专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

2. 发明专利

JP2010052086A Semiconductor device and method for manufacturing the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2010052086A
公开(公告)日：2010-03-11
申请号：JP2008218941
申请日：2008-08-28
申请人： Oki Semiconductor Co Ltd , Okiセミコンダクタ株式会社
发明人： OZAWA NOBUO
IPC分类号： B81C3/00 , B81B3/00 , H01L21/301 , H01L23/02
CPC分类号： B81C1/00325 , B81B7/0051 , B81C2203/0109 , B81C2203/019 , B81C2203/032
摘要： PROBLEM TO BE SOLVED: To provide a structure of a semiconductor device in which a characteristic change of an MEMS element is restrained, and a method for manufacturing the semiconductor device.
SOLUTION: The semiconductor device 90 includes a semiconductor chip 20b provided with a switch element structure 10a and a step 30b formed to surround the switch element structure 10a on a surface, and a sealing cap 60b fixed to the step 30b with an adhesive 70a and formed to cover the switch element structure 10a. The step 30b has a bottom face and side faces. The step 30b and the sealing cap 60b are joined at the bottom face and the side faces of the step 30b and the sealing cap 60b, and a silicone based resin is used as the adhesive 70a.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供其中限制了MEMS元件的特性变化的半导体器件的结构以及制造半导体器件的方法。解决方案：半导体器件90包括设置有开关元件结构10a的半导体芯片20b和形成为在表面上包围开关元件结构10a的台阶30b，以及用粘合剂固定到台阶30b的密封帽60b 70a并形成为覆盖开关元件结构10a。台阶30b具有底面和侧面。步骤30b和密封帽60b在台阶30b和密封帽60b的底面和侧面接合，并且使用硅酮树脂作为粘合剂70a。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP5880683B2 電子部品素子およびそれを備えた複合モジュール有权
标题翻译：电子部件元件和包括该复合模块
公开(公告)号：JP5880683B2
公开(公告)日：2016-03-09
申请号：JP2014500152
申请日：2013-01-28
申请人：株式会社村田製作所
发明人：竹村忠治
IPC分类号： H01L23/02 , H01L23/04 , H01L23/28 , H03H9/25
CPC分类号： H01L41/0533 , B81B7/0051 , H01L23/3121 , H01L23/3128 , H03H9/1071 , H01L23/3677 , H01L2924/0002

4. 发明专利

JP2015096843A 物理量測定センサ有权
标题翻译：物理量测量传感器
公开(公告)号：JP2015096843A
公开(公告)日：2015-05-21
申请号：JP2013237398
申请日：2013-11-15
申请人：長野計器株式会社
发明人：今井敦 , 松村亮一
IPC分类号： H01L23/02 , B81B7/02 , G01L19/14 , H01L29/84 , G01L9/00
CPC分类号： B81B7/0051 , G01L19/0084 , G01L19/143 , G01L19/147 , B81B2201/0264 , H01H59/0009 , H01L2224/48091 , H01L29/0665 , H01L29/0673 , H01L29/84 , H01L2924/19105
摘要：【課題】高圧測定が可能な物理量測定センサを提供すること。【解決手段】被測定流体を流通する流通孔31Aが板部31に形成されたセラミック製のパッケージ3Bと、このパッケージ3Bに収納され流通孔31Aから流通された被測定流体の圧力を検出する検出素子41を含む電子部品4と、パッケージ3Bの外部に設けられた端子部5と、パッケージ3Bの壁部32に接合された蓋体6Bと、パッケージ3Bを被取付部材2に取り付ける金属製の取付片7とを備え、この取付片7で、パッケージ3Bを押さえるとともに被取付部材2を係止する。【選択図】図6
摘要翻译：要解决的问题：提供能够进行高压测量的物理量测量传感器。解决方案：物理量测量传感器包括：陶瓷封装3B，其包括循环孔31A，测量对象流体通过循环孔31A循环并形成在板上第31部分; 包括存储在包装3B中的检测元件41并检测从循环孔31A循环的测量对象物流的压力的电子部件4; 设置在封装3B外部的端子部5; 与主体3B的壁部32接合的盖体6B; 以及将包装3B附接到安装构件2的金属配件件7.配件件7按压包装3B并锁定安装件2。

