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1. 发明专利

JP2005002487A Method for producing nonwoven fabric for electric insulation, method for producing prepreg, laminate and printed circuit board 审中-公开
标题翻译：用于生产用于电绝缘的非织造织物的方法，用于生产PREPREG，层压和印刷电路板的方法
公开(公告)号：JP2005002487A
公开(公告)日：2005-01-06
申请号：JP2003165121
申请日：2003-06-10
申请人： Hitachi Ltd , Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社 , 株式会社日立製作所
发明人： GOTO HIROICHI , HIRAOKA KOICHI , MOGI AKIRA , SUZUKI MASAHIRO , NAGAI AKIRA
IPC分类号： B29B15/10 , D04H1/4342 , D04H1/549 , D06M13/278 , D06M13/477 , D06M23/00 , D06M101/36 , H05K1/03 , D04H1/42 , D04H1/54
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a printed circuit board having an aramid fiber-containing nonwoven fabric for electric insulation as the substrate of a thermosetting resin insulated layer, by which the adhesiveness of the aramid fibers to the thermosetting resin can be improved.
SOLUTION: This method for producing the nonwoven fabric for the electric insulation is characterized by immersing a nonwoven fabric which contains para type aramid fibers as main fibers and binds the fibers to each other with a thermally fusible fibers, in an organic solvent to dissolve a part of the thermally fusible fibers. The method for producing the prepreg is characterized by holding an epoxy resin on the nonwoven fabric for the electric insulation and curing the resin up to a semi-cured state. The method for producing the laminate is characterized by heating and press-forming the layer of the prepreg as the whole or partial layers of a prepreg. The method for producing the printed circuit board is characterized by heating and press-forming the layers of the prepreg to form the insulated layer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决问题的方案：提供一种具有含芳族聚酰胺纤维的电绝缘无纺布作为热固性树脂绝缘层的基材的印刷电路板的制造方法，通过该方法，芳族聚酰胺纤维与热固性树脂的粘合性可以改善树脂。解决方案：该电绝缘用无纺布的制造方法的特征在于，将含有对位芳族聚酰胺纤维作为主纤维的无纺布浸渍在有机溶剂中，并将纤维彼此以热熔纤维结合，溶解热熔纤维的一部分。制备预浸料的方法的特征在于在无纺布上保持环氧树脂进行电绝缘，并将树脂固化至半固化状态。制造层压体的方法的特征在于，将预浸料坯的层作为预浸料坯的整个或部分层进行加热和压制成型。制造印刷电路板的方法的特征在于，加热和压制预浸料的层以形成绝缘层。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2013189541A Crosslinked resin composition 有权
标题翻译：交联树脂组合物
公开(公告)号：JP2013189541A
公开(公告)日：2013-09-26
申请号：JP2012056346
申请日：2012-03-13
申请人： Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社 , Hitachi Chemical Co Ltd , 日立化成株式会社
发明人： MORIKAWA TAKAHIRO , KOBAYASHI NAOKI , MORIO YOICHI , FUKAO TAKESHI , NAGAI AKIRA , TSUDA YOSHIHIRO
IPC分类号： C08L79/02 , C08G73/02 , C08J5/24 , C08L71/02
摘要： PROBLEM TO BE SOLVED: To provide a crosslinked resin composition excellent in heat resistance and wear properties.SOLUTION: A polyether is added to a system in which a bis(2-oxazoline) compound and an aromatic amine. The number-average molecular weight of the polyether is 570 to 9,000. The blend amount of the polyether is 5 to 50 pts.mass with respect to 100 pts.mass of a mixture of the bis(2-oxazoline) compound and the aromatic amine.
