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1. 发明专利

JP2011091066A Low dielectric loss wiring board, multilayer wiring board, and copper foil and laminate used for the same 有权
标题翻译：低介电损耗布线板，多层布线板，铜箔及其相关的层压板
公开(公告)号：JP2011091066A
公开(公告)日：2011-05-06
申请号：JP2009240975
申请日：2009-10-20
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AMO SATORU , KAGIWADA HIKARI , HORI DAI
IPC分类号： H05K3/46 , H05K1/09 , H05K3/38
CPC分类号： H05K3/389 , H05K3/384 , H05K3/385 , H05K3/4611 , H05K2201/0355 , H05K2203/0315 , Y10T428/12438 , Y10T428/12444 , Y10T428/12472
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board which has low dielectric loss and low conductor loss and has high adhesive strength between copper wiring and an insulating layer and has a chemically stable adhesion interface, and to provide a copper foil, a laminate and a wiring board used for the multilayer wiring board. SOLUTION: Copper wiring or copper foil and an insulating layer composed of a low-dielectric-loss material is joined via an adhesion interface having a multilayer structure which includes: a metal layer (A) containing at least one kind of metal component selected from among tin, nickel, chromium, zinc, cobalt and aluminum; a layer of oxide and/or a layer of hydroxide (B) of the metal component of the metal layer on the metal layer (A); an amine-based silane coupling agent layer (C) on the layer (B); and a vinyl-based silane coupling agent layer (D) on the layer (C). COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有低介电损耗和低导体损耗并且在铜布线和绝缘层之间具有高粘合强度并具有化学稳定的粘合界面的多层布线板，并且提供铜箔，用于多层布线板的层压板和布线板。解决方案：铜布线或铜箔和由低介电损耗材料构成的绝缘层通过具有多层结构的粘合界面接合，该粘合界面包括：含有至少一种金属组分的金属层（A）选自锡，镍，铬，锌，钴和铝; 在金属层（A）上的金属层的金属成分的氧化物层和/或氢氧化物层（B）的层; 层（B）上的胺基硅烷偶联剂层（C）; 和层（C）上的乙烯基类硅烷偶联剂层（D）。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2010144109A Thermosetting resin composition 有权
标题翻译：热固性树脂组合物
公开(公告)号：JP2010144109A
公开(公告)日：2010-07-01
申请号：JP2008324895
申请日：2008-12-22
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MURAKI TAKAHITO , MOROOKA HISASHI , KAGAWA HIROYUKI , AMO SATORU
IPC分类号： C08F283/01 , H01B3/42 , H01F27/32
CPC分类号： C08F290/06 , C08F283/01 , C08F290/061 , C08F290/14 , C08F290/141
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for electric insulation having both curability at low temperature in a short time and thermal resistance. SOLUTION: This thermosetting resin composition comprises (A) a polymeric component having at least two polymerizable substituents, (B) a compound having at least one polymerizable substituent, and (C) a living polymerization agent [or (C) the living polymerization agent and (D) an organic peroxide and/or organic azo compound] for curing the composition. A boron compound is preferable as the component (C), and an organic peroxide is preferable as the component (D). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种在短时间内具有低温固化性和耐热性的电绝缘性的热固性树脂组合物。解决方案：该热固性树脂组合物包含（A）具有至少两个可聚合取代基的聚合物组分，（B）具有至少一个可聚合取代基的化合物，和（C）活性聚合剂[或（C）聚合剂和（D）有机过氧化物和/或有机偶氮化合物]。作为（C）成分，优选硼化合物，作为成分（D）优选有机过氧化物。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2004087639A Electronic part for high frequency using low dielectric loss tangent insulating material 有权
公开(公告)号：JP2004087639A
公开(公告)日：2004-03-18
申请号：JP2002244520
申请日：2002-08-26
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AMO SATORU , NAGAI AKIRA , YAMADA SHINJI , ISHIKAWA TAKAO , TAKAHASHI AKIO
IPC分类号： C08K3/08 , C08K3/00 , C08K3/32 , C08K5/03 , C08K5/3417 , C08K5/521 , C08K5/5313 , C08K7/22 , C08L101/00 , H01B3/44 , H01L21/312 , H01L21/60 , H01L23/498 , H01L23/66 , H01P3/02 , H03B5/18 , H05K1/00 , H05K1/02 , H05K3/46