5. 发明专利

JP2008118585A Electronic component for surface mounting 审中-公开
标题翻译：电子元件表面安装
公开(公告)号：JP2008118585A
公开(公告)日：2008-05-22
申请号：JP2006302258
申请日：2006-11-08
申请人： Nippon Dempa Kogyo Co Ltd , 日本電波工業株式会社
发明人： YAMADA HIROAKI
IPC分类号： H03H9/02 , H01L23/04 , H01L23/08
CPC分类号： H05K3/3442 , B81B7/0051 , B81B2207/07 , H01L23/49838 , H01L2224/16225 , H03H9/02102 , H03H9/02133 , H03H9/1021 , H05K1/0243 , H05K2201/068 , H05K2201/10068 , H05K2201/10909 , Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide an electronic component of an external terminal structure wherein soldering crack is prevented.
SOLUTION: The electronic component for surface mounting has a surface mounting substrate made of ceramics, and an external terminal provided on an external bottom surface of the surface mounting substrate, primarily consisting of Ni. The electronic component is comprised by connecting the external terminal to a set substrate by soldering, wherein a Young's modulus, an expansion rate and a sectional area of the ceramics are E1, α1 and A1, the Young's modulus, the expansion rate and the sectional area of the Ni are E2, α2 and A2, and a synthetic expansion rate αx is increased by 2.9-21.6% from the expansion rate α1 of the ceramics when the synthetic expansion rate αx of the ceramics and the Ni is satisfied by a formula (1): αx=(E1×α1×A1+E2×α2×A2)/(E1×A1+E2×A2).
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种防止焊接裂纹的外部端子结构的电子部件。解决方案：用于表面安装的电子部件具有由陶瓷制成的表面安装基板和设置在主要由Ni构成的表面安装基板的外部底面上的外部端子。电子部件通过焊接将外部端子连接到固定基板上，其中，陶瓷的杨氏模量，膨胀率和截面积为E1，α1和A1，杨氏模量，膨胀率和截面积的Ni是E2，α2和A2，当陶瓷和Ni的合成膨胀率αx满足公式（1）时，合成膨胀率αx从陶瓷的膨胀率α1增加2.9-21.6％）：αx=（E1×α1×A1 + E2×α2×A2）/（E1×A1 + E2×A2）。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2006145610A Package for housing optical component 审中-公开
标题翻译：住房光学元件的包装
公开(公告)号：JP2006145610A
公开(公告)日：2006-06-08
申请号：JP2004331855
申请日：2004-11-16
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： ODA TAKUYA , OHASHI TATSUSUKE
IPC分类号： G02B26/08 , H01L23/02
CPC分类号： B81B7/0051 , B81C2203/0109 , B81C2203/0145
摘要： PROBLEM TO BE SOLVED: To make it possible for a package for housing an optical component to mount the optical component therein with sufficient airtightness by securing flatness of a flange part of a metallic cap in bonding the metallic cap to a package body by seam welding even when chips of the optical component and the metallic cap are upsized.