摘要翻译：要解决的问题：提供耐热性和耐磨性优异的交联树脂组合物。解决方案：将聚醚加入其中双（2-恶唑啉）化合物和芳族胺的体系中。聚醚的数均分子量为570〜9000。相对于100重量份的双（2-恶唑啉）化合物和芳香族胺的混合物，聚醚的配合量为5〜50质量份。

3. 发明专利

JP2011057831A Crosslinked resin composition 有权
标题翻译：交联树脂组合物
公开(公告)号：JP2011057831A
公开(公告)日：2011-03-24
申请号：JP2009208474
申请日：2009-09-09
申请人： Hitachi Chem Co Ltd , Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社 , 日立化成工業株式会社
发明人： HASHIMOTO YASUYUKI , MORIKAWA TAKAHIRO , KOBAYASHI NAOKI , TSUDA YOSHIHIRO , NAGAI AKIRA
IPC分类号： C08L57/12 , C08G14/073 , C08J5/04 , C08K5/3415
摘要： PROBLEM TO BE SOLVED: To provide a crosslinked resin composition which is improved in workability such as treatability of the melted resin and controllability of the reaction to obtain the resin, and is improved in heat resistance and fatigue property. SOLUTION: The crosslinked resin composition, which is obtained by reacting a bis(2-oxazoline) compound with an aromatic amine, is supplied with only a monomaleimide as a maleimide compound, wherein the bis(2-oxazoline) compound is preferably 2,2'-(1,3-phenylene)bis-2-oxazoline, and the monomaleimide is preferably N-phenylmaleimide. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题的方案：提供提高熔融树脂的处理性和可控制性以获得树脂的可加工性的交联树脂组合物，并提高其耐热性和疲劳性能。解决方案：将双（2-恶唑啉）化合物与芳族胺反应获得的交联树脂组合物仅供给作为马来酰亚胺化合物的单马来酰亚胺，其中双（2-恶唑啉）化合物优选为 2,2' - （1,3-亚苯基）双-2-恶唑啉，单马来酰亚胺优选为N-苯基马来酰亚胺。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2005041914A Resin composition containing rubber component and film and electric part using the same 审中-公开
标题翻译：包含橡胶组分和薄膜的树脂组合物和使用该橡胶组分的电气部件
公开(公告)号：JP2005041914A
公开(公告)日：2005-02-17
申请号：JP2003200182
申请日：2003-07-23
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SUGIMASA MASATOSHI , NAGAI AKIRA , YAMADA SHINJI , AMO SATORU
IPC分类号： B32B15/082 , B32B15/08 , C08F279/02 , C08F283/08 , C08F287/00 , C08L9/06 , C08L25/02 , C08L101/00 , H05K1/03
CPC分类号： C08F283/08 , C08F279/02 , C08F287/00 , H05K1/032 , H05K1/0353 , C08F212/34
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which can form thin films having a low dielectric constant and a low dielectric loss tangent and capable of being cured at low temperature, has excellent flexibility and excellent adhesiveness to conductor foils, and is suitable for the insulating materials of electronic equipment handling high frequency signals, to provide a cured product thereof, to provide a film substrate using the composition, and to provide an electric part using the composition.
SOLUTION: This resin composition having a low dielectric loss tangent comprises a cross-linking component represented by the formula [R is a hydrocarbon skeleton; R
1 groups are each identically or differently H or a 1 to 20C hydrocarbon group; R
2 , R
3 and R
4 are each identically or differently H or a 1 to 6C alkyl; (m) is an integer of 1 to 4; (n) is an integer of ≥2] and having a plurality of styrene groups and a weight-average mol. wt. of ≤1,000, and a rubber component having styrene residues and a weight-average mol. wt. of ≥5,000. The film substrate and the electric part each uses the composition.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够形成低介电常数和低介电损耗角正切并且能够在低温下固化的薄膜的树脂组合物，具有优异的柔性和对导体箔的优异的粘附性，并且是适用于处理高频信号的电子设备的绝缘材料，提供其固化产物，提供使用该组合物的薄膜基材，并提供使用该组合物的电气部件。解决方案：具有低介电损耗角正切的该树脂组合物包含由式[R表示烃骨架; R 1和R 2各自相同或不同，H或1〜20C烃基; R 2 ，R 3 和R 4 各自相同或不同H或1至6C烷基; （m）为1〜4的整数，（n）为≥2的整数，并且具有多个苯乙烯基和重均摩尔。重量。 ≤1,000，和具有苯乙烯残基和重均摩尔的橡胶组分。重量。 ≥5,000。薄膜基板和电气部件各自使用组合物。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004087757A Semiconductor device and its manufacturing method 有权
公开(公告)号：JP2004087757A
公开(公告)日：2004-03-18
申请号：JP2002246287
申请日：2002-08-27
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： YAMADA SATORU , NAGAI AKIRA , OYU SHIZUNORI , NAKAMURA RYOICHI , TAKAURA NORIKATSU
IPC分类号： H01L27/092 , H01L21/28 , H01L21/8238 , H01L21/8242 , H01L27/108 , H01L29/49 , H01L29/78
CPC分类号： H01L27/10891 , H01L21/28061 , H01L21/823842 , H01L27/10894 , H01L27/10897 , H01L29/4941 , H01L29/7833
摘要： PROBLEM TO BE SOLVED: To provide a transistor, special to a DRAM (dynamic random access memory) for simultaneously achieving three points of improvement of the performance of a PMOS (p-channel metal oxide semiconductor) in the circumferential circuit of the DRAM, the reduction of a word line resistance and the mitigation of junction field of a memory cell.