CPC分类号： H01L23/49894 , C08K3/01 , H01B3/441 , H01L23/66 , H01L24/45 , H01L24/48 , H01L2224/16 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01012 , H01L2924/01046 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H03B5/18 , H05K1/024 , H05K3/4676 , H01L2924/00015 , H01L2224/05599 , H01L2924/00 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide an electric part for high frequencies which uses a low dielectric loss tangent resin composition for a high frequency signal as an insulation layer and which is efficient due to a reduced dielectric loss. SOLUTION: The electric part for high frequencies is prepared by using the insulating layer containing the cross-linked structure of a bridge principle expressed by a general formula (I) (wherein, R expresses a hydrocarbon skeleton, R 1 is the same or different and expresses hydrogen or a hydrocarbon radical of carbon number 1 to 20, R 2 , R 3 and R 4 are the same or different and express a hydrogen atom or a hydrocarbon radical of carbon numbers 1 to 6, (m) is an integer of 1 to 4 and (n) is an integer of ≥2). COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2005150535A Electronic component 审中-公开
标题翻译：电子元件
公开(公告)号：JP2005150535A
公开(公告)日：2005-06-09
申请号：JP2003388222
申请日：2003-11-18
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： OGINO MASAHIKO , SATO TOSHIYA , HOJO BOURO , MOTOWAKI NARIHISA , AMO SATORU
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide an electronic component without the missing or failure of plating wiring by surely forming a power feeding film for electric plating even when wiring patterns are densely arranged with the large number of layers. SOLUTION: This electronic component with the structure of lamination is configured of a substrate 1, wiring layers, insulating layers 9, 12, 15 and 18 and external connecting terminals, wherein the wiring layers and the insulating layers are alternately formed on the substrate 1, and only a portion of the insulating layer terminals 9, 12, 15 and 18 is formed with at least one inclined structure for electric plating power supply. The number of the wiring layers and the insulating layers is piled up, and even when the ends of the insulating layers are shaped so as to be steep, a power supply line can be secured. As a result, even when the number of lamination is increased, the wiring layers can be surely formed, and the electronic component without wiring missing can be provided. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使当布线图案以大量层压密布置时，通过确保形成用于电镀的供电膜来提供电子部件而不会出现电镀布线的缺失或故障。解决方案：具有层叠结构的电子部件由基板1，布线层，绝缘层9,12,15和18以及外部连接端子构成，其中布线层和绝缘层交替地形成在基板1，并且只有一部分绝缘层端子9,12,15和18形成有用于电镀电源的至少一个倾斜结构。堆叠布线层和绝缘层的数量，即使当绝缘层的端部成形为陡峭时，也可以确保电源线。结果，即使当层叠数量增加时，可以可靠地形成布线层，并且可以提供没有布线的电子部件。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004087638A Heat-resistant porous resin multilayer substrate 有权
公开(公告)号：JP2004087638A
公开(公告)日：2004-03-18
申请号：JP2002244518
申请日：2002-08-26
申请人： Hitachi Ltd , Nitto Denko Corp , 日東電工株式会社 , 株式会社日立製作所
发明人： ISHIKAWA TAKAO , AMO SATORU , YAMADA SHINJI , KANEMOTO MASARU , NAGAI AKIRA , KAWASHIMA TOSHIYUKI , TAWARA SHINJI