SOLUTION: In the package for housing the optical component provided with a substrate (10) having a component mounting part where the optical component (12) is mounted on the upper surface, a metallic frame (30) fixed on the upper surface of the substrate around the component mounting part, and the metallic cap (40) which keeps a glass window (24) airtight in the center part and has a flange part (44) bonded to the metallic frame at its periphery by thermo-compression bonding, and which airtightly houses the optical component inside, the flange part (44) of the metallic cap (40) comprises a stress absorbing part (46) inside the part bonded to the metallic frame (30).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了使得用于容纳光学部件的包装件可以通过固定金属盖的凸缘部分的平坦度来将金属盖接合到包装体的方式将包含主体的光学部件安装在其中以具有足够的气密性即使当光学部件和金属盖的芯片变大时，也可进行缝焊。解决方案：在用于容纳设置有基板（10）的光学部件的封装中，所述基板具有安装在上表面上的光学部件（12）的部件安装部，固定在上表面上的金属框架（30）和金属盖（40），其将玻璃窗（24）气密地保持在中心部分，并且具有通过热压粘合在其周边处接合到金属框架的凸缘部分（44），并且其内部密封地容纳光学部件，金属盖（40）的凸缘部（44）包括在与金属框架（30）接合的部分内的应力吸收部（46）。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2008193581A Piezoelectric vibrator, and manufacturing method thereof 审中-公开
标题翻译：压电振动器及其制造方法
公开(公告)号：JP2008193581A
公开(公告)日：2008-08-21
申请号：JP2007028045
申请日：2007-02-07
申请人： Epson Toyocom Corp , エプソントヨコム株式会社
发明人： ISHIKAWA KAZUO , TONEGAWA YUKIHIRO , HARA AKITOSHI
IPC分类号： H03H9/02 , H01L23/02 , H03H3/02
CPC分类号： B81B7/0051
摘要： PROBLEM TO BE SOLVED: To provide a piezoelectric vibrator and a manufacturing method thereof such that a lid is prevented from breaking and/or cracking and the lid and a package are joined with a small width to prevent a wax material from spreading.
SOLUTION: A piezoelectric vibrator has a bottom portion 62 where a piezoelectric vibration chip 1 is fixed and a frame wall portion 64 enclosing the bottom portion 62, and has the package 60 having an opening above the bottom portion 62. The lid 72 overlaps the bottom portion 62 and frame wall portion 64 to close the opening of the package 60. The wax material 78 is interposed between an upper end surface 66 of the frame wall portion 64 and the lid 72 to join the frame wall portion 64 and lid 72. The upper end surface 66 is made of metal. The lid 72 is characterized in that at least portion of a region 82 opposed to the upper end surface 66 is made of metal and a leak prevention region 80 which comprises a surface made of oxide or an organic substance and one of frame-shaped projection and recess surfaces made of metal and prevents wet spreading of a fused solder material 78 is formed on a sealing space side inside at least the opposed region 82.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种压电振动器及其制造方法，以防止盖子破裂和/或破裂，并且盖子和包装件以小的宽度接合以防止蜡材料扩散。解决方案：压电振动器具有固定有压电振动芯片1的底部62和封闭底部62的框架壁部64，并且具有在底部62上方的开口的封装60。盖72 与底部62和框架壁部分64重叠以封闭包装件60的开口。蜡材料78介于框架壁部分64的上端表面66和盖子72之间，以将框架壁部分64和盖子上端面66由金属制成。盖72的特征在于，与上端面66相对的区域82的至少一部分由金属制成，防漏区域80包括由氧化物或有机物质构成的表面和框状突起之一，至少在相对区域82内的密封空间侧形成由金属制成的凹陷表面并防止熔融焊料78的湿扩展。（C）2008，JPO＆INPIT

