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1. 发明专利

JP2012053035A System and method for attaching inertial sensor 审中-公开
标题翻译：连接传感器的系统和方法
公开(公告)号：JP2012053035A
公开(公告)日：2012-03-15
申请号：JP2011165518
申请日：2011-07-28
申请人： Honeywell Internatl Inc , ハネウェル・インターナショナル・インコーポレーテッド
发明人： ESKRIDGE MARK
IPC分类号： G01P15/08 , B81B7/02 , B81C3/00 , G01C19/5783 , G01P15/18 , H01L29/84
CPC分类号： G01P1/023 , B81B7/0074 , B81B2201/0235 , B81B2201/025 , G01C19/5783 , G01P15/0802 , G01P15/18 , H01L2224/16225 , H01L2924/1461 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a system and method for attaching an inertial sensor on a plate.SOLUTION: A sensor package includes substrate layers 32 and 34, a sensor layer 24, insulation layers 26 and 28 disposed between the sensor layer 24 and the substrate layers 32 and 34, and a V groove formed in the substrate layers 32 and 34 by anisotropic etching. The substrate layers 32 and 34 are in 100 crystal face orientation. Thereafter, the sensor package is removed from a wafer, and the surface of the substrate layer 32 or 34 formed by the etching is attached to the plate. In one embodiment, three sensor packages are attached to the plate so that their detection axes are perpendicular to each other.
摘要翻译：要解决的问题：提供一种将惯性传感器附接在板上的系统和方法。解决方案：传感器封装包括衬底层32和34，传感器层24，设置在传感器层24和衬底层32和34之间的绝缘层26和28以及形成在衬底层32和34中的V沟槽 34通过各向异性蚀刻。衬底层32和34处于100晶面取向。此后，将传感器封装从晶片上移除，并且通过蚀刻形成的基板层32或34的表面附接到板上。在一个实施例中，三个传感器封装件附接到板，使得它们的检测轴线彼此垂直。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2013173221A System and method for conductive pillar 审中-公开
标题翻译：导电支柱系统和方法
公开(公告)号：JP2013173221A
公开(公告)日：2013-09-05
申请号：JP2013006371
申请日：2013-01-17
申请人： Honeywell Internatl Inc , ハネウェル・インターナショナル・インコーポレーテッド
发明人： ESKRIDGE MARK , MILNE JAMES CHRISTOPHER
IPC分类号： B81B7/02
CPC分类号： B81B7/007 , B81B2207/093
摘要： PROBLEM TO BE SOLVED: To provide a system and method for conductive pillar of a MEMS device in a flip-chip packaging.SOLUTION: A packaged die 100 bonded to an electrical board includes a substrate layer 102 having a recessed area 112, a conductive trace 104 of which a part is formed in the recessed area, and an epitaxial device layer 106 bonded to the substrate layer. A part of a MEMS device layer includes a MEMS device arranged on the recessed area, and at least one epitaxial conductive pillar 108. A first side of the at least one epitaxial conductive pillar is electrically connected to the conductive trace and the second side of the epitaxial conductive pillar is electrically connected to the electrical board. The at least one epitaxial conductive pillar extends through the epitaxial device layer to electrically couple the conductive trace to an interface surface on the epitaxial device layer.
摘要翻译：要解决的问题：提供一种用于倒装芯片封装的MEMS器件的导电柱的系统和方法。解决方案：结合到电路板的封装管芯100包括具有凹陷区域112的基底层102，导电迹线其中一部分形成在凹陷区域中，并且外延装置层106结合到基底层。 MEMS器件层的一部分包括布置在凹陷区域上的MEMS器件和至少一个外延导电柱108.至少一个外延导电柱的第一侧电连接到导电迹线，并且第二侧外延导电柱电连接到电路板。至少一个外延导电柱延伸穿过外延器件层，以将导电迹线电耦合到外延器件层上的界面表面。

3. 发明专利

JP2014004681A Anodically bonded strain isolator 审中-公开
标题翻译：阳离子粘结分离器
公开(公告)号：JP2014004681A
公开(公告)日：2014-01-16
申请号：JP2013129309
申请日：2013-06-20
申请人： Honeywell Internatl Inc , ハネウェル・インターナショナル・インコーポレーテッド
发明人： ESKRIDGE MARK , ZHOU SHIFANG
IPC分类号： B81B7/02 , G01P15/08 , H01L29/84
CPC分类号： B81B7/0051
摘要： PROBLEM TO BE SOLVED: To provide a stress isolator that allows a sensor to be attached to materials of the same coefficient of thermal expansion and still realizes required elastic isolation between the sensor and a system to which the sensor is mounted.SOLUTION: The isolator is made of two materials, borosilicate glass and silicon. The glass is the same material as a mounting surface of microelectromechanical system (MEMS) sensors. The silicon makes an excellent isolator, being very elastic and easy to form into complex shapes. The two materials of the isolator are joined using an anodic bond. The structure of the isolator can be specific to different types of MEMS sensors, the most of their geometry capable of reducing the overall volume.
摘要翻译：要解决的问题：提供一种应力隔离器，其允许将传感器附接到相同热膨胀系数的材料，并且仍然实现传感器与安装传感器的系统之间所需的弹性隔离。解决方案：隔离器由两种材料制成，硼硅酸盐玻璃和硅。该玻璃与微机电系统（MEMS）传感器的安装表面相同。硅是一种优秀的隔离器，非常有弹性，易于形成复杂的形状。隔离器的两种材料使用阳极键连接。隔离器的结构可以针对不同类型的MEMS传感器，其大部分几何能够减小总体积。