IPC分类号： B32B15/08 , C09J7/02 , C09J201/00 , H05K1/03 , H05K1/11 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a heat-resistant porous resin multilayer substrate of a small dielectric loss tangent, high strength, and a small thermal expansion. SOLUTION: The heat-resistant porous resin multilayer substrate comprises an adhesive, a heat-resistant porous resin film laminated via the adhesive, and a conductive layer formed on both surfaces or either one surface of the heat-resistant porous resin film. The adhesive is a low dielectric loss tangent resin composition which contains a bridge principle of ≤100 weight average molecular weight having a plurality of styrene groups shown by a general formula (wherein, R is a hydrocarbon skeleton, R 1 is the same or equal and is a hydrogen atom or hydrocarbon radical of 1 to 20 carbon numbers, R 2 , R 3 and R 4 can be the same or different and are hydrogen atoms or alkyl radical of 1 to 6 carbon numbers, (m) is an integer of 1 to 4, and (n) is an integer of ≥2), and which contains a high molecular weight body. COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2004083681A Composite film between resin composition having low dielectric dissipation factor and liquid-crystal polymer and flexible circuit board using the same 审中-公开
标题翻译：具有低介电耗散因子和液晶聚合物的树脂组合物和使用其的柔性电路板之间的复合膜
公开(公告)号：JP2004083681A
公开(公告)日：2004-03-18
申请号：JP2002244517
申请日：2002-08-26
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： SUGIMASA MASATOSHI , NAGAI AKIRA , YAMADA SHINJI , AMO SATORU , ITO YUZO , ANDO YOSHIYUKI
IPC分类号： C08J5/18 , B32B27/26 , C08J5/04 , C08K5/01 , C08L101/00 , C08L101/12 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a composite film having a low dielectric constant and a low dielectric dissipation factor and exhibiting excellent heat resistance, flexibility and thermal expansion properties after curing and to provide a flexible circuit board comprising the composite film as an insulating layer. SOLUTION: The resin composition having a low dielectric dissipation factor contains a crosslinking component containing a plurality of styrene groups represented by formula (R is a hydrocarbon skeleton; R 1 s are mutually the same or different and are each hydrogen atom or a 1-20C hydrocarbon group; R 2 , R 3 and R 4 are mutually the same or different and are each hydrogen atom or a 1-6C alkyl group; m is an integer of 1-4; n is an integer of ≥2) and having a ≤1,000 weight-average molecular weight and a polymeric substance having a ≥5,000 weight-average molecular weight. The composite film contains the resin composition having a low dielectric dissipation factor and a liquid-crystal polymer. The flexible circuit board comprises the cured material of the laminate film as an insulating layer. COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：为了获得具有低介电常数和低介电损耗因数的复合膜，并且在固化后具有优异的耐热性，柔软性和热膨胀性，并且提供一种柔性电路板，其包括复合膜作为绝缘层。解决方案：具有低介电损耗因子的树脂组合物含有含有多个由式表示的苯乙烯基团的交联组分（R是烃骨架; R 1相同或不同）并且各自为氢原子或1-20C的烃基; R 2，R 3，R 3，R 4和R 4相互相同或不同，为每个氢原子或1-6C烷基; m是1-4的整数; n是≥2的整数），并且具有≤1000的重均分子量和具有≥5000重均分子量的聚合物质重量。该复合膜包含具有低介电损耗因数的树脂组合物和液晶聚合物。柔性电路板包括层压膜的固化材料作为绝缘层。版权所有（C）2004，JPO

7. 发明专利

JP2003012710A Resin composition having low dielectric loss tangent, cured product of the same, prepreg using the same composition, laminated plate and multilayered printed board 有权
标题翻译：具有低介电损耗的树脂组合物，其固化产物，使用相同的组合物，层压板和多层印刷板
公开(公告)号：JP2003012710A
公开(公告)日：2003-01-15
申请号：JP2001201227
申请日：2001-07-02
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： AMO SATORU , YAMADA SHINJI , ISHIKAWA TAKAO , MIWA TAKAO
IPC分类号： C08J5/24 , C08F2/44 , C08F291/00 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To obtain a resin composition having a low dielectric constant and a low dielectric loss tangent, which is nonvolatile, is excellent in solubility and compatibility with various resins and contains a crosslinking agent, expresses good heat resistance and flexibility after curing the same, and provide a cured product of the same, a prepreg, a laminated plate and a multilayered printed board using the same.