SOLUTION: In the semiconductor device of a gate electrode structure consisting of three levels or more of Fermi level polysilicon, P-type polysilicon having the lowest Fermi level is arranged in a first N-type surface channel MOS (metal-oxide-semiconductor) transistor 13, N-type polysilicon having the highest Fermi level, is arranged in a second N-type surface channel MOS transistor 12 and the N-type polysilicon, having an intermediate Fermi level and produced through doping both of N-type impurities and P-type impurities, is arranged in a P-channel MOS transistor 11 respectively.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2000077536A Manufacture of semiconductor device 审中-公开
标题翻译：半导体器件的制造
公开(公告)号：JP2000077536A
公开(公告)日：2000-03-14
申请号：JP24897698
申请日：1998-09-03
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ASAKURA HISAO , TADAKI YOSHITAKA , SEKIGUCHI TOSHIHIRO , NAGAI AKIRA , MIYAMOTO MASABUMI , NAKAMURA MASAYUKI
IPC分类号： H01L21/8234 , H01L21/336 , H01L21/8238 , H01L21/8242 , H01L21/8246 , H01L27/088 , H01L27/105 , H01L27/108
CPC分类号： H01L27/10894 , H01L21/823857 , H01L27/10852 , H01L27/10873 , Y10S438/981
摘要： PROBLEM TO BE SOLVED: To adjust the threshold voltage of a p-channel type field effect transistor and n-channel type field effect transistor with a relatively thin gate insulating film, without increasing the number of photomasks and the number of formation/removal processes for the photoresist pattern.
SOLUTION: Using a photoresist film 3e, which is a mask for etching/ removing a gate insulating film 7a in a formation region of a relatively thin gate insulating film, an impurity for adjusting the threshold voltage of an n- channel type field effect transistor and p-channel type field effect transistor having a relatively thin gate insulating film, is introduced in batch in a semiconductor substrate 1 exposed there.
COPYRIGHT: (C)2000,JPO
摘要翻译：要解决的问题：通过相对薄的栅极绝缘膜来调节p沟道型场效应晶体管和n沟道型场效应晶体管的阈值电压，而不增加光掩模的数量和形成/去除处理的数量光刻胶图案。解决方案：使用作为蚀刻/去除相对薄的栅极绝缘膜的形成区域中的栅极绝缘膜7a的掩模的光致抗蚀剂膜3e，用于调整n沟道型场效应晶体管的阈值电压的杂质，以及在其中暴露的半导体衬底1中分批引入具有相对薄的栅极绝缘膜的p沟道型场效应晶体管。

7. 发明专利

JP2004087639A Electronic part for high frequency using low dielectric loss tangent insulating material 有权
公开(公告)号：JP2004087639A
公开(公告)日：2004-03-18
申请号：JP2002244520
申请日：2002-08-26
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AMO SATORU , NAGAI AKIRA , YAMADA SHINJI , ISHIKAWA TAKAO , TAKAHASHI AKIO
IPC分类号： C08K3/08 , C08K3/00 , C08K3/32 , C08K5/03 , C08K5/3417 , C08K5/521 , C08K5/5313 , C08K7/22 , C08L101/00 , H01B3/44 , H01L21/312 , H01L21/60 , H01L23/498 , H01L23/66 , H01P3/02 , H03B5/18 , H05K1/00 , H05K1/02 , H05K3/46
CPC分类号： H01L23/49894 , C08K3/01 , H01B3/441 , H01L23/66 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01012 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H03B5/18 , H05K1/024 , H05K3/4676 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide an electric part for high frequencies which uses a low dielectric loss tangent resin composition for a high frequency signal as an insulation layer and which is efficient due to a reduced dielectric loss. SOLUTION: The electric part for high frequencies is prepared by using the insulating layer containing the cross-linked structure of a bridge principle expressed by a general formula (I) (wherein, R expresses a hydrocarbon skeleton, R 1 is the same or different and expresses hydrogen or a hydrocarbon radical of carbon number 1 to 20, R 2 , R 3 and R 4 are the same or different and express a hydrogen atom or a hydrocarbon radical of carbon numbers 1 to 6, (m) is an integer of 1 to 4 and (n) is an integer of ≥2). COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2005060680A Fiber-reinforced composite material, manufacturing method therefor, and wiring base 有权
标题翻译：纤维增强复合材料及其制造方法及布线
公开(公告)号：JP2005060680A
公开(公告)日：2005-03-10
申请号：JP2004218962
申请日：2004-07-27
申请人： Hitachi Ltd , Kyoto Univ , Mitsubishi Chemicals Corp , Nippon Telegr & Teleph Corp , Pioneer Electronic Corp , Rohm Co Ltd , パイオニア株式会社 , ローム株式会社 , 三菱化学株式会社 , 国立大学法人京都大学 , 日本電信電話株式会社 , 株式会社日立製作所
发明人： YANO HIROYUKI , SUGIYAMA JUNJI , ATAGI MASAYA , IWAMOTO SHINICHIRO , KURIHARA TAKASHI , MATSUURA TORU , HANDA KEISHIN , NAGAI AKIRA , MIWA TAKAO , TAKEZAWA YOSHITAKA