4. 发明专利

JP2011104767A Silicon tab edge mount for a wafer level package 审中-公开
标题翻译：硅胶边缘安装用于水平包装
公开(公告)号：JP2011104767A
公开(公告)日：2011-06-02
申请号：JP2010249590
申请日：2010-11-08
申请人： Honeywell Internatl Inc , ハネウェル・インターナショナル・インコーポレーテッド
发明人： ESKRIDGE MARK
IPC分类号： B81B7/02
CPC分类号： B81B7/007 , B81B7/0074 , B81B2207/097
摘要： PROBLEM TO BE SOLVED: To provide a downsized package for sealing micro-electromechanical systems (MEMS). SOLUTION: The Micro-ElectroMechanical Systems (MEMS) 30 are sealed by being sandwiched by a first glass plate 24 and a second glass plate 26. Electrical connections 34, 36 are available at an edge of the MEMS and connected to bumps 42-1, 42-2 provided on a side face of the glass plate. The first glass plate 24 and the second glass plate 26 are sealed by a seal 32. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供用于密封微机电系统（MEMS）的小型封装。解决方案：微电子机械系统（MEMS）30通过被第一玻璃板24和第二玻璃板26夹在中间而被密封。电连接件34,36在MEMS的边缘处可用，并连接到凸块42 -1,42-2设置在玻璃板的侧面上。第一玻璃板24和第二玻璃板26由密封件32密封。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2011040745A Suspended lead-frame electronic package 审中-公开
标题翻译：悬挂铅框电子包装
公开(公告)号：JP2011040745A
公开(公告)日：2011-02-24
申请号：JP2010177497
申请日：2010-08-06
申请人： Honeywell Internatl Inc , ハネウェル・インターナショナル・インコーポレーテッド
发明人： ESKRIDGE MARK
IPC分类号： H01L23/12 , H01L23/34
CPC分类号： H01L23/041 , B81B7/0048 , H01L23/49572 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and a method for packaging an electronic device that mechanically isolates the electronic device from its supporting substrate, eliminating transmission of mechanical stress from the substrate to the device.
SOLUTION: The apparatus includes a plurality of elongated members that extend from a frame 14 support 18 to a center opening, where the ends of the elongated members together support the electronic device. The shape, material and orientation of the elongated members combine to both support the electronic device 12 and absorb mechanical force transmitted from the substrate to the support frame. In one embodiment, the absorbing portion is substantially perpendicular to the direction of the transmitted force and the transmitted force is absorbed by mechanical displacement of one end of the perpendicular portion. The apparatus and method eliminate the negative effects of thermal stress mismatch between the electronic device and its supporting substrate.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于封装电子装置的装置和方法，该电子装置将电子装置与其支撑基板机械地隔离，消除了从基板到装置的机械应力的传递。解决方案：该装置包括从框架14支撑件18延伸到中心开口的多个细长构件，其中细长构件的端部一起支撑电子装置。细长构件的形状，材料和取向结合在一起以支撑电子装置12并吸收从衬底传递到支撑框架的机械力。在一个实施例中，吸收部分基本上垂直于透射力的方向，并且透射的力被垂直部分的一端的机械位移吸收。该装置和方法消除了电子器件与其支撑衬底之间的热应力失配的负面影响。版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2010105153A Mems device and method for assembling microelectromechanical system (mems) 审中-公开
标题翻译：用于组装微电子系统（MEMS）的MEMS器件和方法
公开(公告)号：JP2010105153A
公开(公告)日：2010-05-13
申请号：JP2009245586
申请日：2009-10-26
申请人： Honeywell Internatl Inc , ハネウェル・インターナショナル・インコーポレーテッド
发明人： ESKRIDGE MARK , MAGENDANZ GALEN
IPC分类号： B81B1/00 , B81C3/00
CPC分类号： B81C3/004 , B81C2203/051 , H01L24/11 , H01L2924/00014 , H01L2924/1461 , Y10S438/975 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide a MEMS device and a method for correctly assembling a microelectromechanical system (MEMS). SOLUTION: The MEMS die includes a pattern-formed metal layer 104 having bumps 108 and a MEMS composition element 106 mounted to a glass layer 102. One or a plurality of reference features arranged on or inside the glass layer can be optically detected by using a window 112 manufactured or formed in the metal layer. By using this, the glass layer 102 having the MEMS composition element and the metal layer 104 having the bumps 108 can be correctly positioned and assembled. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于正确组装微机电系统（MEMS）的MEMS装置和方法。解决方案：MEMS管芯包括具有凸起108的图案形成的金属层104和安装到玻璃层102的MEMS组成元件106.可以光学地检测布置在玻璃层上或内部的一个或多个参考特征通过使用在金属层中制造或形成的窗口112。通过这样，具有MEMS组成元件的玻璃层102和具有凸块108的金属层104可以被正确地定位和组装。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2013191847A Controlled area solder bonding for dies 审中-公开
标题翻译：控制区域焊接工具
公开(公告)号：JP2013191847A
公开(公告)日：2013-09-26
申请号：JP2013048932
申请日：2013-03-12
申请人： Honeywell Internatl Inc , ハネウェル・インターナショナル・インコーポレーテッド
发明人： ESKRIDGE MARK
IPC分类号： H01L21/52 , H01L21/60
CPC分类号： H01L24/83 , B81B7/0048 , B81C1/00095 , H01L24/29 , H01L24/32 , H01L2224/26175 , H01L2224/27013 , H01L2224/32014 , H01L2224/32055 , H01L2224/32225 , H01L2224/73204 , H01L2224/83101 , H01L2224/83136 , H01L2224/83192 , H01L2224/92125 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/1461 , H01S5/02272 , H01L2924/0105 , H01L2924/01079 , H01L2924/01014 , H01L2924/01032 , H01L2224/16225 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for solder bonding which accurately controls a bonding area, a thickness and a shape etc. to reduce die stress.SOLUTION: A method of fabricating a semiconductor comprises: forming a plurality of stud bumps in a pattern having a geometrical shape on a surface of a substrate, the pattern defining a periphery of a bonding area on the surface of the substrate 118; and placing a solder material 120 in the bonding area such that the solder material 120 is surrounded by the stud bumps 110. The solder material is heated to a temperature where the solder material begins to flow within the bonding area. A bonding surface of a die 130 is pressed onto the stud bumps with a sufficient pressure to crush the stud bumps to a predetermined extent such that the solder material substantially evenly spreads between the stud bumps within the bonding area. The solder material is then solidified to form a final solder area that conforms to the geometrical shape of the pattern of stud bumps.
摘要翻译：要解决的问题：提供一种用于焊接接合的方法，其精确地控制接合面积，厚度和形状等以减小模具应力。解决方案：制造半导体的方法包括：以图案形成多个柱状凸块在基板的表面上具有几何形状，该图案限定了基板118的表面上的接合区域的周边; 并且将焊料材料120放置在接合区域中，使得焊料材料120被柱形突起110包围。焊料材料被加热到焊料材料在接合区域内开始流动的温度。模具130的接合表面以足够的压力压在柱形凸块上，以将凸起凸起压碎到预定的程度，使得焊料材料基本上均匀地铺展在接合区域内的凸块凸块之间。然后将焊料材料固化以形成符合螺柱凸起图案的几何形状的最终焊料区域。