SOLUTION: The resin composition comprises a crosslinking ingredient having several styrene groups expressed by the formula (wherein R expresses a hydrocarbon skeleton; R
1 s are the same or mutually different and express each H or a 1-20C hydrocarbon group; R
2 , R
3 and R
4 are the same or different and express each H or a 1-6C alkyl; (m) is 1-4 integer; (n) is ≥2 integer) and having ≤1000 weight average molecular weight and a polymer. The resin composition gives the cured product having ≥170°C glass transition temperature by curing the same at 180°C for 100 minutes or having ≥500 MPa elastic modulus at 170°C. The cured product of the same, the prepreg, the laminated plate and the multilayered printed board using the resin composition are also provided.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题为了获得不挥发性的低介电常数和低介电损耗角正切的树脂组合物，其溶解性和与各种树脂的相容性优异并含有交联剂，在固化后表现出良好的耐热性和柔软性提供其固化产物，预浸料，层压板和使用其的多层印刷板。解决方案：树脂组合物包含具有由下式表示的若干苯乙烯基团的交联成分（其中R表示烃骨架; R 1相同或相互不同，表示每个H或1-20C烃基; R 3和R 4相同或不同，表示每个H或1-6C烷基;（m）为1-4整数;（n）=> 2整数），并且具有<= 1000重均分子量和聚合物。树脂组合物通过在180℃下固化100分钟或在170℃下具有> = 500MPa的弹性模量，使具有> = 170℃玻璃化转变温度的固化产物。还提供了其固化产物，预浸料，层压板和使用树脂组合物的多层印刷板。

8. 发明专利

JP2005041966A Composite material composition with high dielectric constant and low dielectric dissipation factor, curable film, cured product and method for producing the cured product 有权
标题翻译：具有高介电常数和低介电耗散因子，可固化膜，固化产品和生产固化产品的方法的复合材料组合物
公开(公告)号：JP2005041966A
公开(公告)日：2005-02-17
申请号：JP2003202162
申请日：2003-07-28
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SATSUU YUUICHI , AMO SATORU , TAKAHASHI AKIO , WATABE NORIYUKI , UNNO MORIMICHI , FUJIEDA TADASHI , AKABOSHI HARUO , NAGAI AKIRA
IPC分类号： C08J5/18 , C08F291/00 , C08K3/00 , C08K5/01 , C08L101/00 , H01B3/00 , H01B3/44 , H01L23/14
摘要： PROBLEM TO BE SOLVED: To provide a composite material composition of high dielectric constant and low dielectric dissipation factor, good in processability having a dielectric constant of ≥15 and a dielectric dissipation factor of ≤0.05 in the frequency range from 100 MHz to 80 GHz, to provide a curable film, to provide a cured product, and to provide a method for producing the cured product.
SOLUTION: The composite material composition of high dielectric constant and low dielectric dissipation factor comprises a crosslinkable component having a plurality of styrene groups with a weight-average molecular weight of ≤1,000 represented by the general formula[1][ wherein, R is a (substituted) hydrocarbon skeleton; R
1 is H, methyl or ethyl; m is an integer of 1-4; and n is an integer of ≥2 ] and an a resin containing at least one polymer with a weight-average molecular weight of ≥5,000, wherein the resin is dispersed with inorganic fillers essentially comprising metallic powder with the mean particle size for the respective filler components being ≤5μm.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供高介电常数和低介电损耗因子的复合材料组合物，在100MHz至10MHz的频率范围内具有介电常数≥15且介电损耗因子≤0.05的加工性良好 80GHz，以提供可固化膜，以提供固化产物，并提供固化产物的制备方法。解决方案：高介电常数和低介电损耗因子的复合材料组合物包含具有由通式[1]表示的重均分子量≤1,000的多个苯乙烯基团的可交联组分[其中，R 是（取代的）烃骨架; R 1是H，甲基或乙基; m为1-4的整数; n为≥2的整数]，以及含有至少一种重均分子量≥5,000的聚合物的树脂，其中树脂以基本上包含金属粉末的无机填料分散，其平均粒径为相应填料组件≤5μm。版权所有（C）2005，JPO＆NCIPI

9. 发明专利

JP2004277205A Tube laminated body and its manufacturing method 有权
公开(公告)号：JP2004277205A