8. 发明专利

JP2006247833A Mems element package and its manufacturing method 审中-公开
标题翻译： MEMS元件封装及其制造方法
公开(公告)号：JP2006247833A
公开(公告)日：2006-09-21
申请号：JP2006060445
申请日：2006-03-07
申请人： Samsung Electronics Co Ltd , 三星電子株式会社Samsung Electronics Co.,Ltd.
发明人： KIM JONG-SEOK , KIM DUCK-HWAN , NAM KUANG-WOO , PARK YUN-KWON , YUN SEOK-CHUL , CHOA SUNG-HOON , SO INSO
IPC分类号： B81B3/00 , H01L23/02
CPC分类号： B81B7/0051 , B81B7/007
摘要： PROBLEM TO BE SOLVED: To provide MEMS (micro-electro mechanical system) element package having stable action and high reliability.
SOLUTION: The MEMS element package includes an element substrate 100 formed with MEMS active element 100 on one surface; a multiple sealing pad 200 for providing an electric route of the MEMS active element and surrounding the MEMS active element in multiple in order to protect the MEMS active element from the outside; a cap substrate 300 bonded to the element substrate through the multiple sealing pad and formed with a via hole 320 at a trench 310 where the MEMS active element is positioned and a portion where the multiple sealing pad is positioned; and an external electrode pad 400 formed on one surface of the cap substrate so as to form electrical connection with the multiple sealing pad through the via hole.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有稳定动作和高可靠性的MEMS（微机电系统）元件封装。解决方案：MEMS元件封装包括在一个表面上形成有MEMS有源元件100的元件基板100; 用于提供MEMS有源元件的电路径并围绕MEMS有源元件多个的多重密封垫200，以便将MEMS有源元件从外部保护; 盖基板300通过多个密封垫接合到元件基板，并在MEMS活性元件所在的沟槽310处形成有通孔320和多个密封垫所在的部分; 以及形成在盖基板的一个表面上以通过通孔与多个密封垫形成电连接的外部电极焊盘400。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005210131A Packaging method and structure of semiconductor chip 审中-公开
标题翻译：半导体芯片的包装方法和结构
公开(公告)号：JP2005210131A
公开(公告)日：2005-08-04
申请号：JP2005015924
申请日：2005-01-24
申请人： Robert Bosch Gmbh , ローベルトボツシユゲゼルシヤフトミツトベシユレンクテルハフツングRobert Bosch Gmbh
发明人： WEIBLEN KURT , BENZEL HUBERT , PINTER STEFAN DR , GUENSCHEL ROLAND , HAAG FRIEDER
IPC分类号： H01L23/02 , B81B3/00 , B81B7/00 , B81C1/00 , B81C3/00 , G01L9/00 , G01P1/02 , H01L21/50 , H01L21/52 , H01L21/56 , H01L21/60
CPC分类号： B81B7/0051 , B81C2203/0154 , G01L19/141 , G01P1/023 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/0102 , H01L2924/01068 , H01L2924/01079 , H01L2924/15151 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To improve the packaging method of a semiconductor chip.
SOLUTION: The packaging method comprises the steps of preparing the semiconductor chip 5 equipped with a diaphragm region 55, forming a cap 10 above the diaphragm region 55 so as to expose the diaphragm region 55, setting the semiconductor chip 5 to a support frame 1, and mounting a mould case 20 at the periphery of the semiconductor chip 5 and at least the subregion of the support frame 1 so as to package the semiconductor chip 5.
COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2005077349A Acceleration sensor 审中-公开
标题翻译：加速传感器
公开(公告)号：JP2005077349A
公开(公告)日：2005-03-24
申请号：JP2003311066
申请日：2003-09-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMAGUCHI YASUO , NAKAMURA KUNIHIRO
IPC分类号： B81B7/00 , G01P1/02 , G01P15/08 , G01P15/125 , H01L29/84
CPC分类号： B81B7/0051 , B81B2201/0235 , B81C2203/0109 , G01P1/026 , G01P15/0802 , G01P15/125 , G01P2015/0814
摘要： PROBLEM TO BE SOLVED: To attain a miniaturization of a dimension of an acceleration sensor concerning a direction of a semiconductor substrate major face by inhibiting a propagation of a crack by an external force.
SOLUTION: The acceleration sensor 2 comprises the semiconductor substrate 6, a frame 8 surrounding the acceleration sensor element 3 and the acceleration sensor element 3 which are arranged on the semiconductor substrate 6, the intermediate layers 34, 36 arranged on the frame 8, and a cap 5 which performs a sealing of the acceleration sensor element 3 connecting with the intermediate layers 34, 36. In each of the frame 8 and the intermediate layers 34, 36, a frame-like groove is formed nearly the same position relating to the major face of the semiconductor substrate 6. Therefore, the frame-like groove 38 is prepared as a whole.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过抑制由外力引起的裂纹的传播，来实现关于半导体衬底主面的方向的加速度传感器的尺寸的小型化。解决方案：加速度传感器2包括半导体基板6，围绕加速度传感器元件3的框架8和布置在半导体基板6上的加速度传感器元件3，布置在框架8上的中间层34,36 以及进行与中间层34,36连接的加速度传感器元件3的密封的盖5.在框架8和中间层34,36中的每一个中，框状的槽形成为几乎相同的位置到半导体基板6的主面。因此，整体地制作框状槽38。版权所有（C）2005，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式