8. 发明专利

JP2009154288A Mechanical isolation for mems device 有权
标题翻译： MEMS器件的机械隔离
公开(公告)号：JP2009154288A
公开(公告)日：2009-07-16
申请号：JP2008327692
申请日：2008-12-24
申请人： Honeywell Internatl Inc , ハネウェル・インターナショナル・インコーポレーテッド
发明人： FOSTER MICHAEL , JAFRI IJAZ , ESKRIDGE MARK , ZHOU SHIFANG
IPC分类号： B81B3/00 , B81C3/00
CPC分类号： B81B7/0048 , B81B2207/012 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide mechanical isolation for a device since a MEMS (Micro Electro Mechanical System) is often attached to an other structure to measure inertial force received by a structure, the directly attached MEMS device is exposed to stress applied by the structure and thereby the MEMS device generates an inaccurate measured value. SOLUTION: A device 10 includes the MEMS device supported on a first side of a die 22. A first side of an isolator 14 is mounted on the first side of the die 22. A package 12 is attached to the first side of the isolator 14. At least an electrically conductive attachment device 26 attaches the die 22 to the isolator 14 and attaches the isolator 14 to the package 12. The isolator 14 may include an isolation structure 16 and a receptacle 17. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了为器件提供机械隔离，因为MEMS（微电机械系统）通常附接到另一结构以测量由结构接收的惯性力，直接附接的MEMS器件暴露于施加的应力通过该结构，由此MEMS器件产生不准确的测量值。解决方案：装置10包括支撑在模具22的第一侧上的MEMS装置。隔离器14的第一侧安装在模具22的第一侧上。封装12附接到模具22的第一侧。至少一个导电的附接装置26将管芯22连接到隔离器14并将隔离器14附接到封装12.隔离器14可以包括隔离结构16和插座17.版权：（ C）2009年，JPO＆INPIT

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