公开(公告)日：2004-10-07
申请号：JP2003069071
申请日：2003-03-14
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： ISHIKAWA TAKAO , YAMADA SHINJI , AMO SATORU , HIDAKA KISHIFU
IPC分类号： B82B1/00 , B01J23/745 , B01J23/75 , B01J23/76 , B01J23/89 , B32B3/20 , B32B15/20 , B32B18/00 , B82B3/00 , B82Y10/00 , B82Y30/00 , B82Y40/00 , C01B13/18 , C01B31/02 , C01F7/02 , C01G9/02 , C01G19/02 , C01G23/00 , C03C17/00 , C04B35/524 , C09D7/12 , C09D201/00 , H01M4/02 , H01M8/02
CPC分类号： C04B35/63 , B32B3/20 , B32B15/20 , B82Y30/00 , C03C17/003 , C04B35/524 , C04B35/6264 , C04B2235/3217 , C04B2235/3227 , C04B2235/3232 , C04B2235/3272 , C04B2235/3275 , C04B2235/3281 , C04B2235/3284 , C04B2235/3289 , C04B2235/3293 , C04B2235/3418 , C04B2235/48 , C04B2235/526 , C04B2235/5264 , C04B2235/5284 , C04B2235/5288 , H01M4/02 , H01M4/8882 , H01M8/0236 , H01M8/0241 , H01M8/1213 , H01M14/005 , Y02P70/56 , Y10T428/131
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a tube material wherein the tube material can be manufactured in a large amount with little effort and can be easily thinned or laminated. SOLUTION: The ceramic tube is easily manufactured at a low cost via coating, drying, thermolysis steps, etc. by using a coating liquid wherein a catalytic metal is hybridized with organic matter. The ceramic tube contains a Cu compound and a catalyst comprising at least one selected from the group consisting of Fe, Co, Pt, Ru, Pd and La in a ceramic containing at least one selected from C, Ti, Zn, Sn, Al and a rare-earth element. COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2003342309A Resin composition containing red phosphorus particle and prepreg, laminate and multilayer printed circuit board using the composition 有权
标题翻译：含有红色磷颗粒的树脂组合物和使用组合物的PREPREG，层压板和多层印刷电路板
公开(公告)号：JP2003342309A
公开(公告)日：2003-12-03
申请号：JP2002154160
申请日：2002-05-28
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： AMO SATORU , YAMADA SHINJI , ISHIKAWA TAKAO , TAKAHASHI AKIO , NAKAMURA YOSHIHIRO , HANAWA AKINORI , IIJIMA TOSHIYUKI
IPC分类号： C08J5/24 , B32B15/08 , C08F2/44 , C08F12/34 , C08F291/00 , C08K3/02 , C08K5/3492 , C08L101/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition that gives a flame-resistant cured article having a low dielectric constant and tangent and a prepreg, a laminate and a multilayer printed circuit board using the composition. SOLUTION: The resin composition contains red phosphorous particles and a crosslinking component having a weight average molecular weight of ≤1,000 and a multifunctional stylene group represented by formula (1) (wherein R is a hydrocarbon structure optionally having a substituent; R 2 , R 3 , and R 4 are each independently a hydrogen atom or a 1-6C hydrocarbon group each of which may be different; R 5 , R 6 , R 7 , and R 8 are each a hydrogen atom or a 1-20C hydrocarbon group; n is an integer of ≥2). The composition is used for the prepreg, the laminated, and the multilayer printed circuit board. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种树脂组合物，其提供具有低介电常数和切线的耐火固化物和预浸料，层压体和使用该组合物的多层印刷电路板。解决方案：树脂组合物含有红色磷颗粒和重均分子量≤1,000的交联组分和由式（1）表示的多官能苯基（其中R是任选具有取代基的烃结构; R < SP> 2 ，R 3 和R 4 各自独立地为氢原子或1-6C烃基，其各自可以不同; SP> 5 ，R 6 ，R 7 和R 8 分别为氢原子或1-20C烃基 ; n为≥2的整数）。该组合物用于预浸料，层压和多层印刷电路板。版权所有（C）2004，JPO

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