mounted at two stages.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种均匀设置间距的光纤阵列及其制造方法，并且保持良好的传输特性。解决方案：在光纤阵列10中，在光纤带20中形成有切割部分25，其切割部分23被切割，使得在相互邻近的光纤带20的端部处的光纤24成为预定的排列间距。其上形成有切割部分25的光纤带20安装在基板30的安装部分32附近，使得彼此的切割部分25接合，光纤24几乎从光纤带 20并以预定的排列间距存储在存储槽34中。切割部25通过将装订部23切割成在端部形成在光纤24的周围的被覆部22而形成在安装在安装部32上的部分的搭接部23上。此外，光纤带20可以安装在一个阶段，并且可以分两个阶段安装。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2003114359A METHOD FOR PROCESSING OPTICAL FIBER RIBBON, LAMINATED OPTICAL FIBER RIBBON, AND METHOD FOR MANUFACTURING OPTICAL FIBER ARRAY 审中-公开
公开(公告)号：JP2003114359A
公开(公告)日：2003-04-18
申请号：JP2001268089
申请日：2001-09-04
申请人： IBIDEN CO LTD
发明人： HAYASHI KOTARO , FUJII NAOAKI
IPC分类号： G02B6/44 , C03C25/10 , G02B6/24 , G02B6/36
摘要： PROBLEM TO BE SOLVED: To provide a layered optical fiber ribbon in which optical fibers are arranged in parallel in a high density with a short distance between adjacent optical fibers so that the optical fibers are hardly misaligned in the axial direction and that the fiber ribbon is easily handled. SOLUTION: In the layered optical fiber ribbon, a first optical fiber ribbon with the coating resin layer in one end removed to expose a part of the optical fibers is stacked on a second optical fiber ribbon with a part of the coating resin layer except for both ends removed to expose a part of the optical fibers in such a manner that the exposed optical fibers of the first optical fiber ribbon are arranged among the exposed optical fibers of the second optical fiber ribbon.

9. 发明专利

JP2003114352A OPTICAL FIBER ARRAY 审中-公开
公开(公告)号：JP2003114352A
公开(公告)日：2003-04-18
申请号：JP2001298093
申请日：2001-09-27
申请人： IBIDEN CO LTD
发明人： HAYASHI KOTARO , FUJII NAOAKI
IPC分类号： G02B6/24 , C09J4/06
摘要： PROBLEM TO BE SOLVED: To provide such an optical fiber array that, since optical fibers are surely fixed to grooves formed on a substrate with a UV-curing adhesive, displacement of the optical fibers does not occur and optical signals can be accurately transmitted even when the optical fiber array is connected to optical devices or external force is added to the optical fiber array. SOLUTION: The optical fiber array, in which a plurality of grooves are formed in a part on a substrate and optical fibers are housed in the grooves with an adhesive, is characterized in that the adhesive is an epoxy-based or acrylate-based UV-curing adhesive.

10. 发明专利

JP2003114362A OPTICAL FIBER ARRAY 审中-公开
公开(公告)号：JP2003114362A
公开(公告)日：2003-04-18
申请号：JP2001336923
申请日：2001-11-01
申请人： IBIDEN CO LTD
发明人： HAYASHI KOTARO , FUJII NAOAKI
IPC分类号： G02B6/40
摘要： PROBLEM TO BE SOLVED: To provide such an optical fiber array that, since optical fibers are surely fixed to grooves formed on a substrate with a UV-curing adhesive, the displacement of the optical fibers does not occur and optical signals can be accurately transmitted even when the optical fiber array is connected to optical devices or external force is added to the optical fiber array. SOLUTION: The optical fiber array is composed of a substrate having a plurality of grooves and a holding part of a coating resin layer formed on its upper surface and of an optical fiber ribbon having a plurality of coated optical fibers arranged in parallel and a coating resin layer formed around the fibers. The coated optical fibers are fixed to the grooves with an adhesive and the coated optical fibers and the coating resin layer are fixed with the adhesive to the holding part of the coating resin layer. The adhesive is a hardened product of an epoxy-based or acrylate-based UV-curing resin composition.

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