IPC分类号： C08J5/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain a fiber-reinforced composite material in which its high transparency can always be maintained without being affected by temperature conditions, wavelength, or the like, and which is imparted with various functionalities through compounding a fiber and a matrix material. SOLUTION: The fiber-reinforced composite material comprises the fiber having an average fiber diameter of 4-200 nm and the matrix material, and has a light transmission of 60% or higher at the wavelength of 400-700 nm in terms of 50 μm thickness. Thereby, refraction of visible light in inside of the fiber is hardly generated because the fiber having an average fiber diameter shorter than the wavelength of visible light (380-800 μm) is used, and the occurrence of loss of visible light caused by the scattering at the interface between the fiber and the matrix material is prevented even when changes in temperature or wavelength occur. Therefore, the high light transmittance of visible light of 60% or higher in terms of 50 μm thickness can be maintained. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得其高透明度总是可以保持而不受温度条件，波长等影响的纤维增强复合材料，并且通过配合纤维和一种基质材料。解决方案：纤维增强复合材料包括平均纤维直径为4-200nm的纤维和基体材料，并且在400-700nm的波长下具有60％或更高的透光率厚度为50μm。因此，由于使用平均纤维直径比可见光的波长短（380-800μm）的纤维，并且由散射引起的可见光的损失的发生，难以产生在纤维内侧的可见光的折射即使发生温度或波长的变化，也可防止纤维与基质材料之间的界面。因此，可以保持厚度为50μm的可见光的高透光率为60％以上。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2005056935A Organic/inorganic oxide mixture thin film, electronic substrate with built-in passive element using the same, and method for manufacturing organic/inorganic oxide mixture thin film 有权
标题翻译：有机/无机氧化物混合薄膜，具有内置被动元件的电子基板及其制造有机/无机氧化物混合薄膜的方法
公开(公告)号：JP2005056935A
公开(公告)日：2005-03-03
申请号：JP2003206488
申请日：2003-08-07
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAGAI AKIRA , ONO TOSHIYUKI , HOJO FUSAO , YAMADA SHINJI , KONNO MIKIO , TANASE TOMOKAZU , NAGAO DAISUKE
IPC分类号： C01G23/00 , C01G23/053 , C08K7/18 , C08L101/00 , H01B3/00 , H01G4/20 , H01G4/33 , H01L35/24 , H05K1/16 , H05K3/46
CPC分类号： H05K1/162 , H01G4/206 , H05K3/4611 , H05K2201/0209 , H05K2201/0257 , H05K2201/0355 , H05K2201/09309
摘要： PROBLEM TO BE SOLVED: To obtain organic/inorganic oxide mixture whose electrostatic capacity density is high in order to obtain capacitor material to be included in a substrate. SOLUTION: A mixture thin film wherein inorganic oxide particles whose mean particle diameter is at most 90 nm are distributed in organic polymer, permittivity is at least 10 and thickness is at most 900 nm, the substrate which includes the thin film, and a method for manufacturing the thin film are provided. As a result, a complex thin film of inorganic oxide/organic polymer is obtained which is very thin and has very high electrostatic capacity density and superior property. COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2005042117A Laminated board and multilayer printed circuit board 有权
标题翻译：层压板和多层印刷电路板
公开(公告)号：JP2005042117A
公开(公告)日：2005-02-17
申请号：JP2004255049
申请日：2004-09-02
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAGAI AKIRA , OGATA MASAJI
IPC分类号： C08J5/24 , B32B15/08 , H05K3/38 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide laminated boards, multilayer printed circuit boards, prepregs and electronic products using those, which have small in-plane thermal expansion coefficient and low elasticity thermal stress. SOLUTION: The laminated board can carry semiconductor elements and has a resin part having a sea island structure and an insulating layer composed of a fabric-reinforcing material, wherein in-plane thermal expansion coefficient of the insulating layer is 3.0-10 ppm/K and glass-transition temperature of the insulating layer is 150-300°C. Thereby, the in-plane thermal expansion coefficient and the elastic modulus of the laminated board, multilayer printed circuit board and prepreg are much decreased and, thereby, thermal stress of the mounted surface is largely decreased. And the reliability upon the connection to mounted element such as an LSI can be notably enhanced. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有小面内热膨胀系数和低弹性热应力的层压板，多层印刷电路板，预浸料和电子产品。解决方案：层压板可以承载半导体元件，并且具有海岛结构的树脂部分和由织物增强材料组成的绝缘层，其中绝缘层的面内热膨胀系数为3.0-10ppm / K，绝缘层的玻璃化转变温度为150〜300℃。由此，层叠基板，多层印刷电路板和预浸料坯的面内热膨胀系数和弹性模量大大降低，从而大大降低了安装面的热应力。并且可以显着提高与诸如LSI的安装元件的连接的可靠性。版权所有（C）2005，JPO＆NCIPI

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